JPS6119110B2 - - Google Patents
Info
- Publication number
- JPS6119110B2 JPS6119110B2 JP5050881A JP5050881A JPS6119110B2 JP S6119110 B2 JPS6119110 B2 JP S6119110B2 JP 5050881 A JP5050881 A JP 5050881A JP 5050881 A JP5050881 A JP 5050881A JP S6119110 B2 JPS6119110 B2 JP S6119110B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plate
- suction
- adhesive
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 96
- 239000000853 adhesive Substances 0.000 claims description 36
- 230000001070 adhesive effect Effects 0.000 claims description 36
- 239000007921 spray Substances 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000000116 mitigating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 11
- 239000013078 crystal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- ZPDRQAVGXHVGTB-UHFFFAOYSA-N gallium;gadolinium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Gd+3] ZPDRQAVGXHVGTB-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5050881A JPS57166024A (en) | 1981-04-06 | 1981-04-06 | Bonding device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5050881A JPS57166024A (en) | 1981-04-06 | 1981-04-06 | Bonding device for wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57166024A JPS57166024A (en) | 1982-10-13 |
| JPS6119110B2 true JPS6119110B2 (US06566495-20030520-M00011.png) | 1986-05-15 |
Family
ID=12860894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5050881A Granted JPS57166024A (en) | 1981-04-06 | 1981-04-06 | Bonding device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57166024A (US06566495-20030520-M00011.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0429884B2 (US06566495-20030520-M00011.png) * | 1984-07-14 | 1992-05-20 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59101849A (ja) * | 1982-12-01 | 1984-06-12 | Tokyo Erekutoron Kk | 物品移送装置 |
-
1981
- 1981-04-06 JP JP5050881A patent/JPS57166024A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0429884B2 (US06566495-20030520-M00011.png) * | 1984-07-14 | 1992-05-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57166024A (en) | 1982-10-13 |
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