JPS6122864B2 - - Google Patents

Info

Publication number
JPS6122864B2
JPS6122864B2 JP55004361A JP436180A JPS6122864B2 JP S6122864 B2 JPS6122864 B2 JP S6122864B2 JP 55004361 A JP55004361 A JP 55004361A JP 436180 A JP436180 A JP 436180A JP S6122864 B2 JPS6122864 B2 JP S6122864B2
Authority
JP
Japan
Prior art keywords
base
integrated circuit
gold
welding
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55004361A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56101761A (en
Inventor
Tetsushi Ishida
Seizo Akasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP436180A priority Critical patent/JPS56101761A/ja
Publication of JPS56101761A publication Critical patent/JPS56101761A/ja
Publication of JPS6122864B2 publication Critical patent/JPS6122864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Casings For Electric Apparatus (AREA)
JP436180A 1980-01-18 1980-01-18 Airtight package for integrated circuit Granted JPS56101761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP436180A JPS56101761A (en) 1980-01-18 1980-01-18 Airtight package for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP436180A JPS56101761A (en) 1980-01-18 1980-01-18 Airtight package for integrated circuit

Publications (2)

Publication Number Publication Date
JPS56101761A JPS56101761A (en) 1981-08-14
JPS6122864B2 true JPS6122864B2 (fr) 1986-06-03

Family

ID=11582231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP436180A Granted JPS56101761A (en) 1980-01-18 1980-01-18 Airtight package for integrated circuit

Country Status (1)

Country Link
JP (1) JPS56101761A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989003123A1 (fr) * 1987-09-25 1989-04-06 Aegis, Inc. Boitier de microcircuit avec broches resistantes a la corrosion, et procede de fabrication
JPH079953B2 (ja) * 1988-04-13 1995-02-01 株式会社東芝 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS56101761A (en) 1981-08-14

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