JPH0257338B2 - - Google Patents
Info
- Publication number
- JPH0257338B2 JPH0257338B2 JP2560285A JP2560285A JPH0257338B2 JP H0257338 B2 JPH0257338 B2 JP H0257338B2 JP 2560285 A JP2560285 A JP 2560285A JP 2560285 A JP2560285 A JP 2560285A JP H0257338 B2 JPH0257338 B2 JP H0257338B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- wafer
- floating
- tank
- rotating body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2560285A JPS61216330A (ja) | 1985-02-13 | 1985-02-13 | 半導体装置のエツチング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2560285A JPS61216330A (ja) | 1985-02-13 | 1985-02-13 | 半導体装置のエツチング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61216330A JPS61216330A (ja) | 1986-09-26 |
| JPH0257338B2 true JPH0257338B2 (enExample) | 1990-12-04 |
Family
ID=12170456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2560285A Granted JPS61216330A (ja) | 1985-02-13 | 1985-02-13 | 半導体装置のエツチング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61216330A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001027986A1 (de) * | 1999-10-13 | 2001-04-19 | Gebrüder Decker GmbH & Co. KG | Verfahren und vorrichtung zur oberflächen-behandlung von gegenständen |
| JP5109376B2 (ja) | 2007-01-22 | 2012-12-26 | 東京エレクトロン株式会社 | 加熱装置、加熱方法及び記憶媒体 |
-
1985
- 1985-02-13 JP JP2560285A patent/JPS61216330A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61216330A (ja) | 1986-09-26 |
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