JPS56107878A - Grinder - Google Patents

Grinder

Info

Publication number
JPS56107878A
JPS56107878A JP569680A JP569680A JPS56107878A JP S56107878 A JPS56107878 A JP S56107878A JP 569680 A JP569680 A JP 569680A JP 569680 A JP569680 A JP 569680A JP S56107878 A JPS56107878 A JP S56107878A
Authority
JP
Japan
Prior art keywords
wafer
lapping
carrier
lap plate
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP569680A
Other languages
Japanese (ja)
Inventor
Takashi Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP569680A priority Critical patent/JPS56107878A/en
Publication of JPS56107878A publication Critical patent/JPS56107878A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve working efficiency by automating loadings and unloadings of wafers to a grinder. CONSTITUTION:When a web 12 is held into a holding hole 13 of a carrier 11 at the loading position P, it is carried to a lapped position R by intermittent movements of the carrier in the endless structure 11, namely onto the upper side of a lower lap plate 16. Then, an upper lap plate 15 comes down, it tucks the wafer 12 between with the lower lap plate 16, whereby the wafer 12 is applied the determined surface pressure. After that, while lapping compound is being supplied upon the lapping portion, lapping is done by turning the upper and lower lap plates 15, 16 in the same direction for a determined lapse of time. When the lapping is over, the upper lap plate 15 is sent up, again the carrier 11 makes its intermittent movements and carries the wafer 12 to the unloading position Q. At said position Q, the wafer 12 is moved onto a chute part 24, and after it is stopped by a stopper 25, it is held into a cartridge 26 by a pusher 27.
JP569680A 1980-01-23 1980-01-23 Grinder Pending JPS56107878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP569680A JPS56107878A (en) 1980-01-23 1980-01-23 Grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP569680A JPS56107878A (en) 1980-01-23 1980-01-23 Grinder

Publications (1)

Publication Number Publication Date
JPS56107878A true JPS56107878A (en) 1981-08-27

Family

ID=11618259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP569680A Pending JPS56107878A (en) 1980-01-23 1980-01-23 Grinder

Country Status (1)

Country Link
JP (1) JPS56107878A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100554U (en) * 1982-12-27 1984-07-06 スピ−ドフアム株式会社 Surface grinding device
US4566499A (en) * 1983-11-24 1986-01-28 Mitsubishi Rayon Co., Ltd. Jacquard mechanism
JPS6158057U (en) * 1984-09-20 1986-04-18

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100554U (en) * 1982-12-27 1984-07-06 スピ−ドフアム株式会社 Surface grinding device
JPS6234691Y2 (en) * 1982-12-27 1987-09-03
US4566499A (en) * 1983-11-24 1986-01-28 Mitsubishi Rayon Co., Ltd. Jacquard mechanism
JPS6158057U (en) * 1984-09-20 1986-04-18
JPH0224608Y2 (en) * 1984-09-20 1990-07-05

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