JPS61185527A - 硬化性エポキシ樹脂組成物 - Google Patents

硬化性エポキシ樹脂組成物

Info

Publication number
JPS61185527A
JPS61185527A JP60025574A JP2557485A JPS61185527A JP S61185527 A JPS61185527 A JP S61185527A JP 60025574 A JP60025574 A JP 60025574A JP 2557485 A JP2557485 A JP 2557485A JP S61185527 A JPS61185527 A JP S61185527A
Authority
JP
Japan
Prior art keywords
epoxy resin
component
silicone gel
parts
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60025574A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0511125B2 (ko
Inventor
Yoshiji Morita
好次 森田
Hiroshi Matsuoka
松岡　博史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Priority to JP60025574A priority Critical patent/JPS61185527A/ja
Publication of JPS61185527A publication Critical patent/JPS61185527A/ja
Publication of JPH0511125B2 publication Critical patent/JPH0511125B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP60025574A 1985-02-13 1985-02-13 硬化性エポキシ樹脂組成物 Granted JPS61185527A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60025574A JPS61185527A (ja) 1985-02-13 1985-02-13 硬化性エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60025574A JPS61185527A (ja) 1985-02-13 1985-02-13 硬化性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61185527A true JPS61185527A (ja) 1986-08-19
JPH0511125B2 JPH0511125B2 (ko) 1993-02-12

Family

ID=12169695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60025574A Granted JPS61185527A (ja) 1985-02-13 1985-02-13 硬化性エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61185527A (ko)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63145323A (ja) * 1986-12-09 1988-06-17 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPH01113453A (ja) * 1987-10-27 1989-05-02 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH01163257A (ja) * 1987-09-11 1989-06-27 Polyplastics Co 低応力封止材
JPH01299816A (ja) * 1988-05-26 1989-12-04 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH02170821A (ja) * 1988-12-23 1990-07-02 Matsushita Electric Works Ltd エポキシ樹脂組成物
FR2648466A1 (fr) * 1989-06-15 1990-12-21 Saint Gobain Isover Produit composite a base de fibres minerales, utile pour la fabrication de pieces moulees
EP0506046A2 (en) * 1991-03-26 1992-09-30 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Fixing device and heat roller therefor
EP0707042A1 (en) 1994-10-07 1996-04-17 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same
WO1996028496A1 (fr) * 1995-03-14 1996-09-19 Nagase-Ciba Ltd. Derive d'organopolysiloxane
WO2012020067A1 (de) * 2010-08-10 2012-02-16 Schwering & Hasse Elektrodraht Gmbh Elektroisolierlacke aus modifizierten polymeren und daraus hergestellte elektrische leiter mit verbesserter gleitfähigkeit
JP2014162877A (ja) * 2013-02-26 2014-09-08 Kyocera Chemical Corp 光半導体ケース成形用樹脂組成物及び光半導体用ケース
JP2015000887A (ja) * 2013-06-13 2015-01-05 パナソニック株式会社 酸素透過性の熱硬化性エポキシ樹脂組成物とそれを用いた電子機器
JP2022080638A (ja) * 2020-11-18 2022-05-30 信越化学工業株式会社 シリコーンハイブリッド樹脂組成物、及び半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614556A (en) * 1979-07-13 1981-02-12 Hitachi Ltd Curing method of thermosetting resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614556A (en) * 1979-07-13 1981-02-12 Hitachi Ltd Curing method of thermosetting resin composition

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63145323A (ja) * 1986-12-09 1988-06-17 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPH0689224B2 (ja) * 1987-09-11 1994-11-09 ポリプラスチックス株式会社 低応力封止材
JPH01163257A (ja) * 1987-09-11 1989-06-27 Polyplastics Co 低応力封止材
JPH01113453A (ja) * 1987-10-27 1989-05-02 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH01299816A (ja) * 1988-05-26 1989-12-04 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH02170821A (ja) * 1988-12-23 1990-07-02 Matsushita Electric Works Ltd エポキシ樹脂組成物
FR2648466A1 (fr) * 1989-06-15 1990-12-21 Saint Gobain Isover Produit composite a base de fibres minerales, utile pour la fabrication de pieces moulees
US5420392A (en) * 1991-03-26 1995-05-30 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Fixing device and heat roller therefor
US5362943A (en) * 1991-03-26 1994-11-08 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Fixing device and heat roller therefor
EP0506046A3 (ko) * 1991-03-26 1994-04-13 Kanegafuchi Chemical Ind
EP0506046A2 (en) * 1991-03-26 1992-09-30 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Fixing device and heat roller therefor
EP0769731A3 (en) * 1991-03-26 1997-07-16 Kanegafuchi Chemical Ind Heating roller for a fixing device
EP0707042A1 (en) 1994-10-07 1996-04-17 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same
WO1996028496A1 (fr) * 1995-03-14 1996-09-19 Nagase-Ciba Ltd. Derive d'organopolysiloxane
US5844053A (en) * 1995-03-14 1998-12-01 Nagase-Ciba, Ltd. Organo-polysiloxane derivartives
WO2012020067A1 (de) * 2010-08-10 2012-02-16 Schwering & Hasse Elektrodraht Gmbh Elektroisolierlacke aus modifizierten polymeren und daraus hergestellte elektrische leiter mit verbesserter gleitfähigkeit
US9944823B2 (en) 2010-08-10 2018-04-17 Schwering & Hasse Elektrodraht Gmbh Electrical insulation enamels composed of modified polymers and electrical conductors produced therefrom and having improved sliding capacity
JP2014162877A (ja) * 2013-02-26 2014-09-08 Kyocera Chemical Corp 光半導体ケース成形用樹脂組成物及び光半導体用ケース
JP2015000887A (ja) * 2013-06-13 2015-01-05 パナソニック株式会社 酸素透過性の熱硬化性エポキシ樹脂組成物とそれを用いた電子機器
JP2022080638A (ja) * 2020-11-18 2022-05-30 信越化学工業株式会社 シリコーンハイブリッド樹脂組成物、及び半導体装置

Also Published As

Publication number Publication date
JPH0511125B2 (ko) 1993-02-12

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