JP3460330B2 - Imaging device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image device such as an LED head, a plasma head and an image sensor.

[0002]

2. Description of the Related Art The inventor has proposed an image device in which an image element array is sandwiched between two substrates (see, for example, Japanese Patent Application No.
-180613). In this image device, the cathode electrode of the image element array is die-bonded to the cathode substrate, and the anode electrode is flip-chip connected to the anode substrate. In this way, the connection of the cathode electrode can be processed by die bonding, and the connection of the anode electrode can be processed by flip-chip connection for a large number of electrodes at once. The present invention is a further improvement of the above-mentioned prior application.

[0003]

SUMMARY OF THE INVENTION The basic problems of the present invention are as follows: 1) The image element array is accurately positioned on the substrate by using the groove and the image element array is prevented from protruding from the substrate during flip chip connection. Easy chip connection, and 2) Flip chip connection after the image element array is housed in the groove, and there is no risk of the image element array falling or shifting due to the force applied from the substrate during flip chip connection. and, 3) provided with a slope on the side surface of the groove, the wide surface opening of the groove
And it is easy to mount the image sensor array in the groove.
In addition, it prevents the image element array from falling down during mounting, and 4) automatically absorbs the height variation of the image element array with solder.
And yield, 5) to facilitate directing the cathode wiring on the bottom surface of the groove
There is an advantage (claims 1 to 6).

[0004] Additional object of the present invention set forth in claim 2 and 3, 6) is to improve the positioning precision of the image array to the cathode wiring provided on the bottom surface of the groove. 7 ) An additional object of the invention of claim 5 is to facilitate electrical connection and mechanical coupling between the anode wiring board and the cathode wiring board. 8 ) An additional object of the invention of claim 6 is to accurately position and fix the cathode electrode of the image element array on the cathode wiring, and then connect the anode electrode to the anode wiring and connect the two inter-substrate connection wirings. Especially.

[0005]

According to the present invention, a cathode electrode is provided on each lower surface,
A plurality of image element arrays having a plurality of anode electrodes on the upper surface, and a plurality of rectangular shapes on the upper surface , on the long side surface.
A first substrate having a concave groove formed with an inclined surface and having cathode wiring extending from the bottom surface of each concave groove to the upper surface via the inclined surface ; and a second substrate having a plurality of anode wiring on the lower surface
A substrate, and a picture element in each groove of the first substrate.
The array is housed and the cathode electrode of the image element array is
To connect to the cathode wiring of the first board via solder
The surface of the anode electrode is led to the upper surface of the substrate.
So that it is substantially flush with the surface of the sword wire,
The anode electrode of the image element array housed and fixed in each groove is flip-chip connected to the anode wiring of the second substrate. Preferably, the cathode wiring in the bottom surface of the groove is formed of a plurality of islands and a connection wiring portion connecting the islands, or the cathode wiring in the bottom surface of the groove is a flat plate having a recess in the center. State Also like
In other words, the thickness of the solder between each cathode electrode and each cathode wiring is changed to position the anode electrode surface of each image element array on the same plane. Further, preferably, inter-substrate connection wiring is provided on each of the first substrate and the second substrate, and both inter-substrate connection wirings are connected. More preferably, the cathode wiring of the first substrate and the cathode electrode of the image element array are connected via solder, and the inter-substrate connection wiring provided on each of the first substrate and the second substrate is connected to the image element array. The cathode electrode and the cathode wiring of the first substrate are connected through solder having a melting point lower than that of the solder.

The image element array includes an LED array and a PLZ.
A T-array, a plasma array, a photocell array of an image sensor, or the like is used, and the cathode wiring provided on the bottom surface of the groove is composed of solder, gold bumps, or the like.

[0007]

According to the present invention, the image element array is housed in the groove, the cathode electrode is connected to the cathode wiring in the groove, and the anode electrode is flip-chip connected to the anode wiring of the second substrate. Therefore, the position of the array is positioned on the groove side, the surface of the anode electrode is substantially aligned with the upper surface of the first substrate, and flip chip connection is facilitated. (Claim 1
~ 6 ). Next, if the cathode wiring in the groove is formed in an island shape or a flat shape having a depression in the center, when attaching the cathode electrode of the image element array to the cathode wiring via solder,
The self-alignment effect of the solder allows the image element array to be attached to the cathode wiring at a predetermined position and a predetermined height (claims 2 and 3). Further, since at least one of the long side surfaces of the groove is formed as an inclined surface, the image element array can be easily accommodated in the groove, and the inclined surface can be used to connect the cathode wiring from the bottom of the groove to the upper surface of the first substrate. Can be derived to
There is no fear of disconnection. Further, since the cathode electrode is connected to the cathode wiring via the solder, it is possible to compensate the height variation of the image element array. The inclination angle of the inclined surface is preferably 60 degrees or less, and at this angle, the cathode wiring can be particularly easily led out, and the image element array can be housed particularly easily. When the solder layer between the cathode wiring and the cathode electrode is made variable, the height variation of the image element array is compensated, the height position of the anode electrode is aligned among a large number of image element arrays, and flip chip connection is facilitated. Further, inter-substrate connection wiring is provided on each of the first substrate and the second substrate, and by connecting them, the wiring provided on the two substrates can be connected and the two substrates can be mechanically joined (claim 5 ). If a solder with a lower melting point than the solder for connecting the cathode electrode and the cathode wiring is used for connecting the anode electrode and the anode wiring or between the wiring between the boards, the image element array is accurately positioned with respect to the cathode wiring. After that, the flip-chip connection between the anode electrode and the anode wiring and the inter-substrate connection wiring can be easily connected in one step (claim 6 ).

[0008]

Embodiments FIGS. 1 to 20 show an embodiment and its modification.
In FIG. 1, the LED array 2 is sandwiched between a cathode wiring board 4 which is a first substrate and an anode wiring board 6 which is a second substrate, and the LED array 2 is sandwiched between the cathode wiring board 4 and the cathode wiring board 4.
The state of being accommodated in the concave groove 8 provided in FIG. The LED array 2 has a length of about 5.4 mm and a width and a height of 30 each.
For example, 40 pieces are linearly arranged with a size of about 0 μm, and are separated one by one and mounted in the groove 8. Since the cathode wiring board 4 is preferably highly accurate, has a small coefficient of thermal expansion, and is excellent in heat resistance, a liquid crystal plastic board is used in the embodiment, but an inexpensive board such as a glass epoxy board may be used. The anode wiring substrate 6 is a transparent substrate, which is a glass substrate here, but the LED array 2 is mounted on a hard printed circuit board or the like.
It may be provided with a hole for taking out light from. 1
Reference numeral 0 denotes a cathode wiring in the groove 8, which is die-bonded to a cathode electrode (common electrode) on the bottom surface of the LED array 2 and is drawn out to the upper surface of the substrate 4 via the longitudinal side surface of the groove 8. Reference numeral 12 is a flip-chip connection portion between the anode electrode (individual electrode) of the LED array 2 and the anode wiring of the anode wiring board 6 via solder. Further, the substrates 4 and 6 are coupled to the inter-substrate connection wiring portions 14 and 16 in addition to the flip chip connection portion 12. The board-to-board connecting wirings 14 and 16 are 2 on the boards 4 and 6.
One wiring is connected by solder bumps etc.
Its function is to connect the wiring between the two substrates and mechanically connect the substrates 4 and 6. If the melting point of the solder bumps that connect the inter-substrate connection wirings 14 and 16 is set lower than that of the solder that connects the cathode electrodes of the LED array 2 and the cathode wirings of the cathode wiring substrate 4, the cathode electrodes and the cathode wirings. The connection wirings 14 and 16 between the two substrates can be connected to each other without causing a connection failure. LED
In addition to this, the head has 40 monocular lenses.
Although it corresponds to 1: 1 with the D array 2, it is omitted here.

FIG. 2 shows the structure of the concave groove 8. The bottom surface 20 of the groove is parallel to the top surface of the substrate 4, and its size is equal to or slightly larger than the bottom surface of the LED array 2. Long-side side surfaces 22 and 22 and short-side side surface 2 of the groove
4 and 24 are all slopes, and if the angle formed by the long-side slope 22 with respect to the bottom surface 20 is α and the angle formed by the short-side slope 24 with respect to the bottom surface 20 is β, then both are 60 degrees or less. Is preferable, and more preferably 30 to 60 degrees. As a result, the surface of the concave groove 8 becomes slightly larger than the array 2.

The long side surface of the concave groove 8 may be a vertical surface instead of the inclined surfaces 22 and 22, but if this is done, it will be L when mounted.
The ED array 2 easily falls. This mechanism is shown in FIG. If the side surface of the groove 8 is made vertical as shown by the imaginary line in the figure, the array 2 is easily caught by the edge of the side surface of the groove 8 and easily falls sideways. On the other hand, if the side surfaces of the concave groove 8 are inclined surfaces 22 and 22, the array 2 will not fall sideways when mounted. Next, if the two side surfaces in the short side direction are not inclined surfaces 24, 24, the array 2 rides on one edge as shown in FIG. 4, and mounting becomes difficult. Further, when the four side surfaces of the groove 8 are vertical and have almost the same size as the array 2, it is difficult to mount the long array 2 in the groove 8 itself. Further, the provision of the inclined surface 22 has a role of facilitating the provision of the cathode wiring 10 in the concave groove 8. For example, on a vertical side surface as shown by a chain line in FIG. Is easy to break.

Providing the slopes 22 and 24 in this manner has the meaning that the array 2 is easily mounted, in particular the array 2 is prevented from falling sideways, and the cathode wiring 10 is easily formed. In the embodiment, the four side surfaces of the concave groove 8 are all inclined surfaces 22 and 24, but only the two side surfaces of one of the long side and the short side of the concave groove 8 may be inclined. The range of 60 degrees or less with respect to the angle α and the angle β is empirically determined from the viewpoint that wiring is easy and the array 2 can be easily accommodated, and the range of 30 to 60 degrees is as small as possible. Was obtained on the condition that these objectives were achieved while using.

6 and 7 show details of the cathode wiring 10. In the figure, 26 is a liquid substance such as cream solder or flux, and a substance having a high surface tension is preferable. 28 is a light emitting body of the LED array 2, and 30 is a pad connected to the anode electrode of the light emitting body 28. Further, reference numeral 32 denotes a conductive frame plated with solder or the like, which surrounds the liquid substance 26 made of cream solder or flux as shown in FIG. Further, the slope 22 is covered with a solder layer.
The connection with the cathode electrode of the LED array 2 is performed by solder plating on the frame 32. When the height of the LED array 2 is large, the solder plating on the frame 32 escapes to the surroundings, and when the height is insufficient, the sloped surface is formed. Solder from the solder layer 22 is replenished between the frame 32 and the cathode electrode, and the height of the LED array 2 on the anode electrode side is aligned on the same plane. Reference numeral 33 is a wiring lead-out portion from the frame 32, and 35 is a cathode electrode on the bottom surface of the array 2. Here, there is no partition in the portion where the liquid substance 26 is arranged, but, for example, 1 is provided between the upper side and the lower side of the frame 32 in FIG.
Partitions or the like may be provided at 3 places. Cathode wiring 10
May be provided by a thin film process such as vacuum evaporation or sputtering, but a method that can be manufactured with low-cost equipment, that is, by applying photolithography technology and etching processing technology to copper foil attached to glass epoxy resin or plastic substrate. Frame 3 of cathode wiring formed by
2 is solder-plated. The solder plating applied to the frame 32 acts as a brazing material when the cathode electrodes of the array 2 are mounted on the frame 32. The liquid substance 26 such as cream solder or flux may be applied in the frame 32 by a dispenser or printing.

The liquid substance 26 has two functions, one of which is to prevent the array 2 from being turned over when the LED array 2 is mounted by a collet or the like. This point is shown in FIG. When the holding of the array 2 is stopped by the collet 34 and the array 2 is lowered, the cathode electrode 35 on the bottom surface first comes into contact with the liquid substance 26, and the posture is corrected and positioned by the surface tension of the liquid substance 26. Get on the frame 32. As a result, the LED array 2 can be mounted on the die mounter at a low cost and with a low accuracy in the previous stage of using self-alignment or the like by melting the solder.

The second action is to absorb the height variation of the array 2. This mechanism is shown in FIG. Reference numeral 25 is a solder layer provided on the slope 22, and 27 is solder replenished from the solder layer 25 onto the frame 32 when the height of the LED array 2 is small. 36 is a solder bump on the anode substrate 6 side, which is LE
The D array 2 has a height variation of, for example, about ± 20 μm. Such height variation hinders flip-chip connection between the pad 30 and the bump 36. Therefore, the slope 22 is plated with solder or the like, and when the height is low, the solder of the solder plating is supplied to adjust the height. Here, when the height of the array 2 is large as in the left side of FIG. 9, the liquid substance 26 escapes to the surroundings to sink the array 2, and the cathode electrode is coupled to the solder plating on the frame 32. When the height of the array 2 is small as shown in the right side of FIG. 9, solder is replenished from the surrounding solder layer 25 onto the frame 32, and the frame 32 and the cathode electrode 35 are bonded by the solder 27. Therefore, even if the LED array 2 has height variations, the surface heights of the array 2 are all 40.

In the embodiment, the self-alignment function works between the cathode electrode 35 and the cathode wiring 10, and the array 2 is soldered to the frame 32 at the correct position by the self-alignment function. That is, the liquid substance 26 and the array 2
The cathode electrode 35 and the frame 32 of FIG. 2 are familiar to each other, the cathode electrode 35 and the frame 32 are attracted to each other through the liquid substance 26, and the array 2 is soldered in the correct position with respect to the frame 32, and the array 2 is formed in the groove 8. The misalignment at the time when the 2 is first stored is automatically corrected by the self-alignment function of the liquid substance 26.

FIG. 10 shows a modified cathode wiring 40 in the groove 8. The cathode wiring 40 has a plurality of island portions 42.
And a connection wiring 43 that connects each island portion 42. The cathode wiring 40 includes a plurality of island portions 42 and each island portion 42.
And the connection wiring 43 for connecting the cathode electrode 35 of the LED array 2 to the frame 32.
When coupling through the upper solder, the cathode electrode 35 of the LED array 2 is bonded to the predetermined position of the cathode wiring 40 very accurately due to the self-alignment effect of the solder on the frame 32, whereby the cathode wiring 40 of the LED array 2 is joined. The joining position with respect to is accurate.

Returning now to FIG. 1, the board-to-board connection will be described. The connection is divided into two steps, that is, the frame 32 or the liquid substance 26 side and the anode wiring substrate 6 side, and the solder plating on the solder layer 25 or the frame 32 is a high melting point solder, and the solder bump 36 and the inter-substrate connection wirings 14 and 16 are formed. As the low melting point solder, the frame 2 is used in advance to accurately position and fix the array 2 with respect to the substrate 4,
After that, the anode wiring board 6 and the cathode wiring board 4 are bonded. That is, the array 2 fixed on the cathode wiring substrate 4 is flip-chip connected to the anode wiring substrate 6, and at the same time, the inter-substrate connection wiring portions 14 and 16 are connected. As a result, the connection accuracy between the substrates and the connection accuracy of the anode wiring can be improved, and they can be connected in one step. Further, here, the self-alignment effect of the inter-substrate connection wirings 14 and 16 and the self-alignment effect of the anode electrode 30 can be utilized.

11 to 15 show a modification of the concave groove 8.
The concave groove 50 of FIG. 11 has four sides vertical, and the reference surfaces 52 on both side surfaces.
And reference planes 54 at both ends are provided, and L is defined by these four reference planes.
The four end faces of the ED array 2 are positioned. In this case, LE
Although the workability of mounting the D array 2 in the concave groove 50 is slightly inferior, the LE for positioning the four end faces of the LED array 2 is used.
The mounting position of the D array 2 becomes extremely accurate.

The concave groove 56 shown in FIG. 12 has one side surface and one end surface perpendicular to the upper surface of the substrate 4 to form a side surface reference surface 58 and an end surface reference surface 60, and the other side surface and end surface as the inclined surface 2 described above.
It was set to 2,24. By doing so, disconnection of the lead-out portion 33 can be prevented, and mounting of the LED array 2 in the concave groove 56 becomes easier. Then, in positioning the array 2, reference planes 58 and 60 perpendicular to the upper surface of the substrate 4 are used.

For positioning the array 2, FIG. 13 and FIG.
The reference plate 62 shown in FIG.
A combination of the second concave groove 56 and the reference plate 62 is shown. The reference plate 62 is made of, for example, a stainless steel thin plate, and is accurately drilled by etching to form a reference surface 64. Then, the array 2 is housed in the groove 56 in the state of FIG. 14, the plate 62 is moved to the left side of the drawing, and the array 2 is positioned as shown in FIG. Therefore, the array 2 is positioned on the reference plane 58 and the reference plane 64.

FIG. 13 shows an example in which one of the long side surfaces of the concave groove 56 is a vertical reference plane 58, but as shown in FIG. 15, both long side surfaces are slopes 22 and 22, respectively. The groove 8 may be used. In this case, the array 2 is positioned in the groove 8 by the hole of the reference plate 63. Also, the reference plates 62, 6
3 may be removed after mounting the array 2 as necessary, or may be left as it is.

16 and 17 show the relationship between the substrates 4 and 6. In the figure, 70 is a cathode drive IC, 72 is an anode drive IC, and 74 is a cathode wiring. The anode wiring board 6 has an anode wiring 76 shown in FIG.
A base anode wiring 80 is provided under the insulating film 78. These wirings 76, 80 are connected by, for example, via holes,
The anode wiring is substantially a two-layer wiring. The board-to-board connecting wiring portions 14 and 16 are provided at four corners of the boards 4 and 6, for example. In this way, the cathode wiring 74 is provided on the substrate 4 and the anode wiring is provided on the substrate 6 as a two-layer wiring.
Similarly to the wirings 4 and 16, the wirings 74 and 76 may be connected via solder bumps or the like. Cathode drive IC7
0, the anode driving IC 72 is not particularly limited, but is housed in a groove provided in the substrate 4 similarly to the array 2, for example, the cathode driving IC 70 is flip-chip connected to the bump in the groove, and the anode driving IC 72 is Anode wiring 7
Flip chip connection to 6. Next, the wiring of the board 4 and LE
The D array 2 and the IC 72 are connected to the wiring on the substrate 6 side. Therefore, the connection between the substrates 4 and 6 and the flip chip connection of the array 2 and the IC 72 can be simultaneously performed.

FIG. 18 shows the connection between the cathode driving IC 70 and the LED array 2, and FIG. 19 shows the anode driving IC 72.
And LED array 2 are shown. In these figures, 82 is a through hole penetrating the substrate 4, 84 is a back surface cathode wiring on the back surface side of the substrate 4, and 86 and 88 are anode wirings. The 40 LED arrays 2 are divided into two parts on the left side. It is composed of two wirings 86 for the 20 arrays 2 and wirings 88 for the 20 arrays 2 on the right side. Wiring 84
Is omitted in FIG. For example, one cathode drive IC 70 is provided to drive 20 arrays 2, and one output terminal drives two arrays 2. Therefore, as shown in FIG. 19, two sets of anode wirings 86 and 88 are provided, two sets of anode driving ICs 72 are provided, and 20 LED arrays 2 are separately driven on the anode side. As a result, the number of cathode drive ICs 70 can be reduced from two to one. One of the characteristics of the wiring of FIG. 18 is that the lead-out portions 33 of the cathode wiring are located above and below the array 2, which corresponds to the arrangement of the lead-out portions 33 of FIGS. 6 and 7. The next characteristic is that the cathode wirings of substantially the same number are arranged on the two surfaces of the substrate 4. For example, in FIG.
Then, the number of backside wirings shown by broken lines is almost three, and the number of wirings on the upper surface side shown by solid lines is also almost three. By placing substantially the same number of wirings on the front and back of the substrate 4, the wiring width can be reduced and the width of the substrate 4 can be reduced. Also in FIG.
In the case of 10, the number of through holes 82 is 6 with respect to the LED array 2 shown by 10, and the number of through holes is small. Therefore, the width of the substrate 4 can be reduced and the number of through holes can be reduced. Note that for the wiring in FIG.
Wiring that does not use the through holes 82 at all as shown in FIG. 20 is also possible. In this case, the cathode wiring 90 is allowed to pass through the gap between the arrays 2 and 2, and the lead-out portions 33 are provided on both sides of the recessed groove 8, thereby making the through hole 82 unnecessary.

In the embodiment, the LED array is used as the image element array, but the invention is not limited to this.
It may be a T array, a plasma array, a photocell array of an image sensor, or the like. Further, the arrays 2 are mounted in the groove one by one, but two arrays 2 and 2 may be mounted in close contact with each other.

[0025]

EFFECTS OF THE INVENTION According to the present invention, 1) the image element array is housed in the groove so that the positioning is easy and the anode electrode side top surface of the array does not protrude from the groove, facilitating flip chip connection. 2) Since the image element array is housed in the groove for flip-chip connection, the image element array does not fall or shift during flip-chip connection . 3) A slope is provided on the long side surface of the groove. So the surface of the groove
Wide opening makes it easy to mount the image sensor array in the groove.
Also, the image element array does not fall down when mounted, and 4) the cathode wiring is disconnected between the groove and the upper surface of the substrate.
No, 5) to absorb the height variation of the image element array with solder, full
Facilitates lip tip connection (claims 1-6 ). Further, in the inventions of claims 2 and 3, 6) the cathode wiring in the groove is formed in an island shape or a flat shape having a depression in the central portion, so that the image element array can be accurately joined to a predetermined position of the cathode wiring. it can. 7 ) According to the invention of claim 5 , electrical connection and mechanical coupling between the anode wiring board and the cathode wiring board can be easily performed. 8 ) According to the invention of claim 6 , after the cathode electrode of the image element array is accurately positioned and fixed to the cathode wiring, the anode electrode can be connected to the anode wiring, and two inter-substrate connection wirings can be connected.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a main part of an image device according to an embodiment.

FIG. 2 is a perspective view showing a groove in the embodiment.

FIG. 3 is a cross-sectional view in the short side direction of a groove according to an embodiment.

FIG. 4 is a cross-sectional view in the long side direction of the groove in the example.

FIG. 5 is a cross-sectional view showing an electrode connection to a groove in the example.

FIG. 6 is a cross-sectional view showing the arrangement of cream solder in a groove in the example.

FIG. 7 is a plan view of a groove according to an embodiment.

FIG. 8 is a diagram showing mounting of an array and prevention of sideways falling in the embodiment.

FIG. 9 is a cross-sectional view showing that the height variation of the LED array is corrected by cream solder in the example.

FIG. 10 is a view showing a cathode electrode pattern on the bottom surface of a groove in a modified example.

FIG. 11 is a cross-sectional view of a groove according to a modification.

FIG. 12 is a perspective view of a groove of a modified example.

FIG. 13 is a diagram showing a reference plate in a modified example.

FIG. 14 is a diagram showing a positioning process by a reference plate in a modified example.

FIG. 15 is a sectional view of a modified example.

FIG. 16 is a perspective view showing a cathode electrode substrate and an anode electrode substrate in an example.

FIG. 17 is a cross-sectional view showing a state where the cathode electrode substrate and the anode electrode substrate are connected to each other by bump connection in the example.

FIG. 18 is a diagram showing the connection between the cathode drive IC and the LED array in the example.

FIG. 19 is a diagram showing the connection between the anode driving IC and the LED array in the example.

FIG. 20 is a diagram showing a connection between a cathode drive IC and an LED array in a modified example.

[Explanation of symbols]

2 LED Array 42 Solder Bump 4 Cathode Wiring Board 43 Connection Wiring Section 6 Anode Wiring Board 50 Recessed Groove 8 Recessed Grooves 52, 54 Reference Surface 10 Cathode Wiring in Recessed Groove 56 Recessed Groove 12 Flip Chip Connection 58, 60 Reference Surface 14 , 16 board-to-board connecting wiring part 62, 63 reference plate 20 bottom surface 64 reference surface 22, 24 slope 70 cathode driving IC 26 liquid substance 72 anode driving IC 28 light emitter 74 cathode wiring 30 pad 76 anode wiring 32 frame 78 insulating film 33 drawer Part 80 Base Anode Wiring 34 Collet 82 Through Hole 35 Cathode Electrode 84 Back Side Cathode Wiring 36 Bumps 86, 88 Anode Wiring 40 Cathode Wiring in Recessed Groove 90 Cathode Wiring

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H04N 1/036 (56) References JP-A-2-196476 (JP, A) JP-A-2-55159 (JP, A) Kaihei 2-278893 (JP, A) JP 4-87383 (JP, A) JP 2-34354 (JP, A) JP 64-42183 (JP, A) JP 61-110476 ( JP, A) JP 57-207076 (JP, A) JP 64-38266 (JP, A) JP 56-131977 (JP, A) JP 64-31658 (JP, A) Flat 1-68842 (JP, U) Actual development Sho 63-180249 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B41J 2/44 B41J 2/45 B41J 2/455 H01L 33 / 00 H04N 1/028 H04N 1/036

Claims (6)

(57) [Claims] 1. A plurality of image element arrays each having a cathode electrode on the lower surface and a plurality of anode electrodes on the upper surface, and a plurality of rectangular shapes on the upper surface, and inclined surfaces on the side surfaces on the long side.
By having a groove, and consists of a first substrate having a cathode wiring derived to the upper surface through the inclined surface from the bottom surface of the respective grooves, and a second substrate having a plurality of anode wires on the lower surface, An image element array is housed in each groove of the first substrate.
The cathode electrode of the image element array to the cathode of the first substrate.
By connecting to the lead wire via solder, the anode
Table of cathode wiring with the surface of the electrode led to the upper surface of the substrate
To be substantially coplanar with the surface, and each of the grooves
An image device in which an anode electrode of an image element array housed and fixed in a portion is flip-chip connected to an anode wiring of a second substrate. 2. The cathode wiring in the bottom surface of the groove is formed of a plurality of island portions and a connection wiring portion connecting the island portions,
The image device according to claim 1, wherein 3. The image device according to claim 1, wherein the cathode wiring in the bottom surface of the concave groove is formed in a flat plate shape having a recess in the central portion. 4. by varying the solder thickness between the cathode electrodes and the cathode wirings, the anode electrode surface of each picture element array was positioned on the same plane, to claim 1-3, characterized in The image device described. With wherein providing the inter-board connection wirings to each of the first substrate and the second substrate, an image apparatus according to claim 1-4 which is adapted to connect the connection wiring between the substrates. 6. The cathode wiring of the first substrate and the cathode electrode of the image element array are connected via solder, and the inter-substrate connection wiring provided on each of the first substrate and the second substrate is connected to the image element. The image device according to claim 5 , wherein the cathode electrode of the array and the cathode wiring of the first substrate are connected via solder having a melting point lower than that of the solder.