JPS61185527A - 硬化性エポキシ樹脂組成物 - Google Patents
硬化性エポキシ樹脂組成物Info
- Publication number
- JPS61185527A JPS61185527A JP60025574A JP2557485A JPS61185527A JP S61185527 A JPS61185527 A JP S61185527A JP 60025574 A JP60025574 A JP 60025574A JP 2557485 A JP2557485 A JP 2557485A JP S61185527 A JPS61185527 A JP S61185527A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- component
- silicone gel
- parts
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 43
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 43
- 239000000203 mixture Substances 0.000 title claims abstract description 26
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 40
- 239000010419 fine particle Substances 0.000 claims abstract description 7
- 230000035515 penetration Effects 0.000 claims abstract description 7
- 230000000704 physical effect Effects 0.000 claims description 3
- 239000002075 main ingredient Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 239000000565 sealant Substances 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
- 239000000499 gel Substances 0.000 description 26
- -1 siloxane moiety Chemical group 0.000 description 15
- 239000000047 product Substances 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229920001971 elastomer Polymers 0.000 description 8
- 239000000806 elastomer Substances 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- UALAKBZSBJIXBP-UHFFFAOYSA-N 1-phenylethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)(O)C1=CC=CC=C1 UALAKBZSBJIXBP-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60025574A JPS61185527A (ja) | 1985-02-13 | 1985-02-13 | 硬化性エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60025574A JPS61185527A (ja) | 1985-02-13 | 1985-02-13 | 硬化性エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61185527A true JPS61185527A (ja) | 1986-08-19 |
| JPH0511125B2 JPH0511125B2 (enrdf_load_stackoverflow) | 1993-02-12 |
Family
ID=12169695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60025574A Granted JPS61185527A (ja) | 1985-02-13 | 1985-02-13 | 硬化性エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61185527A (enrdf_load_stackoverflow) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63145323A (ja) * | 1986-12-09 | 1988-06-17 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPH01113453A (ja) * | 1987-10-27 | 1989-05-02 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| JPH01163257A (ja) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | 低応力封止材 |
| JPH01299816A (ja) * | 1988-05-26 | 1989-12-04 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| JPH02170821A (ja) * | 1988-12-23 | 1990-07-02 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| FR2648466A1 (fr) * | 1989-06-15 | 1990-12-21 | Saint Gobain Isover | Produit composite a base de fibres minerales, utile pour la fabrication de pieces moulees |
| EP0506046A3 (enrdf_load_stackoverflow) * | 1991-03-26 | 1994-04-13 | Kanegafuchi Chemical Ind | |
| EP0707042A1 (en) | 1994-10-07 | 1996-04-17 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same |
| WO1996028496A1 (fr) * | 1995-03-14 | 1996-09-19 | Nagase-Ciba Ltd. | Derive d'organopolysiloxane |
| WO2012020067A1 (de) * | 2010-08-10 | 2012-02-16 | Schwering & Hasse Elektrodraht Gmbh | Elektroisolierlacke aus modifizierten polymeren und daraus hergestellte elektrische leiter mit verbesserter gleitfähigkeit |
| JP2014162877A (ja) * | 2013-02-26 | 2014-09-08 | Kyocera Chemical Corp | 光半導体ケース成形用樹脂組成物及び光半導体用ケース |
| JP2015000887A (ja) * | 2013-06-13 | 2015-01-05 | パナソニック株式会社 | 酸素透過性の熱硬化性エポキシ樹脂組成物とそれを用いた電子機器 |
| JP2022080638A (ja) * | 2020-11-18 | 2022-05-30 | 信越化学工業株式会社 | シリコーンハイブリッド樹脂組成物、及び半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5614556A (en) * | 1979-07-13 | 1981-02-12 | Hitachi Ltd | Curing method of thermosetting resin composition |
-
1985
- 1985-02-13 JP JP60025574A patent/JPS61185527A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5614556A (en) * | 1979-07-13 | 1981-02-12 | Hitachi Ltd | Curing method of thermosetting resin composition |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63145323A (ja) * | 1986-12-09 | 1988-06-17 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPH01163257A (ja) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | 低応力封止材 |
| JPH01113453A (ja) * | 1987-10-27 | 1989-05-02 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| JPH01299816A (ja) * | 1988-05-26 | 1989-12-04 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| JPH02170821A (ja) * | 1988-12-23 | 1990-07-02 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| FR2648466A1 (fr) * | 1989-06-15 | 1990-12-21 | Saint Gobain Isover | Produit composite a base de fibres minerales, utile pour la fabrication de pieces moulees |
| US5420392A (en) * | 1991-03-26 | 1995-05-30 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Fixing device and heat roller therefor |
| US5362943A (en) * | 1991-03-26 | 1994-11-08 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Fixing device and heat roller therefor |
| EP0506046A3 (enrdf_load_stackoverflow) * | 1991-03-26 | 1994-04-13 | Kanegafuchi Chemical Ind | |
| EP0769731A3 (en) * | 1991-03-26 | 1997-07-16 | Kanegafuchi Chemical Ind | Heating roller for a fixing device |
| EP0707042A1 (en) | 1994-10-07 | 1996-04-17 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same |
| WO1996028496A1 (fr) * | 1995-03-14 | 1996-09-19 | Nagase-Ciba Ltd. | Derive d'organopolysiloxane |
| US5844053A (en) * | 1995-03-14 | 1998-12-01 | Nagase-Ciba, Ltd. | Organo-polysiloxane derivartives |
| WO2012020067A1 (de) * | 2010-08-10 | 2012-02-16 | Schwering & Hasse Elektrodraht Gmbh | Elektroisolierlacke aus modifizierten polymeren und daraus hergestellte elektrische leiter mit verbesserter gleitfähigkeit |
| US9944823B2 (en) | 2010-08-10 | 2018-04-17 | Schwering & Hasse Elektrodraht Gmbh | Electrical insulation enamels composed of modified polymers and electrical conductors produced therefrom and having improved sliding capacity |
| JP2014162877A (ja) * | 2013-02-26 | 2014-09-08 | Kyocera Chemical Corp | 光半導体ケース成形用樹脂組成物及び光半導体用ケース |
| JP2015000887A (ja) * | 2013-06-13 | 2015-01-05 | パナソニック株式会社 | 酸素透過性の熱硬化性エポキシ樹脂組成物とそれを用いた電子機器 |
| JP2022080638A (ja) * | 2020-11-18 | 2022-05-30 | 信越化学工業株式会社 | シリコーンハイブリッド樹脂組成物、及び半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0511125B2 (enrdf_load_stackoverflow) | 1993-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |