JPS6122461B2 - - Google Patents

Info

Publication number
JPS6122461B2
JPS6122461B2 JP55137471A JP13747180A JPS6122461B2 JP S6122461 B2 JPS6122461 B2 JP S6122461B2 JP 55137471 A JP55137471 A JP 55137471A JP 13747180 A JP13747180 A JP 13747180A JP S6122461 B2 JPS6122461 B2 JP S6122461B2
Authority
JP
Japan
Prior art keywords
bonding
plastic deformation
leads
degree
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55137471A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5762550A (en
Inventor
Takashi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55137471A priority Critical patent/JPS5762550A/ja
Publication of JPS5762550A publication Critical patent/JPS5762550A/ja
Publication of JPS6122461B2 publication Critical patent/JPS6122461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/429—

Landscapes

  • Wire Bonding (AREA)
JP55137471A 1980-10-01 1980-10-01 Semiconductor device Granted JPS5762550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55137471A JPS5762550A (en) 1980-10-01 1980-10-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55137471A JPS5762550A (en) 1980-10-01 1980-10-01 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5762550A JPS5762550A (en) 1982-04-15
JPS6122461B2 true JPS6122461B2 (cg-RX-API-DMAC10.html) 1986-05-31

Family

ID=15199376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55137471A Granted JPS5762550A (en) 1980-10-01 1980-10-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5762550A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102040U (cg-RX-API-DMAC10.html) * 1984-12-10 1986-06-28
JPH01104031U (cg-RX-API-DMAC10.html) * 1987-12-25 1989-07-13
US4842662A (en) * 1988-06-01 1989-06-27 Hewlett-Packard Company Process for bonding integrated circuit components

Also Published As

Publication number Publication date
JPS5762550A (en) 1982-04-15

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