JPS61232061A - 物品の融着接合装置 - Google Patents
物品の融着接合装置Info
- Publication number
- JPS61232061A JPS61232061A JP7347785A JP7347785A JPS61232061A JP S61232061 A JPS61232061 A JP S61232061A JP 7347785 A JP7347785 A JP 7347785A JP 7347785 A JP7347785 A JP 7347785A JP S61232061 A JPS61232061 A JP S61232061A
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- article
- transfer liquid
- vapor
- steam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 claims abstract description 70
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- 239000007767 bonding agent Substances 0.000 claims description 16
- 238000010992 reflux Methods 0.000 claims description 10
- 238000009835 boiling Methods 0.000 claims description 7
- 230000004927 fusion Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000007096 poisonous effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- -1 polyoxypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7347785A JPS61232061A (ja) | 1985-04-09 | 1985-04-09 | 物品の融着接合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7347785A JPS61232061A (ja) | 1985-04-09 | 1985-04-09 | 物品の融着接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61232061A true JPS61232061A (ja) | 1986-10-16 |
| JPH0354027B2 JPH0354027B2 (enExample) | 1991-08-16 |
Family
ID=13519395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7347785A Granted JPS61232061A (ja) | 1985-04-09 | 1985-04-09 | 物品の融着接合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61232061A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234666A (ja) * | 1985-08-06 | 1987-02-14 | Denkoo:Kk | 気相式ハンダリフロ−装置 |
| JPS63248569A (ja) * | 1987-04-03 | 1988-10-14 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置におけるワ−ク急冷装置 |
| JPS63248568A (ja) * | 1987-04-03 | 1988-10-14 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置における蒸気凝縮装置 |
| JPH0237962A (ja) * | 1988-07-27 | 1990-02-07 | Hitachi Techno Eng Co Ltd | ベーパーリフロー式はんだ付け装置 |
| JPH04237558A (ja) * | 1991-01-16 | 1992-08-26 | Hitachi Ltd | ベーパーはんだ付装置 |
| US20220238478A1 (en) * | 2021-01-25 | 2022-07-28 | Infineon Technologies Ag | Arrangement for forming a connection |
-
1985
- 1985-04-09 JP JP7347785A patent/JPS61232061A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234666A (ja) * | 1985-08-06 | 1987-02-14 | Denkoo:Kk | 気相式ハンダリフロ−装置 |
| JPS63248569A (ja) * | 1987-04-03 | 1988-10-14 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置におけるワ−ク急冷装置 |
| JPS63248568A (ja) * | 1987-04-03 | 1988-10-14 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置における蒸気凝縮装置 |
| JPH0237962A (ja) * | 1988-07-27 | 1990-02-07 | Hitachi Techno Eng Co Ltd | ベーパーリフロー式はんだ付け装置 |
| JPH04237558A (ja) * | 1991-01-16 | 1992-08-26 | Hitachi Ltd | ベーパーはんだ付装置 |
| US20220238478A1 (en) * | 2021-01-25 | 2022-07-28 | Infineon Technologies Ag | Arrangement for forming a connection |
| US12272669B2 (en) * | 2021-01-25 | 2025-04-08 | Infineon Technologies Ag | Arrangement for forming a connection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354027B2 (enExample) | 1991-08-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |