JPS59101849A - Article carrier - Google Patents
Article carrierInfo
- Publication number
- JPS59101849A JPS59101849A JP21176682A JP21176682A JPS59101849A JP S59101849 A JPS59101849 A JP S59101849A JP 21176682 A JP21176682 A JP 21176682A JP 21176682 A JP21176682 A JP 21176682A JP S59101849 A JPS59101849 A JP S59101849A
- Authority
- JP
- Japan
- Prior art keywords
- endless belt
- strut
- carrier
- endless
- belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Control Of Conveyors (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は半導体の製造工程に用いられる物品移送装置
に関し、ウェハを処理する各工程のプロセスチェンバへ
のウェハの収納に際しての移送を正確かつ迅速に行うこ
とのできる物品移送装置を提供せんとするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an article transfer device used in a semiconductor manufacturing process, and an article transfer device that can accurately and quickly transfer wafers when storing them in a process chamber in each step of processing wafers. The aim is to provide the equipment.
従来、半導体ウェハの加工工程においては、化学的及び
物理的な表面処理、フォトリングラフ処理におけるフォ
１〜レジスト塗布および現像等が何回となく行われる。Conventionally, in the processing of semiconductor wafers, chemical and physical surface treatments, photolithographic processing, photoresist coating, development, etc. are performed many times.
この各工程はそれぞれのプロセスチャンバを組合わせて
製造ラインを構成し、製造ラインは全体をクリーンルー
ム（無塵室）に収納している。上記製造ラインにおける
各プロセスチャンバには、ウェハの収納やピンクアップ
及び移送を行う付属装置が付設されているが、従来はベ
ル１へその他によるコンベア方式の付属装置が通例で、
この装置は必ず摺動部分を有しており、その摺動部分か
ら発生する塵芥がウェハに付着して回路的に悪影響を及
ぼすという欠点があった。Each process consists of a manufacturing line by combining the respective process chambers, and the entire manufacturing line is housed in a clean room (dust-free room). Each process chamber in the above manufacturing line is equipped with an attached device for storing, pinking up, and transferring wafers, but conventionally, it has been customary to use a conveyor-type attached device with a bell 1 and others.
This device always has a sliding portion, and the drawback is that dust generated from the sliding portion adheres to the wafer and adversely affects the circuit.
また上記装置においては、また生産速度を向上させるた
めの各プロセスチャンバにおける収納、ピックアップ及
び移送速度の向上という要求に対応できない。Moreover, the above-mentioned apparatus cannot meet the demand for increasing the storage, pick-up and transfer speeds in each process chamber in order to increase the production speed.
そこで本発明は、半導体製造工程における自動化装置の
高速化に適した物品移送装置を提供せんとするもので、
駆動機構を持つ一対のプーリ間に張設されたエンドレス
ベルトと、エンドレスベルトの外周部分を挟着するベル
トクリップを付設し、かつウェイトセンサを備えた支柱
と、支柱の上面に散設したキャリアステーションと、支
柱を下部で支承するとともに上記エンドレスベルトに牽
引されて回動する基台と、この基台の回動を規制するエ
ンドレスガイドとを有することを特徴とするものである
。Therefore, the present invention aims to provide an article transfer device suitable for increasing the speed of automated equipment in semiconductor manufacturing processes.
An endless belt stretched between a pair of pulleys with a drive mechanism, a support that is equipped with a belt clip that clamps the outer periphery of the endless belt and a weight sensor, and carrier stations scattered on the top of the support. The present invention is characterized in that it has a base that supports the column at its lower part and is rotated by being pulled by the endless belt, and an endless guide that restricts the rotation of the base.
以下図面に基いて本発明の物品移送装置の一実施例を説
明すると、／はモータＪにより駆動される一対のプーリ
４間に張設されたエンドレスベルトである。このエンド
レスベルト／には所定の間隔でキャリアステーションダ
が８個設置しである。キャリアステーションダは、スプ
リング６を外嵌し、基台７上に昇降自在に支承された支
柱乙上面に散設されている。この支柱乙の側方に突設し
たベルトクリップ８は５締着バンド部６２／で支柱乙に
固着され、その上面に取付けた挟持片、、２．．２によ
って上記エンドレスベルト／の外周部分を挟着する。そ
の内周部分にはかからないため、エンドレスベルトｌは
プーリーをスムーズに通過する。An embodiment of the article transfer device of the present invention will be described below with reference to the drawings. / is an endless belt stretched between a pair of pulleys 4 driven by a motor J. Eight carrier stations are installed on this endless belt at predetermined intervals. The carrier stationers are fitted with springs 6 and are scattered on the upper surface of a support column 7 supported on a base 7 so as to be movable up and down. The belt clip 8 protruding from the side of the support post B is fixed to the support post B with 5 fastening band portions 62/, and a clamping piece attached to the upper surface thereof, 2. ．． 2, the outer peripheral portion of the endless belt is clamped. The endless belt l passes through the pulley smoothly because it does not cover the inner circumference of the pulley.
支柱乙はまたウェイトセンサ？を備えており、このウェ
イトセンサ２は昇降自在の支柱乙下端に装着した可動部
／／と、この可動部／／がら所定の間隔で設置された受
光センサ／、２とよりなり、キャリアステーショングの
搭載により可動部／／上下面固設した反射面／３の接近
を受光センサ／、２で検知してマニピュレータ等に送信
する。Is pillar B also a weight sensor? The weight sensor 2 consists of a movable part // attached to the lower end of the support column which can be raised and lowered, and a light receiving sensor /, 2 installed at a predetermined interval from this movable part //. By mounting the movable part //, the approach of the reflective surface /3 fixed on the upper and lower surfaces is detected by the light receiving sensor /, 2 and transmitted to the manipulator etc.
上記基台７は、支柱乙を支承するとともに上記エンドレ
スベルト／に牽引され、基台７の動きを規制するエンド
レスガイド／、５に沿って回動するガイドローラ／ｌを
有する。このエンドレスガイド／６は、エンドレスベル
ト／よりやや小径にしてエンドレスベルト／を緊張させ
る。The base 7 supports the column B and has an endless guide / 5 which is pulled by the endless belt / and which restricts the movement of the base 7 , and a guide roller / l which rotates along the guide roller / 5 . This endless guide 6 has a slightly smaller diameter than the endless belt and tensions the endless belt.
／乙はエンドレスベルト／のテンションボルトである。/B is the tension bolt of the endless belt/.
次に本発明の物品移送装置３３の作用について説明する
。物品移送装置３３はロボットハンド３／と通常一対で
用いられる。ロボットハンド３／は、化学的及び物理的
な表面処理、フォトリソグラフ処理におけるフォトレジ
スト塗布および現像等を行うプロセスチェンバ３２に並
設される。移送装置３３にウェハキャリア３Ｉ、ｔを搭
載している状態において、ロボットハンド３／は所定位
置にあるキャリア３ダを把持してピックアップし、プロ
セスチェンバ３ｄに送り込む。その後ウェハ処理の済ん
だキャリア３１Ｉをロボットハンド３／でピックアップ
し、移送装置３３に戻す。Next, the operation of the article transfer device 33 of the present invention will be explained. The article transfer device 33 is usually used in pair with the robot hand 3/. The robot hands 3/ are arranged in parallel in a process chamber 32 that performs chemical and physical surface treatment, photoresist coating and development in photolithography processing, and the like. When the wafer carriers 3I, t are loaded on the transfer device 33, the robot hand 3/ grasps and picks up the carrier 3D at a predetermined position, and sends it into the process chamber 3d. Thereafter, the carrier 31I after wafer processing is picked up by the robot hand 3/ and returned to the transfer device 33.
このプロセスチェンバ３，２へのウェハの収納、ピック
アップ及び移送の際に、ロボットハンド３／と連動する
物品移送装置３３の動作について説明する。キャリア３
１Ｉが上記移送装置３３のキャリアステーションダ上に
おいて、所定の位置にきたとき、位置センサ（図示せず
）ロボットハンド３／を作動してキャリア３ダをピック
アップし、プロセスチェンバ３フへキャリア３１を搭載
する。物品移送装置３３内の上記キャリアステーション
ダに処理後のキャリア３ダが戻った際、センサラが作動
してモータ３を駆動させ、エンドレスベルト／を回動し
て上記キャリアステーションダを次の位置に送出する。The operation of the article transfer device 33 in conjunction with the robot hand 3 will be described when storing, picking up, and transferring wafers to the process chambers 3 and 2. career 3
When the carrier 1I reaches a predetermined position on the carrier station dam of the transfer device 33, the position sensor (not shown) operates the robot hand 3/ to pick up the carrier 3da and transfer the carrier 31 to the process chamber 3f. Mount. When the processed carrier 3 returns to the carrier station in the article transfer device 33, the sensor is activated to drive the motor 3, rotate the endless belt, and move the carrier station to the next position. Send.
この発明の物品移送装置は以上のように構成したので、
種々の半導体製造工程における半導体ウェハの移送等の
ためのハンドリングに好適に使用され、プロセスチェン
バ３．２へのウェハの収納、ピックアップ及び移送をロ
ボットハンド３１と共働し、キャリア３１Ｉの姿勢を制
御しながら正確に移送することができる。Since the article transfer device of the present invention is configured as described above,
It is suitably used for handling such as transferring semiconductor wafers in various semiconductor manufacturing processes, and works together with the robot hand 31 to store, pick up, and transfer wafers to the process chamber 3.2, and controls the attitude of the carrier 31I. can be transferred accurately.
また、エンドレスベルト／の動作時には、ベルトクリッ
プ８とプーリｄとの摺擦部分をなくしたため、ウェハ上
への塵芥の散逸を防止でき、しかもスムーズにキャリア
を搬送するので位置ずれがほとんどなく、ロボットハン
ド３／と併用することにより半導体製造装置におけるキ
ャリアの操作性を飛躍的に向上させることができた。In addition, during the operation of the endless belt, there is no rubbing part between the belt clip 8 and the pulley d, which prevents dust from dissipating onto the wafer.Moreover, the carrier is conveyed smoothly, so there is almost no positional deviation, and the robot hand By using it in combination with 3/, it was possible to dramatically improve the operability of carriers in semiconductor manufacturing equipment.
図面は本発明の物品移送装置の一実施例を示し、第１図
はその斜視図、第２図はセンサンの斜視図、第３図はベ
ルトクリップ８の斜視図、第４図は物品移送装置３３を
プロセスチェンバ３−２へ設備した状態の斜視図である
。
／９１．エンドレスベルト
−１０，プーリ ３・・・モーラダ９９．キヤ
リアステーシヨン
乙１２．支柱 ７９０．基台８００．ベルト
クリップン９０．ウェイトセンサ／／、、、可動部
／、２．、、センサ／ 、５．、、エンドレスガイ
ドThe drawings show an embodiment of the article transfer device of the present invention, in which FIG. 1 is a perspective view thereof, FIG. 2 is a perspective view of a sensor, FIG. 3 is a perspective view of a belt clip 8, and FIG. 4 is a perspective view of an article transfer device 33. FIG. 3 is a perspective view of a state in which the apparatus is installed in a process chamber 3-2. /91. Endless belt-10, pulley 3... Morada 99. Carrier Station Otsu12. Pillar 790. Base 800. Belt clip 90. Weight sensor //,,,, moving part
/, 2. ,,sensor/ ,5. ,, endless guide
Claims (1)
レスベルトと、エンドレスベルトの外周部分を挟着する
ベルトクリップを付設し、かつウェイ１−センサを備え
た支柱と、支柱の上面に散設したキャリアステーション
と、支柱を下部で支承するとともに上記エンドレスベル
トに牽引されて回動する基台と、この基台の回動を規制
するエンドレスガイドとを有することを特徴とする物品
移送装置。 ２、ウェイトセンサが、昇降自在の支柱下端に装着した
可動部と、この可動部から所定の間隔で設置されたセン
サとよりなる特許請求の範囲第１項記載の物品移送装置
。[Scope of Claims] 1. An endless belt stretched between a pair of pulleys having a drive mechanism, a support that is attached with a belt clip that clamps the outer circumference of the endless belt, and is equipped with a way 1 sensor; It is characterized by having carrier stations scattered on the upper surface of the column, a base that supports the column at the bottom and rotates by being pulled by the endless belt, and an endless guide that restricts the rotation of the base. Equipment for transporting goods. 2. The article transfer device according to claim 1, wherein the weight sensor comprises a movable part attached to the lower end of a column that can be raised and lowered, and a sensor installed at a predetermined interval from the movable part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21176682A JPS59101849A (en) | 1982-12-01 | 1982-12-01 | Article carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21176682A JPS59101849A (en) | 1982-12-01 | 1982-12-01 | Article carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59101849A true JPS59101849A (en) | 1984-06-12 |
Family
ID=16611224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21176682A Pending JPS59101849A (en) | 1982-12-01 | 1982-12-01 | Article carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101849A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100932812B1 (en) | 2005-09-14 | 2009-12-21 | 어플라이드 머티어리얼스, 인코포레이티드 | Method and apparatus for band-to-band transfer module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166024A (en) * | 1981-04-06 | 1982-10-13 | Nippon Telegr & Teleph Corp <Ntt> | Bonding device for wafer |
-
1982
- 1982-12-01 JP JP21176682A patent/JPS59101849A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166024A (en) * | 1981-04-06 | 1982-10-13 | Nippon Telegr & Teleph Corp <Ntt> | Bonding device for wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100932812B1 (en) | 2005-09-14 | 2009-12-21 | 어플라이드 머티어리얼스, 인코포레이티드 | Method and apparatus for band-to-band transfer module |
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