JPS61190139U - - Google Patents
Info
- Publication number
- JPS61190139U JPS61190139U JP1985074451U JP7445185U JPS61190139U JP S61190139 U JPS61190139 U JP S61190139U JP 1985074451 U JP1985074451 U JP 1985074451U JP 7445185 U JP7445185 U JP 7445185U JP S61190139 U JPS61190139 U JP S61190139U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- resin
- concave
- reinforced
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910000833 kovar Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案実施例の断面図、第２図は従来
例の断面図である。
第１図と第２図において、１１はパツケージ本
体、１２はコバールリング、１３はキヤツプ、１
４は半導体チツプ、１５はワイヤ、１７は樹脂で
ある。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. In Figures 1 and 2, 11 is the package body, 12 is the Kovar ring, 13 is the cap, 1
4 is a semiconductor chip, 15 is a wire, and 17 is a resin.
Claims (1)
よつて封止された半導体パツケージにおいて、 キヤツプ１３の凹部に埋めた樹脂１７によつて
キヤツプ１３を補強してなることを特徴とする半
導体装置。[Claims for Utility Model Registration] A semiconductor package in which a cap 13 with a concave center is sealed by a seam weld, characterized in that the cap 13 is reinforced with resin 17 filled in the concave part of the cap 13. semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985074451U JPS61190139U (en) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985074451U JPS61190139U (en) | 1985-05-20 | 1985-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190139U true JPS61190139U (en) | 1986-11-27 |
Family
ID=30614761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985074451U Pending JPS61190139U (en) | 1985-05-20 | 1985-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190139U (en) |
-
1985
- 1985-05-20 JP JP1985074451U patent/JPS61190139U/ja active Pending