JPS6122352U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS6122352U
JPS6122352U JP1984108343U JP10834384U JPS6122352U JP S6122352 U JPS6122352 U JP S6122352U JP 1984108343 U JP1984108343 U JP 1984108343U JP 10834384 U JP10834384 U JP 10834384U JP S6122352 U JPS6122352 U JP S6122352U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit device
flow
coating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984108343U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322917Y2 (enrdf_load_stackoverflow
Inventor
保一 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1984108343U priority Critical patent/JPS6122352U/ja
Publication of JPS6122352U publication Critical patent/JPS6122352U/ja
Application granted granted Critical
Publication of JPH0322917Y2 publication Critical patent/JPH0322917Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984108343U 1984-07-16 1984-07-16 混成集積回路装置 Granted JPS6122352U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984108343U JPS6122352U (ja) 1984-07-16 1984-07-16 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984108343U JPS6122352U (ja) 1984-07-16 1984-07-16 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS6122352U true JPS6122352U (ja) 1986-02-08
JPH0322917Y2 JPH0322917Y2 (enrdf_load_stackoverflow) 1991-05-20

Family

ID=30667539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984108343U Granted JPS6122352U (ja) 1984-07-16 1984-07-16 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS6122352U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764160U (enrdf_load_stackoverflow) * 1980-10-06 1982-04-16
JPS57170542A (en) * 1981-04-14 1982-10-20 Seiko Keiyo Kogyo Kk Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764160U (enrdf_load_stackoverflow) * 1980-10-06 1982-04-16
JPS57170542A (en) * 1981-04-14 1982-10-20 Seiko Keiyo Kogyo Kk Semiconductor device

Also Published As

Publication number Publication date
JPH0322917Y2 (enrdf_load_stackoverflow) 1991-05-20

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