JPS61182738A - ウエハのフリ−サイズチヤツク機構 - Google Patents

ウエハのフリ−サイズチヤツク機構

Info

Publication number
JPS61182738A
JPS61182738A JP60020973A JP2097385A JPS61182738A JP S61182738 A JPS61182738 A JP S61182738A JP 60020973 A JP60020973 A JP 60020973A JP 2097385 A JP2097385 A JP 2097385A JP S61182738 A JPS61182738 A JP S61182738A
Authority
JP
Japan
Prior art keywords
chuck
wafer
porous ceramic
water
chuck mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60020973A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0246331B2 (enExample
Inventor
Kazuo Kobayashi
一雄 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibayama Kikai Co Ltd
Original Assignee
Shibayama Kikai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibayama Kikai Co Ltd filed Critical Shibayama Kikai Co Ltd
Priority to JP60020973A priority Critical patent/JPS61182738A/ja
Publication of JPS61182738A publication Critical patent/JPS61182738A/ja
Publication of JPH0246331B2 publication Critical patent/JPH0246331B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Jigs For Machine Tools (AREA)
JP60020973A 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構 Granted JPS61182738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60020973A JPS61182738A (ja) 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60020973A JPS61182738A (ja) 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構

Publications (2)

Publication Number Publication Date
JPS61182738A true JPS61182738A (ja) 1986-08-15
JPH0246331B2 JPH0246331B2 (enExample) 1990-10-15

Family

ID=12042109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60020973A Granted JPS61182738A (ja) 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構

Country Status (1)

Country Link
JP (1) JPS61182738A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332538A (ja) * 1989-06-28 1991-02-13 Disco Abrasive Syst Ltd ユニバーサルチャックテーブル
JPH0332537A (ja) * 1989-06-28 1991-02-13 Disco Abrasive Syst Ltd ユニバーサルチャックテーブル
JPH04192523A (ja) * 1990-11-27 1992-07-10 Nec Corp シリコン基板の研磨装置および研磨方法
JPH081464A (ja) * 1992-06-17 1996-01-09 Shibayama Kikai Kk ユニバーサルチャック機構の自動切換装置
US6280308B1 (en) 1999-07-09 2001-08-28 Tokyo Seimitsu Co., Ltd. Wafer suction pad
JP2003059872A (ja) * 2001-08-17 2003-02-28 Disco Abrasive Syst Ltd 研削装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164549A (en) * 1980-05-23 1981-12-17 Disco Abrasive Sys Ltd Mounting method by positioning
JPS58180026A (ja) * 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> ウエハ研磨用吸着板
JPS5930631A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 吸着保持装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164549A (en) * 1980-05-23 1981-12-17 Disco Abrasive Sys Ltd Mounting method by positioning
JPS58180026A (ja) * 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> ウエハ研磨用吸着板
JPS5930631A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 吸着保持装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332538A (ja) * 1989-06-28 1991-02-13 Disco Abrasive Syst Ltd ユニバーサルチャックテーブル
JPH0332537A (ja) * 1989-06-28 1991-02-13 Disco Abrasive Syst Ltd ユニバーサルチャックテーブル
JPH04192523A (ja) * 1990-11-27 1992-07-10 Nec Corp シリコン基板の研磨装置および研磨方法
JPH081464A (ja) * 1992-06-17 1996-01-09 Shibayama Kikai Kk ユニバーサルチャック機構の自動切換装置
US6280308B1 (en) 1999-07-09 2001-08-28 Tokyo Seimitsu Co., Ltd. Wafer suction pad
JP2003059872A (ja) * 2001-08-17 2003-02-28 Disco Abrasive Syst Ltd 研削装置

Also Published As

Publication number Publication date
JPH0246331B2 (enExample) 1990-10-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term