DE3671329D1 - Doppel-elektroninjektionsstruktur und verfahren mit selbsttaetiger oxidationssperre. - Google Patents

Doppel-elektroninjektionsstruktur und verfahren mit selbsttaetiger oxidationssperre.

Info

Publication number
DE3671329D1
DE3671329D1 DE8686101468T DE3671329T DE3671329D1 DE 3671329 D1 DE3671329 D1 DE 3671329D1 DE 8686101468 T DE8686101468 T DE 8686101468T DE 3671329 T DE3671329 T DE 3671329T DE 3671329 D1 DE3671329 D1 DE 3671329D1
Authority
DE
Germany
Prior art keywords
self
electron injection
injection structure
oxidation barrier
double electron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686101468T
Other languages
English (en)
Inventor
Kroll, Jr
Geoffrey Brownell Stephens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3671329D1 publication Critical patent/DE3671329D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/3143—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers
    • H01L21/3145—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers formed by deposition from a gas or vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Non-Volatile Memory (AREA)
  • Formation Of Insulating Films (AREA)
  • Semiconductor Memories (AREA)
DE8686101468T 1985-03-25 1986-02-05 Doppel-elektroninjektionsstruktur und verfahren mit selbsttaetiger oxidationssperre. Expired - Lifetime DE3671329D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/715,318 US4656729A (en) 1985-03-25 1985-03-25 Dual electron injection structure and process with self-limiting oxidation barrier

Publications (1)

Publication Number Publication Date
DE3671329D1 true DE3671329D1 (de) 1990-06-21

Family

ID=24873551

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686101468T Expired - Lifetime DE3671329D1 (de) 1985-03-25 1986-02-05 Doppel-elektroninjektionsstruktur und verfahren mit selbsttaetiger oxidationssperre.

Country Status (5)

Country Link
US (1) US4656729A (de)
EP (1) EP0195902B1 (de)
JP (1) JPS61220474A (de)
CA (1) CA1232365A (de)
DE (1) DE3671329D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183565A (ja) * 1986-02-07 1987-08-11 Fujitsu Ltd 半導体不揮発性メモリおよびその製造方法
JP2664685B2 (ja) * 1987-07-31 1997-10-15 株式会社東芝 半導体装置の製造方法
JP2650287B2 (ja) * 1987-12-25 1997-09-03 ソニー株式会社 半導体記憶装置の製造方法
CA1276314C (en) * 1988-03-24 1990-11-13 Alexander Kalnitsky Silicon ion implanted semiconductor device
US5164339A (en) * 1988-09-30 1992-11-17 Siemens-Bendix Automotive Electronics L.P. Fabrication of oxynitride frontside microstructures
WO1991011026A1 (en) * 1990-01-22 1991-07-25 Silicon Storage Technology, Inc. Single transistor non-volatile electrically alterable semiconductor memory device with a re-crystallized floating gate
WO1993003500A1 (en) * 1991-08-01 1993-02-18 Sierra Semiconductor Corporation Method of forming a resistive element in a semiconductor device and a sram cell made thereby
US5467305A (en) * 1992-03-12 1995-11-14 International Business Machines Corporation Three-dimensional direct-write EEPROM arrays and fabrication methods
US5331189A (en) * 1992-06-19 1994-07-19 International Business Machines Corporation Asymmetric multilayered dielectric material and a flash EEPROM using the same
JP3045946B2 (ja) * 1994-05-09 2000-05-29 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体デバイスの製造方法
JP2630257B2 (ja) * 1994-06-03 1997-07-16 日本電気株式会社 半導体装置の製造方法
US5622596A (en) * 1995-05-08 1997-04-22 International Business Machines Corporation High density selective SiO2 :Si3 N4 etching using a stoichiometrically altered nitride etch stop
US6066525A (en) * 1998-04-07 2000-05-23 Lsi Logic Corporation Method of forming DRAM capacitor by forming separate dielectric layers in a CMOS process
KR101100428B1 (ko) * 2005-09-23 2011-12-30 삼성전자주식회사 ＳＲＯ(Ｓｉｌｉｃｏｎ Ｒｉｃｈ Ｏｘｉｄｅ) 및 이를적용한 반도체 소자의 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3067881D1 (en) * 1980-02-25 1984-06-20 Ibm Dual electron injector structures
US4472726A (en) * 1981-05-06 1984-09-18 The United States Of America As Represented By The Secretary Of The Air Force Two carrier dual injector apparatus
EP0081626B1 (de) * 1981-12-14 1988-10-19 International Business Machines Corporation Doppel-Elektroneninjektionsstruktur und Halbleiterspeicheranordnung mit Doppel-Elektroneninjektionsstruktur
US4471471A (en) * 1981-12-31 1984-09-11 International Business Machines Corporation Non-volatile RAM device
US4535349A (en) * 1981-12-31 1985-08-13 International Business Machines Corporation Non-volatile memory cell using a crystalline storage element with capacitively coupled sensing
US4486859A (en) * 1982-02-19 1984-12-04 International Business Machines Corporation Electrically alterable read-only storage cell and method of operating same
JPS59112657A (ja) * 1982-09-30 1984-06-29 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン 書込可能なリ−ドオンリ−メモリ
US4458407A (en) * 1983-04-01 1984-07-10 International Business Machines Corporation Process for fabricating semi-conductive oxide between two poly silicon gate electrodes

Also Published As

Publication number Publication date
US4656729A (en) 1987-04-14
JPS61220474A (ja) 1986-09-30
JPS6364063B2 (de) 1988-12-09
EP0195902A3 (en) 1988-08-31
EP0195902A2 (de) 1986-10-01
CA1232365A (en) 1988-02-02
EP0195902B1 (de) 1990-05-16

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