JPS61193855A - 紙基材合成樹脂積層板連続製造装置 - Google Patents

紙基材合成樹脂積層板連続製造装置

Info

Publication number
JPS61193855A
JPS61193855A JP60034868A JP3486885A JPS61193855A JP S61193855 A JPS61193855 A JP S61193855A JP 60034868 A JP60034868 A JP 60034868A JP 3486885 A JP3486885 A JP 3486885A JP S61193855 A JPS61193855 A JP S61193855A
Authority
JP
Japan
Prior art keywords
paper
drying
impregnated
paper base
dried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60034868A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0465784B2 (enExample
Inventor
文夫 山口
敏行 宮下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP60034868A priority Critical patent/JPS61193855A/ja
Publication of JPS61193855A publication Critical patent/JPS61193855A/ja
Publication of JPH0465784B2 publication Critical patent/JPH0465784B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Reinforced Plastic Materials (AREA)
JP60034868A 1985-02-22 1985-02-22 紙基材合成樹脂積層板連続製造装置 Granted JPS61193855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60034868A JPS61193855A (ja) 1985-02-22 1985-02-22 紙基材合成樹脂積層板連続製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60034868A JPS61193855A (ja) 1985-02-22 1985-02-22 紙基材合成樹脂積層板連続製造装置

Publications (2)

Publication Number Publication Date
JPS61193855A true JPS61193855A (ja) 1986-08-28
JPH0465784B2 JPH0465784B2 (enExample) 1992-10-21

Family

ID=12426135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60034868A Granted JPS61193855A (ja) 1985-02-22 1985-02-22 紙基材合成樹脂積層板連続製造装置

Country Status (1)

Country Link
JP (1) JPS61193855A (enExample)

Also Published As

Publication number Publication date
JPH0465784B2 (enExample) 1992-10-21

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