JPS61232608A - 半導体素子の製造方法 - Google Patents
半導体素子の製造方法Info
- Publication number
- JPS61232608A JPS61232608A JP7497685A JP7497685A JPS61232608A JP S61232608 A JPS61232608 A JP S61232608A JP 7497685 A JP7497685 A JP 7497685A JP 7497685 A JP7497685 A JP 7497685A JP S61232608 A JPS61232608 A JP S61232608A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- growth
- chamber
- gaas substrate
- gaas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 238000007872 degassing Methods 0.000 claims abstract 2
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000013078 crystal Substances 0.000 abstract description 8
- 229910052733 gallium Inorganic materials 0.000 abstract description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 229910052738 indium Inorganic materials 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 229910000673 Indium arsenide Inorganic materials 0.000 description 5
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000002128 reflection high energy electron diffraction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
- H01L21/02661—In-situ cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7497685A JPS61232608A (ja) | 1985-04-08 | 1985-04-08 | 半導体素子の製造方法 |
US06/843,146 US4824518A (en) | 1985-03-29 | 1986-03-24 | Method for the production of semiconductor devices |
GB08607458A GB2174542B (en) | 1985-03-29 | 1986-03-26 | A method and apparatus for the production of semiconductor devices |
FR868604353A FR2579824B1 (fr) | 1985-03-29 | 1986-03-26 | Procede et appareil pour la fabrication de dispositifs semi-conducteurs, utilisant un traitement epitaxial par faisceau moleculaire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7497685A JPS61232608A (ja) | 1985-04-08 | 1985-04-08 | 半導体素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61232608A true JPS61232608A (ja) | 1986-10-16 |
JPH035051B2 JPH035051B2 (enrdf_load_stackoverflow) | 1991-01-24 |
Family
ID=13562825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7497685A Granted JPS61232608A (ja) | 1985-03-29 | 1985-04-08 | 半導体素子の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61232608A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61289621A (ja) * | 1985-06-18 | 1986-12-19 | Kokusai Denshin Denwa Co Ltd <Kdd> | 分子線エピタキシヤル成長方法 |
JPS6273705A (ja) * | 1985-09-27 | 1987-04-04 | Anelva Corp | 分子線エピタキシヤル成長層形成における清浄基板面の保護膜作成方法およびその装置 |
JP2009182315A (ja) * | 2008-02-01 | 2009-08-13 | Nippon Mining & Metals Co Ltd | 半導体基板の表面処理方法、半導体基板、及び薄膜形成方法 |
-
1985
- 1985-04-08 JP JP7497685A patent/JPS61232608A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61289621A (ja) * | 1985-06-18 | 1986-12-19 | Kokusai Denshin Denwa Co Ltd <Kdd> | 分子線エピタキシヤル成長方法 |
JPS6273705A (ja) * | 1985-09-27 | 1987-04-04 | Anelva Corp | 分子線エピタキシヤル成長層形成における清浄基板面の保護膜作成方法およびその装置 |
JP2009182315A (ja) * | 2008-02-01 | 2009-08-13 | Nippon Mining & Metals Co Ltd | 半導体基板の表面処理方法、半導体基板、及び薄膜形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH035051B2 (enrdf_load_stackoverflow) | 1991-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |