JPS61210651A - ディスプレイパネルの実装体 - Google Patents

ディスプレイパネルの実装体

Info

Publication number
JPS61210651A
JPS61210651A JP60053132A JP5313285A JPS61210651A JP S61210651 A JPS61210651 A JP S61210651A JP 60053132 A JP60053132 A JP 60053132A JP 5313285 A JP5313285 A JP 5313285A JP S61210651 A JPS61210651 A JP S61210651A
Authority
JP
Japan
Prior art keywords
display panel
film carrier
lead
frame
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60053132A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0424857B2 (enrdf_load_stackoverflow
Inventor
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60053132A priority Critical patent/JPS61210651A/ja
Publication of JPS61210651A publication Critical patent/JPS61210651A/ja
Publication of JPH0424857B2 publication Critical patent/JPH0424857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Wire Bonding (AREA)
JP60053132A 1985-03-15 1985-03-15 ディスプレイパネルの実装体 Granted JPS61210651A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60053132A JPS61210651A (ja) 1985-03-15 1985-03-15 ディスプレイパネルの実装体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60053132A JPS61210651A (ja) 1985-03-15 1985-03-15 ディスプレイパネルの実装体

Publications (2)

Publication Number Publication Date
JPS61210651A true JPS61210651A (ja) 1986-09-18
JPH0424857B2 JPH0424857B2 (enrdf_load_stackoverflow) 1992-04-28

Family

ID=12934286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60053132A Granted JPS61210651A (ja) 1985-03-15 1985-03-15 ディスプレイパネルの実装体

Country Status (1)

Country Link
JP (1) JPS61210651A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100553759B1 (ko) 2004-04-29 2006-02-20 삼성에스디아이 주식회사 플라즈마 표시장치
KR100554419B1 (ko) * 2003-12-10 2006-02-22 엘지전자 주식회사 새로운 구조의 티씨피를 포함하는 플라즈마 표시 패널의 구동장치
KR100627384B1 (ko) 2003-11-11 2006-09-21 삼성에스디아이 주식회사 드라이버 ｉｃ 방열 구조를 갖는 플라즈마 디스플레이 장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100627384B1 (ko) 2003-11-11 2006-09-21 삼성에스디아이 주식회사 드라이버 ｉｃ 방열 구조를 갖는 플라즈마 디스플레이 장치
KR100554419B1 (ko) * 2003-12-10 2006-02-22 엘지전자 주식회사 새로운 구조의 티씨피를 포함하는 플라즈마 표시 패널의 구동장치
KR100553759B1 (ko) 2004-04-29 2006-02-20 삼성에스디아이 주식회사 플라즈마 표시장치

Also Published As

Publication number Publication date
JPH0424857B2 (enrdf_load_stackoverflow) 1992-04-28

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees