JPS57166024A - Bonding device for wafer - Google Patents

Bonding device for wafer

Info

Publication number
JPS57166024A
JPS57166024A JP5050881A JP5050881A JPS57166024A JP S57166024 A JPS57166024 A JP S57166024A JP 5050881 A JP5050881 A JP 5050881A JP 5050881 A JP5050881 A JP 5050881A JP S57166024 A JPS57166024 A JP S57166024A
Authority
JP
Japan
Prior art keywords
plate
wafers
adhesives
chamber
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5050881A
Other languages
Japanese (ja)
Other versions
JPS6119110B2 (en
Inventor
Shigeyuki Iiyama
Junji Watanabe
Masao Nishijima
Atsunobu Une
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP5050881A priority Critical patent/JPS57166024A/en
Publication of JPS57166024A publication Critical patent/JPS57166024A/en
Publication of JPS6119110B2 publication Critical patent/JPS6119110B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To bond the wafer onto a plate in high efficiency and with high accuracy by automating a series of processes of the spray coating of adhesives- evaporation and drying of a solvent-bonding of positioning. CONSTITUTION:When wafers are supplied onto a base 4 one by one from a carrier 2 by the plate 7, the carrier falls by one stage. The wafers are adsorbed to a plate 28 when a plate 26, which rises and falls by means of an air cyliner 22 and is turned and stopped at a predetermined position to a case 30, rises, and transported 18 to a spraying chamber 42. N2 And the adhesives are sprayed to the lower surfaces of the wafers from a nozzle 47 for a fixed time, the plate 26 is rotated, and N2 and the adhesives are applied. The wafers are pulled out 22 of the chamber 42, transported 18 to a chamber 58 and dried by an infrared lamp 59. The wafers are pulled out 22 again, and carried to a section just above an adhesive plate 63. The plate 26 is driven and turned and the adsorbing plate 28 is rested in the predetermined direction, the adhesive plate 63 is driven 65, and the adhesive plate 63 is positioned to the wafers 3 by utilizing a dividing plate 60. An adsorbing mechanism C is dropped, the wafers are pressure-welded by utilizing the pressure of a spring in the case 30, and adsorption is released after adhesion. Said work is repeated.
JP5050881A 1981-04-06 1981-04-06 Bonding device for wafer Granted JPS57166024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5050881A JPS57166024A (en) 1981-04-06 1981-04-06 Bonding device for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5050881A JPS57166024A (en) 1981-04-06 1981-04-06 Bonding device for wafer

Publications (2)

Publication Number Publication Date
JPS57166024A true JPS57166024A (en) 1982-10-13
JPS6119110B2 JPS6119110B2 (en) 1986-05-15

Family

ID=12860894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5050881A Granted JPS57166024A (en) 1981-04-06 1981-04-06 Bonding device for wafer

Country Status (1)

Country Link
JP (1) JPS57166024A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101849A (en) * 1982-12-01 1984-06-12 Tokyo Erekutoron Kk Article carrier

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124886A (en) * 1984-07-14 1986-02-03 Hitachi Constr Mach Co Ltd Warmup device for pilot operating circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101849A (en) * 1982-12-01 1984-06-12 Tokyo Erekutoron Kk Article carrier

Also Published As

Publication number Publication date
JPS6119110B2 (en) 1986-05-15

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