JPS61181820A - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物Info
- Publication number
- JPS61181820A JPS61181820A JP2010385A JP2010385A JPS61181820A JP S61181820 A JPS61181820 A JP S61181820A JP 2010385 A JP2010385 A JP 2010385A JP 2010385 A JP2010385 A JP 2010385A JP S61181820 A JPS61181820 A JP S61181820A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- compound
- epoxy resin
- epoxy
- chlorine content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004593 Epoxy Substances 0.000 claims abstract description 16
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 16
- 239000000460 chlorine Substances 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 229920003986 novolac Polymers 0.000 claims abstract description 10
- -1 diisocyanate compound Chemical class 0.000 claims abstract description 8
- 239000005011 phenolic resin Substances 0.000 claims abstract description 6
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 230000001588 bifunctional effect Effects 0.000 claims description 12
- 239000012948 isocyanate Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 abstract description 14
- 239000011347 resin Substances 0.000 abstract description 14
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 abstract description 8
- 230000009477 glass transition Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 7
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 abstract description 6
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 abstract 1
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 11
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000002329 infrared spectrum Methods 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 235000014036 Castanea Nutrition 0.000 description 1
- 241001070941 Castanea Species 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- QPJDMGCKMHUXFD-UHFFFAOYSA-N cyanogen chloride Chemical compound ClC#N QPJDMGCKMHUXFD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010385A JPS61181820A (ja) | 1985-02-06 | 1985-02-06 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010385A JPS61181820A (ja) | 1985-02-06 | 1985-02-06 | 熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61181820A true JPS61181820A (ja) | 1986-08-14 |
| JPH0521133B2 JPH0521133B2 (enExample) | 1993-03-23 |
Family
ID=12017775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010385A Granted JPS61181820A (ja) | 1985-02-06 | 1985-02-06 | 熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61181820A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09278867A (ja) * | 1996-04-10 | 1997-10-28 | Toto Kasei Co Ltd | エポキシ樹脂組成物 |
| US6225377B1 (en) | 1992-07-17 | 2001-05-01 | Siemens Aktiengesellschaft | Blending epoxy resin-polyisocyanate-filler mixture and phenolic resin-filler mixture for molding |
| JP2002308965A (ja) * | 2001-04-13 | 2002-10-23 | Asahi Kasei Epoxy Kk | オキサゾリドン環含有エポキシ樹脂 |
| JP2002322241A (ja) * | 2001-04-26 | 2002-11-08 | Dainippon Ink & Chem Inc | 難燃性エポキシ樹脂組成物 |
| JP2002332326A (ja) * | 2001-05-09 | 2002-11-22 | Asahi Kasei Epoxy Kk | 変性エポキシ樹脂およびその製造方法 |
| JP2011503259A (ja) * | 2007-10-31 | 2011-01-27 | ダウ グローバル テクノロジーズ インコーポレイティド | 融着エポキシ樹脂用の非焼結イソシアネート改質エポキシ樹脂 |
| KR20160018726A (ko) | 2013-07-08 | 2016-02-17 | 아사히 가세이 케미칼즈 가부시키가이샤 | 개질된 수지 및 수지 조성물 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5048100A (enExample) * | 1973-08-31 | 1975-04-28 | ||
| JPS5626926A (en) * | 1979-08-10 | 1981-03-16 | Toshiba Corp | Epoxy resin molding material for sealing electronic part |
-
1985
- 1985-02-06 JP JP2010385A patent/JPS61181820A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5048100A (enExample) * | 1973-08-31 | 1975-04-28 | ||
| JPS5626926A (en) * | 1979-08-10 | 1981-03-16 | Toshiba Corp | Epoxy resin molding material for sealing electronic part |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6225377B1 (en) | 1992-07-17 | 2001-05-01 | Siemens Aktiengesellschaft | Blending epoxy resin-polyisocyanate-filler mixture and phenolic resin-filler mixture for molding |
| JPH09278867A (ja) * | 1996-04-10 | 1997-10-28 | Toto Kasei Co Ltd | エポキシ樹脂組成物 |
| JP2002308965A (ja) * | 2001-04-13 | 2002-10-23 | Asahi Kasei Epoxy Kk | オキサゾリドン環含有エポキシ樹脂 |
| JP2002322241A (ja) * | 2001-04-26 | 2002-11-08 | Dainippon Ink & Chem Inc | 難燃性エポキシ樹脂組成物 |
| JP2002332326A (ja) * | 2001-05-09 | 2002-11-22 | Asahi Kasei Epoxy Kk | 変性エポキシ樹脂およびその製造方法 |
| JP2011503259A (ja) * | 2007-10-31 | 2011-01-27 | ダウ グローバル テクノロジーズ インコーポレイティド | 融着エポキシ樹脂用の非焼結イソシアネート改質エポキシ樹脂 |
| KR20160018726A (ko) | 2013-07-08 | 2016-02-17 | 아사히 가세이 케미칼즈 가부시키가이샤 | 개질된 수지 및 수지 조성물 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521133B2 (enExample) | 1993-03-23 |
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