JPS5764160U - - Google Patents
Info
- Publication number
- JPS5764160U JPS5764160U JP1980142377U JP14237780U JPS5764160U JP S5764160 U JPS5764160 U JP S5764160U JP 1980142377 U JP1980142377 U JP 1980142377U JP 14237780 U JP14237780 U JP 14237780U JP S5764160 U JPS5764160 U JP S5764160U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980142377U JPS6020929Y2 (ja) | 1980-10-06 | 1980-10-06 | 電気回路素子の封止枠構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980142377U JPS6020929Y2 (ja) | 1980-10-06 | 1980-10-06 | 電気回路素子の封止枠構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5764160U true JPS5764160U (enrdf_load_stackoverflow) | 1982-04-16 |
JPS6020929Y2 JPS6020929Y2 (ja) | 1985-06-22 |
Family
ID=29502180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980142377U Expired JPS6020929Y2 (ja) | 1980-10-06 | 1980-10-06 | 電気回路素子の封止枠構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6020929Y2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6122352U (ja) * | 1984-07-16 | 1986-02-08 | 三菱電機株式会社 | 混成集積回路装置 |
-
1980
- 1980-10-06 JP JP1980142377U patent/JPS6020929Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6122352U (ja) * | 1984-07-16 | 1986-02-08 | 三菱電機株式会社 | 混成集積回路装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6020929Y2 (ja) | 1985-06-22 |