JPS6120758Y2 - - Google Patents

Info

Publication number
JPS6120758Y2
JPS6120758Y2 JP1980075049U JP7504980U JPS6120758Y2 JP S6120758 Y2 JPS6120758 Y2 JP S6120758Y2 JP 1980075049 U JP1980075049 U JP 1980075049U JP 7504980 U JP7504980 U JP 7504980U JP S6120758 Y2 JPS6120758 Y2 JP S6120758Y2
Authority
JP
Japan
Prior art keywords
lead
semiconductor element
sub
thin metal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980075049U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57945U (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980075049U priority Critical patent/JPS6120758Y2/ja
Publication of JPS57945U publication Critical patent/JPS57945U/ja
Application granted granted Critical
Publication of JPS6120758Y2 publication Critical patent/JPS6120758Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP1980075049U 1980-05-29 1980-05-29 Expired JPS6120758Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980075049U JPS6120758Y2 (OSRAM) 1980-05-29 1980-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980075049U JPS6120758Y2 (OSRAM) 1980-05-29 1980-05-29

Publications (2)

Publication Number Publication Date
JPS57945U JPS57945U (OSRAM) 1982-01-06
JPS6120758Y2 true JPS6120758Y2 (OSRAM) 1986-06-21

Family

ID=29437739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980075049U Expired JPS6120758Y2 (OSRAM) 1980-05-29 1980-05-29

Country Status (1)

Country Link
JP (1) JPS6120758Y2 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211638A (ja) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd 樹脂封止型半導体装置の製造方法

Also Published As

Publication number Publication date
JPS57945U (OSRAM) 1982-01-06

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