JPS61226936A - ワイヤボンデイング方法および装置 - Google Patents

ワイヤボンデイング方法および装置

Info

Publication number
JPS61226936A
JPS61226936A JP60067606A JP6760685A JPS61226936A JP S61226936 A JPS61226936 A JP S61226936A JP 60067606 A JP60067606 A JP 60067606A JP 6760685 A JP6760685 A JP 6760685A JP S61226936 A JPS61226936 A JP S61226936A
Authority
JP
Japan
Prior art keywords
bonding
drive
wire
driving
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60067606A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0438136B2 (enExample
Inventor
Hiroaki Kobayashi
弘明 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60067606A priority Critical patent/JPS61226936A/ja
Publication of JPS61226936A publication Critical patent/JPS61226936A/ja
Publication of JPH0438136B2 publication Critical patent/JPH0438136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning

Landscapes

  • Wire Bonding (AREA)
JP60067606A 1985-03-30 1985-03-30 ワイヤボンデイング方法および装置 Granted JPS61226936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60067606A JPS61226936A (ja) 1985-03-30 1985-03-30 ワイヤボンデイング方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60067606A JPS61226936A (ja) 1985-03-30 1985-03-30 ワイヤボンデイング方法および装置

Publications (2)

Publication Number Publication Date
JPS61226936A true JPS61226936A (ja) 1986-10-08
JPH0438136B2 JPH0438136B2 (enExample) 1992-06-23

Family

ID=13349757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60067606A Granted JPS61226936A (ja) 1985-03-30 1985-03-30 ワイヤボンデイング方法および装置

Country Status (1)

Country Link
JP (1) JPS61226936A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11404393B2 (en) * 2018-08-23 2022-08-02 Kaijo Corporation Wire bonding method and wire bonding device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348461A (en) * 1976-10-15 1978-05-01 Hitachi Ltd Wire bonder
JPS5724026A (en) * 1980-07-16 1982-02-08 Tdk Corp Magnetic recording medium
JPS593850A (ja) * 1982-06-29 1984-01-10 Mitsubishi Electric Corp 陰極線管

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348461A (en) * 1976-10-15 1978-05-01 Hitachi Ltd Wire bonder
JPS5724026A (en) * 1980-07-16 1982-02-08 Tdk Corp Magnetic recording medium
JPS593850A (ja) * 1982-06-29 1984-01-10 Mitsubishi Electric Corp 陰極線管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11404393B2 (en) * 2018-08-23 2022-08-02 Kaijo Corporation Wire bonding method and wire bonding device

Also Published As

Publication number Publication date
JPH0438136B2 (enExample) 1992-06-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term