JPS61183572U - - Google Patents
Info
- Publication number
- JPS61183572U JPS61183572U JP5831786U JP5831786U JPS61183572U JP S61183572 U JPS61183572 U JP S61183572U JP 5831786 U JP5831786 U JP 5831786U JP 5831786 U JP5831786 U JP 5831786U JP S61183572 U JPS61183572 U JP S61183572U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive layer
- lead terminal
- terminal
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は従来の電子部品実装装置の平面図、第
２図は同装置の要部断面図、第３図は本考案にか
かる電子部品実装装置の要部断面図、第４図は第
３図のＡ―Ａ′線における切断第２図である。
１；ベースフイルム、２；ホツトメタル接着剤
、３；電子部品、４；部品端子、５；配線基板、
６；基板接続端子、７；導電性接着層。
FIG. 1 is a plan view of a conventional electronic component mounting apparatus, FIG. 2 is a cross-sectional view of a main part of the same apparatus, FIG. 3 is a cross-sectional view of a main part of an electronic component mounting apparatus according to the present invention, and FIG. FIG. 2 is a cross-sectional view taken along line AA' in the figure. 1; base film, 2; hot metal adhesive, 3; electronic component, 4; component terminal, 5; wiring board,
6; board connection terminal; 7; conductive adhesive layer.
Claims (1)
品のリード端子を配線基板上の電極端子に圧着固
定し、上記電子部品のリード端子と配線基板ん電
極端子を電気的に接続するものにおいて、上記ベ
ースフイルムと上記電子部品のリード端子間に介
在された導電性接着層を有し、該導電性接着層が
上記電子部品のリード端子と直接接続される上記
電極端子以外の延長部にも接着されており、且つ
上記ベースフイルムを上記電極端子間の絶縁基板
上に接着層を介して接着させてなる電子部品の実
装装置。 A base film having an adhesive layer is used to crimp and fix a lead terminal of an electronic component to an electrode terminal on a wiring board, and electrically connects the lead terminal of the electronic component and the electrode terminal of the wiring board. and a conductive adhesive layer interposed between the lead terminal of the electronic component, and the conductive adhesive layer is also adhered to an extension part other than the electrode terminal that is directly connected to the lead terminal of the electronic component. , and an electronic component mounting device, wherein the base film is adhered to an insulating substrate between the electrode terminals via an adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5831786U JPS61183572U (en) | 1986-04-17 | 1986-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5831786U JPS61183572U (en) | 1986-04-17 | 1986-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183572U true JPS61183572U (en) | 1986-11-15 |
Family
ID=30583707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5831786U Pending JPS61183572U (en) | 1986-04-17 | 1986-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183572U (en) |
-
1986
- 1986-04-17 JP JP5831786U patent/JPS61183572U/ja active Pending
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