JPS61225851A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法Info
- Publication number
- JPS61225851A JPS61225851A JP60066799A JP6679985A JPS61225851A JP S61225851 A JPS61225851 A JP S61225851A JP 60066799 A JP60066799 A JP 60066799A JP 6679985 A JP6679985 A JP 6679985A JP S61225851 A JPS61225851 A JP S61225851A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- conductor layer
- capacitor insulating
- groove
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60066799A JPS61225851A (ja) | 1985-03-30 | 1985-03-30 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60066799A JPS61225851A (ja) | 1985-03-30 | 1985-03-30 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61225851A true JPS61225851A (ja) | 1986-10-07 |
| JPH023303B2 JPH023303B2 (enrdf_load_stackoverflow) | 1990-01-23 |
Family
ID=13326274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60066799A Granted JPS61225851A (ja) | 1985-03-30 | 1985-03-30 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61225851A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299371A (ja) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | 溝堀り型キャパシタの製造方法 |
| JPH01179443A (ja) * | 1988-01-06 | 1989-07-17 | Fujitsu Ltd | 半導体装置 |
| US5354710A (en) * | 1988-01-14 | 1994-10-11 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor devices using an adsorption enhancement layer |
| US5753530A (en) * | 1992-04-21 | 1998-05-19 | Seiko Instruments, Inc. | Impurity doping method with diffusion source of boron-silicide film |
-
1985
- 1985-03-30 JP JP60066799A patent/JPS61225851A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299371A (ja) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | 溝堀り型キャパシタの製造方法 |
| JPH01179443A (ja) * | 1988-01-06 | 1989-07-17 | Fujitsu Ltd | 半導体装置 |
| US5354710A (en) * | 1988-01-14 | 1994-10-11 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor devices using an adsorption enhancement layer |
| US5753530A (en) * | 1992-04-21 | 1998-05-19 | Seiko Instruments, Inc. | Impurity doping method with diffusion source of boron-silicide film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023303B2 (enrdf_load_stackoverflow) | 1990-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0348046A2 (en) | Method of producing a semiconductor device | |
| KR100509210B1 (ko) | Dram셀장치및그의제조방법 | |
| JP3229665B2 (ja) | Mosfetの製造方法 | |
| KR940006681B1 (ko) | 스택트렌치 셀 및 그 제조방법 | |
| JPH01132152A (ja) | 半導体装置の溝型キャパシタセルの製造方法 | |
| JPH01287956A (ja) | 半導体記憶装置およびその製造方法 | |
| KR950012034B1 (ko) | 반도체 기억장치의 제조방법 | |
| JPH0645522A (ja) | 半導体装置の製造方法 | |
| JPS6156445A (ja) | 半導体装置 | |
| JP2513287B2 (ja) | 積層型メモリセルの製造方法 | |
| JPS61225851A (ja) | 半導体装置及びその製造方法 | |
| JP2772375B2 (ja) | 半導体記憶装置 | |
| JP3233935B2 (ja) | コンデンサ電極とmosトランジスタのソース/ドレイン領域との間に接触を製造するための方法 | |
| JP2568638B2 (ja) | 半導体装置の製造方法 | |
| JPH0336309B2 (enrdf_load_stackoverflow) | ||
| JPH05226466A (ja) | 半導体装置の製造方法 | |
| JPS6240765A (ja) | 読み出し専用半導体記憶装置およびその製造方法 | |
| JPH01114042A (ja) | 半導体装置の製造方法 | |
| JP2621607B2 (ja) | 半導体装置の製造方法 | |
| JP3004280B2 (ja) | 半導体メモリセル | |
| JPH022672A (ja) | 半導体メモリセルとその製造方法 | |
| JP2556155B2 (ja) | 半導体装置の製造方法 | |
| KR960001952B1 (ko) | 스택형 트렌치 캐패시터의 제조방법 | |
| US6204528B1 (en) | Dynamic random access memory structure | |
| KR940006659B1 (ko) | 반도체 메모리장치의 제조방법 |