JPS61231131A - 耐食性銅合金管 - Google Patents
耐食性銅合金管Info
- Publication number
- JPS61231131A JPS61231131A JP7291885A JP7291885A JPS61231131A JP S61231131 A JPS61231131 A JP S61231131A JP 7291885 A JP7291885 A JP 7291885A JP 7291885 A JP7291885 A JP 7291885A JP S61231131 A JPS61231131 A JP S61231131A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- corrosion resistance
- film
- silicate
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Rigid Pipes And Flexible Pipes (AREA)
- Fuel-Injection Apparatus (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7291885A JPS61231131A (ja) | 1985-04-05 | 1985-04-05 | 耐食性銅合金管 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7291885A JPS61231131A (ja) | 1985-04-05 | 1985-04-05 | 耐食性銅合金管 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61231131A true JPS61231131A (ja) | 1986-10-15 |
| JPH0517292B2 JPH0517292B2 (cg-RX-API-DMAC7.html) | 1993-03-08 |
Family
ID=13503211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7291885A Granted JPS61231131A (ja) | 1985-04-05 | 1985-04-05 | 耐食性銅合金管 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61231131A (cg-RX-API-DMAC7.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004046415A1 (ja) * | 2002-11-21 | 2004-06-03 | Nikko Materials Co., Ltd. | 銅合金スパッタリングターゲット及び半導体素子配線 |
| US7740721B2 (en) | 2003-03-17 | 2010-06-22 | Nippon Mining & Metals Co., Ltd | Copper alloy sputtering target process for producing the same and semiconductor element wiring |
| JP2013185221A (ja) * | 2012-03-08 | 2013-09-19 | Jx Nippon Mining & Metals Corp | 電気電子機器用Cu−Zn−Sn−Ca合金 |
| US9896745B2 (en) | 2002-01-30 | 2018-02-20 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and method for manufacturing the target |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5078519A (cg-RX-API-DMAC7.html) * | 1973-11-14 | 1975-06-26 | ||
| JPS534718A (en) * | 1976-07-05 | 1978-01-17 | Mitsubishi Metal Corp | Anticorrosive copper alloy having superior hot workability |
| JPS59222542A (ja) * | 1983-05-31 | 1984-12-14 | Hitachi Cable Ltd | ラジエ−タ用フィン材 |
| JPS59226142A (ja) * | 1983-06-06 | 1984-12-19 | Nippon Mining Co Ltd | 耐食性に優れた銅合金 |
| JPS59229450A (ja) * | 1983-06-10 | 1984-12-22 | Nippon Mining Co Ltd | 耐食性に優れた銅合金 |
-
1985
- 1985-04-05 JP JP7291885A patent/JPS61231131A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5078519A (cg-RX-API-DMAC7.html) * | 1973-11-14 | 1975-06-26 | ||
| JPS534718A (en) * | 1976-07-05 | 1978-01-17 | Mitsubishi Metal Corp | Anticorrosive copper alloy having superior hot workability |
| JPS59222542A (ja) * | 1983-05-31 | 1984-12-14 | Hitachi Cable Ltd | ラジエ−タ用フィン材 |
| JPS59222541A (ja) * | 1983-05-31 | 1984-12-14 | Hitachi Cable Ltd | 自動車用ラジエ−タフィン材 |
| JPS59226142A (ja) * | 1983-06-06 | 1984-12-19 | Nippon Mining Co Ltd | 耐食性に優れた銅合金 |
| JPS59229450A (ja) * | 1983-06-10 | 1984-12-22 | Nippon Mining Co Ltd | 耐食性に優れた銅合金 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9896745B2 (en) | 2002-01-30 | 2018-02-20 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and method for manufacturing the target |
| WO2004046415A1 (ja) * | 2002-11-21 | 2004-06-03 | Nikko Materials Co., Ltd. | 銅合金スパッタリングターゲット及び半導体素子配線 |
| US7507304B2 (en) | 2002-11-21 | 2009-03-24 | Nippon Mining & Metals Co., Ltd. | Copper alloy sputtering target and semiconductor element wiring |
| US8246764B2 (en) | 2002-11-21 | 2012-08-21 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and semiconductor element wiring |
| US10665462B2 (en) | 2002-11-21 | 2020-05-26 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target and semiconductor element wiring |
| US7740721B2 (en) | 2003-03-17 | 2010-06-22 | Nippon Mining & Metals Co., Ltd | Copper alloy sputtering target process for producing the same and semiconductor element wiring |
| US9765425B2 (en) | 2003-03-17 | 2017-09-19 | Jx Nippon Mining & Metals Corporation | Copper alloy sputtering target, process for producing the same and semiconductor element wiring |
| JP2013185221A (ja) * | 2012-03-08 | 2013-09-19 | Jx Nippon Mining & Metals Corp | 電気電子機器用Cu−Zn−Sn−Ca合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517292B2 (cg-RX-API-DMAC7.html) | 1993-03-08 |
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