JPS61220474A - ジユアル電子注入構造体 - Google Patents

ジユアル電子注入構造体

Info

Publication number
JPS61220474A
JPS61220474A JP60283208A JP28320885A JPS61220474A JP S61220474 A JPS61220474 A JP S61220474A JP 60283208 A JP60283208 A JP 60283208A JP 28320885 A JP28320885 A JP 28320885A JP S61220474 A JPS61220474 A JP S61220474A
Authority
JP
Japan
Prior art keywords
layer
region
silicon
polycrystalline silicon
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60283208A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364063B2 (cg-RX-API-DMAC10.html
Inventor
チヤールズ・トーマス・クロール、ジユニア
ジヨフレイ・ブウネル・スチーブンス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS61220474A publication Critical patent/JPS61220474A/ja
Publication of JPS6364063B2 publication Critical patent/JPS6364063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P14/6336—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H10P14/6682—
    • H10P14/69215—
    • H10P14/69433—

Landscapes

  • Non-Volatile Memory (AREA)
  • Formation Of Insulating Films (AREA)
  • Semiconductor Memories (AREA)
JP60283208A 1985-03-25 1985-12-18 ジユアル電子注入構造体 Granted JPS61220474A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/715,318 US4656729A (en) 1985-03-25 1985-03-25 Dual electron injection structure and process with self-limiting oxidation barrier
US715318 1996-09-17

Publications (2)

Publication Number Publication Date
JPS61220474A true JPS61220474A (ja) 1986-09-30
JPS6364063B2 JPS6364063B2 (cg-RX-API-DMAC10.html) 1988-12-09

Family

ID=24873551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60283208A Granted JPS61220474A (ja) 1985-03-25 1985-12-18 ジユアル電子注入構造体

Country Status (5)

Country Link
US (1) US4656729A (cg-RX-API-DMAC10.html)
EP (1) EP0195902B1 (cg-RX-API-DMAC10.html)
JP (1) JPS61220474A (cg-RX-API-DMAC10.html)
CA (1) CA1232365A (cg-RX-API-DMAC10.html)
DE (1) DE3671329D1 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183565A (ja) * 1986-02-07 1987-08-11 Fujitsu Ltd 半導体不揮発性メモリおよびその製造方法
JPH01170049A (ja) * 1987-12-25 1989-07-05 Sony Corp 半導体記憶装置の製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2664685B2 (ja) * 1987-07-31 1997-10-15 株式会社東芝 半導体装置の製造方法
CA1276314C (en) * 1988-03-24 1990-11-13 Alexander Kalnitsky Silicon ion implanted semiconductor device
US5164339A (en) * 1988-09-30 1992-11-17 Siemens-Bendix Automotive Electronics L.P. Fabrication of oxynitride frontside microstructures
ATE217448T1 (de) * 1990-01-22 2002-05-15 Silicon Storage Tech Inc Nichtflüchtige elektrisch veränderbare eintransistor-halbleiterspeicheranordnung mit rekristallisiertem schwebendem gate
WO1993003500A1 (en) * 1991-08-01 1993-02-18 Sierra Semiconductor Corporation Method of forming a resistive element in a semiconductor device and a sram cell made thereby
US5467305A (en) * 1992-03-12 1995-11-14 International Business Machines Corporation Three-dimensional direct-write EEPROM arrays and fabrication methods
US5331189A (en) * 1992-06-19 1994-07-19 International Business Machines Corporation Asymmetric multilayered dielectric material and a flash EEPROM using the same
JP3045946B2 (ja) * 1994-05-09 2000-05-29 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体デバイスの製造方法
JP2630257B2 (ja) * 1994-06-03 1997-07-16 日本電気株式会社 半導体装置の製造方法
US5622596A (en) * 1995-05-08 1997-04-22 International Business Machines Corporation High density selective SiO2 :Si3 N4 etching using a stoichiometrically altered nitride etch stop
US6066525A (en) * 1998-04-07 2000-05-23 Lsi Logic Corporation Method of forming DRAM capacitor by forming separate dielectric layers in a CMOS process
KR101100428B1 (ko) * 2005-09-23 2011-12-30 삼성전자주식회사 ＳＲＯ(Ｓｉｌｉｃｏｎ Ｒｉｃｈ Ｏｘｉｄｅ) 및 이를적용한 반도체 소자의 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0034653B1 (en) * 1980-02-25 1984-05-16 International Business Machines Corporation Dual electron injector structures
US4472726A (en) * 1981-05-06 1984-09-18 The United States Of America As Represented By The Secretary Of The Air Force Two carrier dual injector apparatus
EP0081626B1 (en) * 1981-12-14 1988-10-19 International Business Machines Corporation Dual electron injector structure and semiconductor memory device including a dual electron injector structure
US4471471A (en) * 1981-12-31 1984-09-11 International Business Machines Corporation Non-volatile RAM device
US4535349A (en) * 1981-12-31 1985-08-13 International Business Machines Corporation Non-volatile memory cell using a crystalline storage element with capacitively coupled sensing
US4486859A (en) * 1982-02-19 1984-12-04 International Business Machines Corporation Electrically alterable read-only storage cell and method of operating same
JPS59112657A (ja) * 1982-09-30 1984-06-29 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン 書込可能なリ−ドオンリ−メモリ
US4458407A (en) * 1983-04-01 1984-07-10 International Business Machines Corporation Process for fabricating semi-conductive oxide between two poly silicon gate electrodes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183565A (ja) * 1986-02-07 1987-08-11 Fujitsu Ltd 半導体不揮発性メモリおよびその製造方法
JPH01170049A (ja) * 1987-12-25 1989-07-05 Sony Corp 半導体記憶装置の製造方法

Also Published As

Publication number Publication date
EP0195902A3 (en) 1988-08-31
DE3671329D1 (de) 1990-06-21
EP0195902B1 (en) 1990-05-16
JPS6364063B2 (cg-RX-API-DMAC10.html) 1988-12-09
EP0195902A2 (en) 1986-10-01
US4656729A (en) 1987-04-14
CA1232365A (en) 1988-02-02

Similar Documents

Publication Publication Date Title
US6232244B1 (en) Methodology for achieving dual gate oxide thicknesses
US4397077A (en) Method of fabricating self-aligned MOS devices and independently formed gate dielectrics and insulating layers
US6069041A (en) Process for manufacturing non-volatile semiconductor memory device by introducing nitrogen atoms
US4458407A (en) Process for fabricating semi-conductive oxide between two poly silicon gate electrodes
JPH0451071B2 (cg-RX-API-DMAC10.html)
JPH0140503B2 (cg-RX-API-DMAC10.html)
JPS58148445A (ja) 相補形電界効果型トランジスタの製造方法
JPS61220474A (ja) ジユアル電子注入構造体
JPS6410107B2 (cg-RX-API-DMAC10.html)
JPH06204496A (ja) 高品質の酸化膜を成長させるための方法
US4566173A (en) Gate insulation layer and method of producing such a structure
US4229755A (en) Fabrication of very large scale integrated circuits containing N-channel silicon gate nonvolatile memory elements
US6110780A (en) Using NO or N2 O treatment to generate different oxide thicknesses in one oxidation step for single poly non-volatile memory
US4470191A (en) Process for making complementary transistors by sequential implantations using oxidation barrier masking layer
US6316804B1 (en) Oxygen implant self-aligned, floating gate and isolation structure
JPS6068658A (ja) 半導体装置の製造方法
JP3328600B2 (ja) バイポーラ及びｂｉｃｍｏｓデバイスの作製プロセス
JPS62290147A (ja) 半導体装置の製法
KR900000204B1 (ko) 불휘발성 반도체기억장치의 제조방법
Sunami et al. Selective oxide coating of silicon gate (SELOCS)
JPH11176959A (ja) 半導体装置の製造方法
JPH05343698A (ja) 半導体装置の製造方法
KR980005825A (ko) 반도체 소자의 제조방법
JPH0629543A (ja) 半導体装置の製造方法
JPH05343703A (ja) 不揮発性メモリの製造方法