JPS61210651A - Mounting body of display panel - Google Patents
Mounting body of display panelInfo
- Publication number
- JPS61210651A JPS61210651A JP60053132A JP5313285A JPS61210651A JP S61210651 A JPS61210651 A JP S61210651A JP 60053132 A JP60053132 A JP 60053132A JP 5313285 A JP5313285 A JP 5313285A JP S61210651 A JPS61210651 A JP S61210651A
- Authority
- JP
- Japan
- Prior art keywords
- display panel
- film carrier
- lead
- frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、液晶、ＥＬ等のディスプレイパネルとこれを
駆動する回路を高密度、薄型かっ、安価に実装した実装
体に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a package in which a display panel such as a liquid crystal or EL display panel and a circuit for driving the display panel are mounted in a high-density, thin, and inexpensive manner.
従来の技術
近年、液晶やＥＬを用いた平板ディスプレイパネルが開
発、商品化されてきている。これらの平板ディスプレイ
パネルは薄型のディスプレイを実現できるものの、平板
ディスプレイパネルの端面に導出された電極群にこれを
駆動するだめの半導体装置を接続する必要がある。これ
ら電極の数は平板ディスプレイの大きさにもよるが数１
００本から数１０００本に達するものであった。第７図
で従来の構成について説明する。半導体装置はフラット
パック等のパッケージ１０に実装され、平板ディスプレ
イパネル７とほぼ同一寸法の回路基板１２上に搭載され
る。パッケージ１０のリード１１は、前記回路基板１２
上に形成した配線パターン１３に半田づけ固定され、前
記配線パターン１３は、回路基板１２に設けたスルーホ
ールを介して、反対面の回路基板の電極１３′に接続さ
れる。前記回路基板の電極１３′と平板ティスプレィパ
ネル７の電極８とは同一間隔で形成されるものである。BACKGROUND OF THE INVENTION In recent years, flat display panels using liquid crystals or EL have been developed and commercialized. Although these flat display panels can realize a thin display, it is necessary to connect a semiconductor device for driving the electrode group to the end face of the flat display panel. The number of these electrodes depends on the size of the flat panel display, but it is several 1.
The number ranged from 00 to several thousand. A conventional configuration will be explained with reference to FIG. The semiconductor device is mounted in a package 10 such as a flat pack, and mounted on a circuit board 12 having approximately the same dimensions as the flat display panel 7. The leads 11 of the package 10 are connected to the circuit board 12.
It is fixed by soldering to a wiring pattern 13 formed above, and the wiring pattern 13 is connected to an electrode 13' of the circuit board on the opposite side through a through hole provided in the circuit board 12. The electrodes 13' of the circuit board and the electrodes 8 of the flat display panel 7 are formed at the same interval.
また前記回路基板の電極１３′と平板ディスプレイパネ
ル７の電極８とは、導電性領域と絶縁性領域とを交互に
積層した弾性接続体１４で接続され、押え体１５で固定
される。Further, the electrode 13' of the circuit board and the electrode 8 of the flat display panel 7 are connected by an elastic connector 14 in which conductive regions and insulating regions are alternately laminated, and fixed by a presser member 15.
この様々従来の平板ディスプレイパネルの実装体の構成
においては、半導体装置のパッケージはリード数の増大
とともに大型に々り回路基板に搭載され難くなり、平板
ディスプレイ全体が大型するものであった。壕だ回路基
板の電極を平板ディスプレイの電極と相対して、１対１
で形成しなければならない。実際には数１ｏｍの辺に数
１００μｍのピッチで電極を形成しなければならないか
ら、前記回路基板上の電極間隔の寸法は、熱膨張等で累
積誤差をきたし、完全な接続を得る事ができす接続不良
を発生していた。更にまだ、接続箇所が著しるしく多い
、例えば半導体装置のパッケージ内のワイヤボンディン
グ、パッケージ１１の半田づけ、弾性接続体の２箇所の
部分と少なくとも４箇所の接続を必要としこれは、信頼
性を低下させる原因になっていた。In these various conventional flat display panel mounting configurations, as the number of leads increases, it becomes difficult for the semiconductor device package to be mounted on a large circuit board, resulting in an increase in the size of the flat display as a whole. Place the electrodes of the trench circuit board against the electrodes of the flat display, one-on-one.
must be formed. In reality, electrodes must be formed at a pitch of several 100 μm on a side of several 1 ohm, so the dimensions of the electrode spacing on the circuit board will have cumulative errors due to thermal expansion, etc., making it impossible to obtain a perfect connection. A poor connection was occurring. Furthermore, there are still a significant number of connection points, such as wire bonding inside the package of the semiconductor device, soldering of the package 11, and two parts of the elastic connector and at least four connections, which impairs reliability. It was causing a decline.
発明が解決しようとする問題点
従来のこの様な構成では、平板ディスプレイパネルの実
装体の大きさが著しるしく大きく々ったり、あるいは、
接続点数が多く接続の信頼性を低下させる原因に々って
いる。これは、実装体の構成部品点数が多い事や、本当
の平板ディスプレイ６ヘー／
パネルの実装体を実現できていない事によるものと思わ
れる。Problems to be Solved by the Invention In such a conventional configuration, the size of the mounting body of the flat display panel is significantly large, or
This is due to the large number of connection points, which reduces the reliability of the connection. This is thought to be due to the large number of component parts in the mounting body and the inability to realize a true flat display 6/panel mounting body.
そこで、本発明は、構成部品数を少なく、平板ディスプ
レイパネルの電極と半導体装置の電極を極力接近させん
とするものである。Therefore, the present invention aims to reduce the number of component parts and bring the electrodes of the flat display panel and the electrodes of the semiconductor device as close as possible.
問題点を解決するだめの手段
そして上記問題点を解決する本発明の技術的手段は、半
導体装置のパッケージにフィルムキャリヤ方式を用い、
リードを２方向に導出し、これを枠体に載置するもので
ある。A means for solving the problems and a technical means of the present invention for solving the above problems is to use a film carrier method in the package of a semiconductor device,
Leads are led out in two directions and placed on a frame.
作 用
この技術的手段による作用は次の様になる。すなわちフ
ィルムキャリヤ方式で半導体装置を実装し、リードを２
方向のみに導出し、これを枠体に載置する事により、一
方のリードは少なくともディスプレイパネルの電極と相
対し、接するものである。枠体と２方向に導出したリー
ドを有するフィルムキャリヤを用いる事により、位置合
せが容易でかつ、ピッチずれがなく、構成部品点数が著
しるしく少なく、小型、薄型の実装体を得る事が６ ペ
ー。Effect The effect of this technical means is as follows. In other words, the semiconductor device is mounted using a film carrier method, and two leads are mounted.
By leading out only in the direction and placing it on the frame, one lead faces and contacts at least the electrode of the display panel. By using a frame body and a film carrier having leads led out in two directions, it is possible to easily align the frame, have no pitch deviation, significantly reduce the number of component parts, and obtain a small and thin mounting body.6 P.
できる。can.
実施例 本発明の一実施例を第１図〜第５図を用いて説明する。Example An embodiment of the present invention will be described using FIGS. 1 to 5.
まず第１図において、枠体４には回路基板９を載置する
第１の面４ａと、シリコーンゴムを有し、第１の面４ａ
と傾斜面２２とが交わる領域に凹部６が形成されている
。First, in FIG. 1, the frame body 4 has a first surface 4a on which a circuit board 9 is placed, and a first surface 4a made of silicone rubber.
A recess 6 is formed in a region where the and inclined surface 22 intersect.
半導体装置１はフィルムキャリヤ方式で実装され、リー
ドは２方丙に導出され、枠体４の傾斜面２２上に配設さ
れ、一方のり一ド２は枠体４の第１の面４ａと載置され
た回路基板９の配線ノくターン９ａに半田づけされ、他
方のリード３は枠体４の第２の面４ｂに設けた弾性体１
０上に置かれている。１リード３上には平板ディスプレ
イパネル７の電極８が置かれ、ネジ１６を締めて治具１
１により弾性体１０を押圧し、その反発力により、＜ネ
ル、リード３が治具１１に対し押圧されるものである。The semiconductor device 1 is mounted using a film carrier method, and the leads are led out in two directions and placed on the inclined surface 22 of the frame 4, while the lead 2 is connected to the first surface 4a of the frame 4. The other lead 3 is soldered to the wiring turn 9a of the placed circuit board 9, and the other lead 3 is connected to the elastic body 1 provided on the second surface 4b of the frame 4.
It is placed on 0. The electrode 8 of the flat display panel 7 is placed on the 1 lead 3, and the jig 1 is tightened by tightening the screw 16.
1 presses the elastic body 10, and its repulsive force presses the lead 3 against the jig 11.
ここで前記リード３のピッチは前記デイスプレイパネル
７の電極８のピッチと同一に形成されるものである。ま
た半導体装置１は第２図に示す」：うにフィルムキャリ
ヤ方式により、前記半導体装置１の電極６上にＴｉ −
Ｐｄ−Ａｕ 、 Ｃｒ−Ｃｕ−Ａｕ等の多層金属膜を介
してＡｕ突起１０〜３０μｍを形成し、ポリイミド、ガ
ラス人りエポキシフィルム２０上に形成しだＣｕ箔を蝕
刻し、Ｓｎメッキ処理したリード２，３にＡｕ、Ｓｎの
合金で接合されるものである。あるいはまた、Ａｕ突起
を剥離容易な基板上に形成し、これを前記リードに転写
接合し、次いでリード上のＡｕ突起を半導体装置１のア
ルミ電極上に直接、接合する、いわゆる転写バンプ方式
を用いれば、低コストの実装体を得る事ができる。Here, the pitch of the leads 3 is formed to be the same as the pitch of the electrodes 8 of the display panel 7. Further, the semiconductor device 1 is shown in FIG.
A lead is formed by forming an Au protrusion of 10 to 30 μm through a multilayer metal film such as Pd-Au or Cr-Cu-Au, and forming it on a polyimide or glass epoxy film 20, etching the Cu foil, and subjecting it to Sn plating. 2 and 3 are joined with an alloy of Au and Sn. Alternatively, a so-called transfer bump method may be used in which Au protrusions are formed on an easily peelable substrate, transferred and bonded to the leads, and then the Au protrusions on the leads are directly bonded to the aluminum electrodes of the semiconductor device 1. If so, a low-cost mounting body can be obtained.
次に他の実施例について第３図を用いて説明する。この
構成においては第１図で説明した枠体４の凹部６は、枠
体４の第１の面４ａ上に厚目の回路基板９を載置し、こ
れを傾斜面２２より少しく離し凹部６ａを形成せしめて
いる。Next, another embodiment will be described using FIG. 3. In this configuration, a thick circuit board 9 is placed on the first surface 4a of the frame 4, and the recess 6 of the frame 4 explained in FIG. is formed.
次に本発明の一つの特徴である凹部の効果についてのべ
る。第４図の構成の枠体４には凹部を形成シてい々い。Next, the effect of the recesses, which is one of the features of the present invention, will be described. The frame body 4 having the structure shown in FIG. 4 is provided with a recessed portion.
この様な構成において、フィルムキャリヤを載置し、リ
ード３とパネルディスプレイパネル７を治具１１加圧す
ると、リード２は第１面４ａの回路基板９の配線パター
ン９ａに半田づけ固定されているから、加圧する事によ
り弾性体１０はその厚みが小さくなり、リード３は３ａ
の如く変形し、折曲がる。一方リード２も第１の面４ａ
の方向におされるから変形２ａをきたす事になる。この
ために、リード３が断線したり、あるいは、リード３の
ピッチがずれてしまいパネルディスプレイ７の電極８と
相対する事が出来なく々す、接続不良を発生させるもの
である。In such a configuration, when the film carrier is placed and the jig 11 pressurizes the leads 3 and the panel display panel 7, the leads 2 are soldered and fixed to the wiring pattern 9a of the circuit board 9 on the first surface 4a. Therefore, by applying pressure, the thickness of the elastic body 10 becomes smaller, and the lead 3 becomes 3a.
It deforms and bends like this. On the other hand, the lead 2 is also on the first surface 4a.
Since it is placed in the direction of , deformation 2a occurs. For this reason, the leads 3 are broken, or the pitch of the leads 3 is shifted so that they cannot face the electrodes 8 of the panel display 7, resulting in poor connection.
ところが第６図の如く例えば枠体４に凹部６が形成され
ていると治具１１により弾性体が縮少しても、フィルム
キャリヤは枠体４の傾斜面２２の下方（第１の面４ａ）
に押され、リード２が凹部５に入９こむからり一ド２は
軽く円形状２ａに曲がり、フィルムキャリヤ全体の寸法
を一定に保つ事ができるものである。However, if the recess 6 is formed in the frame 4 as shown in FIG.
When the lead 2 is pushed into the recess 5, the lead 2 is slightly bent into a circular shape 2a, and the dimensions of the entire film carrier can be kept constant.
９ ハ、−／
まだ半導体装置を載置した第２図のフィルムキャリヤを
枠体４に配設する方法について第６図でのべる。フィル
ムキャリヤを載置するために枠体４の傾斜面２２には前
記フィルムキャリヤとほぼ同一寸法の溝２５が、ディス
プレイパネルの電極と相対して、複数個形成されている
（第６図（ａ））。9 C, -/ A method for arranging the film carrier shown in FIG. 2 on which a semiconductor device is still mounted on the frame 4 will be described in FIG. 6. In order to place the film carrier, a plurality of grooves 25 having substantially the same dimensions as the film carrier are formed on the inclined surface 22 of the frame 4, facing the electrodes of the display panel (see FIG. 6(a)). )).
フィルムキャリヤを溝２６に配設するだけでディスプレ
イパネルの電極とフィルムキャリヤのリードとの位置合
せが完全に実施できるものである。Just by disposing the film carrier in the groove 26, the electrodes of the display panel and the leads of the film carrier can be completely aligned.
また第６図（ｂ）の構成は枠体４の傾斜面２２には前記
フィルムキャリヤを配設すべき位置にピン２６が設けら
れている。一方フィルムキャリャには前記ピン２６と合
致する孔を形成し、これをピン２６に差込む事によりフ
ィルムキャリヤを載置す、ると同時にパネルディスプレ
イパネルの電極との位置合せも行なうものである。Further, in the configuration shown in FIG. 6(b), a pin 26 is provided on the inclined surface 22 of the frame 4 at a position where the film carrier is to be placed. On the other hand, holes are formed in the film carrier that match the pins 26, and by inserting the holes into the pins 26, the film carrier is placed and at the same time aligned with the electrodes of the panel display panel. .
枠体４はアルミ等の金属でも良いし、樹脂で成形する事
もでき、枠体をナイスプレイパネルの化粧枠としてｆｆ
ｌいる事もできる。The frame 4 may be made of metal such as aluminum or may be molded from resin, and the frame 4 can be used as a decorative frame for a nice play panel.
I can also be there.
発明の効果
１ｏベーノ
以上のように、本発明は次のような効果を得ることがで
きる。Effects of the Invention 1o Beno As described above, the present invention can obtain the following effects.
（１）本発明の構成では構成部品が少なくかつ、半導体
装置の電極からのリードが直接、ディスプレイパネルの
電極と接しており接続箇所が著しるしく少なく、信頼性
が高いとともに、安価な実装体を実現できるものである
。(1) The configuration of the present invention has fewer components, the leads from the electrodes of the semiconductor device are in direct contact with the electrodes of the display panel, and the number of connection points is significantly smaller, resulting in a highly reliable and inexpensive package. It is possible to realize this.
（２）枠体に凹部を形成しであるだめフィルムキャリヤ
のリードの応力をここで吸収できるので、リードの損傷
が著しるしく少々く、信頼性が高跡・
（３） また、本発明の構成では、接続箇所が少々く
、万一、半導体装置が破損しても、リード２の半田づけ
のみを剥すだけで良いから、交換が著しるしく容易であ
る。(2) Since the stress of the lead of the film carrier can be absorbed by forming a recessed part in the frame, the damage to the lead is significantly reduced and the reliability is high. In this structure, there are only a few connection points, and even if the semiconductor device should be damaged, it is only necessary to remove the solder from the leads 2, making replacement extremely easy.
（４）枠体の傾斜面と設けた溝、ピンにより、フィルム
キャリヤの配設が著しるしく容易でかつ、ディスプレイ
パネルの電極との位置合せか、これもまだ著しるしく容
易になるもので製造方法が容易と々る等の効果を有する
。(4) The inclined surface of the frame and the provided grooves and pins make it extremely easy to arrange the film carrier, and it is also extremely easy to align it with the electrodes of the display panel. It has the advantage of being easy to manufacture.
第１図は本発明の一実施例におけるディスプレイパネル
の実装体の要部構成を示す断面図、第２図はフィルムキ
ャリヤ方式で実装した半導体装置の亦１視図、第３図は
本発明の他の実施例の構成を示す断面図、第４図は本発
明の更に他の実施例であって枠体に凹部を形成していな
い構成例を示す断面図、第５図は同枠体に凹部を形成し
た場合のリードの変形を示す断面図、第６図は枠体の実
施例の斜視図、第７図は従来の実装体の断面図である。
１・・・・・・半導体装置、２，３・・・・・−リード
、４・・・・枠体、５，６ａ・・・・・凹部、７・・・
・・平板ディスプレイパネル、８・・・・・電極、９・
・・・−回路基板、１０・・・・弾性体、２６・・・・
・溝、２６・・・・・ピン。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名／−
−−子側１１
２Ｊ−１１）’
第１図 ４−丘俸
８−−一震棲
９− 回路も及
１０−一一洋十省Ｅうイト、
第２図
第４図
第５図
、ｆ２２ｊ 伴FIG. 1 is a cross-sectional view showing the main structure of a display panel package according to an embodiment of the present invention, FIG. 2 is a first perspective view of a semiconductor device mounted using a film carrier method, and FIG. FIG. 4 is a sectional view showing a configuration of another embodiment of the present invention, and FIG. 5 is a sectional view showing a configuration example in which a recess is not formed in the frame body. FIG. 6 is a perspective view of an embodiment of the frame, and FIG. 7 is a cross-sectional view of a conventional mounting body. 1... Semiconductor device, 2, 3...-Lead, 4... Frame, 5, 6a... Concavity, 7...
・・Flat display panel, 8・・・Electrode, 9・
...-circuit board, 10...elastic body, 26...
・Groove, 26...pin. Name of agent: Patent attorney Toshio Nakao and 1 other person/-
--Child side 11 2J-11)' Fig. 1 4-Oka-pay 8--Issho-sei 9- The circuit also extends 10-11 Yoshu Euite, Fig. 2 Fig. 4 Fig. 5, f22j Ban
Claims (4)
第２の面との間に傾斜面を有する段部が形成され、かつ
、前記第１の面と傾斜面とが交わる領域に凹部を形成し
た枠体と、少なくとも２方向にリードを導出し、一方の
リードがディスプレイパネルの電極ピッチと同一である
半導体装置を搭載したフィルムキャリヤおよび端面に電
極を形成したディスプレイパネルとからなり、前記枠体
の傾斜面にフィルムキャリヤを配設せしめ、他方のリー
ドが前記第１の面に載置した回路基板に接合され、一方
のリードが前記弾性体上に設置されかつディスプレイパ
ネルの電極と圧接された事を特徴とするディスプレイパ
ネルの実装体。(1) A stepped portion having an inclined surface is formed between a first surface on which a circuit board is placed and a second surface on which an elastic body is placed, and the first surface and the inclined surface are A frame body with a recess formed in the intersecting area, a film carrier mounting a semiconductor device with leads led out in at least two directions, one of which has the same electrode pitch as the display panel, and a display panel with electrodes formed on the end surface. A film carrier is disposed on the inclined surface of the frame body, the other lead is bonded to the circuit board placed on the first surface, one lead is disposed on the elastic body, and a display panel is provided. A mounted display panel characterized in that it is in pressure contact with an electrode.
は、第１の面に載置した回路基板を傾斜面より離す事に
よって形成した凹部である事を特徴とする特許請求の範
囲第１項記載のディスプレイパネルの実装体。(2) A patent claim characterized in that the recess of the frame is formed in the frame itself or by separating the circuit board placed on the first surface from the inclined surface. A mounted body of the display panel according to scope 1.
を形成した事を特徴とする特許請求の範囲第１項記載の
ディスプレイパネルの実装体。(3) The display panel assembly according to claim 1, wherein a groove in which the film carrier is embedded is formed in the inclined surface of the frame.
ィルムキャリヤを配設する傾斜面に前記フィルムキャリ
ヤの孔と合致するピンを埋設した事を特徴とする特許請
求の範囲第１項記載のディスプレイパネルの実装体。(4) A hole is formed in the periphery of the film carrier, and a pin that matches the hole in the film carrier is embedded in the inclined surface of the frame body on which the film carrier is disposed. display panel implementation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60053132A JPS61210651A (en) | 1985-03-15 | 1985-03-15 | Mounting body of display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60053132A JPS61210651A (en) | 1985-03-15 | 1985-03-15 | Mounting body of display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61210651A true JPS61210651A (en) | 1986-09-18 |
| JPH0424857B2 JPH0424857B2 (en) | 1992-04-28 |
Family
ID=12934286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60053132A Granted JPS61210651A (en) | 1985-03-15 | 1985-03-15 | Mounting body of display panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61210651A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100553759B1 (en) | 2004-04-29 | 2006-02-20 | 삼성에스디아이 주식회사 | Plasma display apparatus |
| KR100554419B1 (en) * | 2003-12-10 | 2006-02-22 | 엘지전자 주식회사 | PDP Driving Device Including TCP Having New Structure |
| KR100627384B1 (en) | 2003-11-11 | 2006-09-21 | 삼성에스디아이 주식회사 | Plasma display apparatus having heat dissipating structure for driver ic |
-
1985
- 1985-03-15 JP JP60053132A patent/JPS61210651A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100627384B1 (en) | 2003-11-11 | 2006-09-21 | 삼성에스디아이 주식회사 | Plasma display apparatus having heat dissipating structure for driver ic |
| KR100554419B1 (en) * | 2003-12-10 | 2006-02-22 | 엘지전자 주식회사 | PDP Driving Device Including TCP Having New Structure |
| KR100553759B1 (en) | 2004-04-29 | 2006-02-20 | 삼성에스디아이 주식회사 | Plasma display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0424857B2 (en) | 1992-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |