JPS61216330A - 半導体装置のエツチング装置 - Google Patents

半導体装置のエツチング装置

Info

Publication number
JPS61216330A
JPS61216330A JP2560285A JP2560285A JPS61216330A JP S61216330 A JPS61216330 A JP S61216330A JP 2560285 A JP2560285 A JP 2560285A JP 2560285 A JP2560285 A JP 2560285A JP S61216330 A JPS61216330 A JP S61216330A
Authority
JP
Japan
Prior art keywords
etching
floating
wafer
periphery
rotating body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2560285A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0257338B2 (enExample
Inventor
Eiichi Yamashita
山下　ひで一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2560285A priority Critical patent/JPS61216330A/ja
Publication of JPS61216330A publication Critical patent/JPS61216330A/ja
Publication of JPH0257338B2 publication Critical patent/JPH0257338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2560285A 1985-02-13 1985-02-13 半導体装置のエツチング装置 Granted JPS61216330A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2560285A JPS61216330A (ja) 1985-02-13 1985-02-13 半導体装置のエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2560285A JPS61216330A (ja) 1985-02-13 1985-02-13 半導体装置のエツチング装置

Publications (2)

Publication Number Publication Date
JPS61216330A true JPS61216330A (ja) 1986-09-26
JPH0257338B2 JPH0257338B2 (enExample) 1990-12-04

Family

ID=12170456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2560285A Granted JPS61216330A (ja) 1985-02-13 1985-02-13 半導体装置のエツチング装置

Country Status (1)

Country Link
JP (1) JPS61216330A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001027986A1 (de) * 1999-10-13 2001-04-19 Gebrüder Decker GmbH & Co. KG Verfahren und vorrichtung zur oberflächen-behandlung von gegenständen
US7992318B2 (en) * 2007-01-22 2011-08-09 Tokyo Electron Limited Heating apparatus, heating method, and computer readable storage medium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001027986A1 (de) * 1999-10-13 2001-04-19 Gebrüder Decker GmbH & Co. KG Verfahren und vorrichtung zur oberflächen-behandlung von gegenständen
US7992318B2 (en) * 2007-01-22 2011-08-09 Tokyo Electron Limited Heating apparatus, heating method, and computer readable storage medium
US8186077B2 (en) 2007-01-22 2012-05-29 Tokyo Electron Limited Heating apparatus, heating method, and computer readable storage medium

Also Published As

Publication number Publication date
JPH0257338B2 (enExample) 1990-12-04

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