JPS61177754A - 樹脂封止形半導体装置 - Google Patents

樹脂封止形半導体装置

Info

Publication number
JPS61177754A
JPS61177754A JP60018361A JP1836185A JPS61177754A JP S61177754 A JPS61177754 A JP S61177754A JP 60018361 A JP60018361 A JP 60018361A JP 1836185 A JP1836185 A JP 1836185A JP S61177754 A JPS61177754 A JP S61177754A
Authority
JP
Japan
Prior art keywords
thermal stress
semiconductor
pellet
plated
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60018361A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0353780B2 (cg-RX-API-DMAC10.html
Inventor
Masanori Nakatsuka
中司　正憲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60018361A priority Critical patent/JPS61177754A/ja
Publication of JPS61177754A publication Critical patent/JPS61177754A/ja
Publication of JPH0353780B2 publication Critical patent/JPH0353780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/20—
    • H10W72/00—
    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07636—
    • H10W72/07651—
    • H10W72/60—
    • H10W74/00—
    • H10W90/736—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60018361A 1985-01-31 1985-01-31 樹脂封止形半導体装置 Granted JPS61177754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60018361A JPS61177754A (ja) 1985-01-31 1985-01-31 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60018361A JPS61177754A (ja) 1985-01-31 1985-01-31 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPS61177754A true JPS61177754A (ja) 1986-08-09
JPH0353780B2 JPH0353780B2 (cg-RX-API-DMAC10.html) 1991-08-16

Family

ID=11969552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60018361A Granted JPS61177754A (ja) 1985-01-31 1985-01-31 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPS61177754A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007214219A (ja) * 2006-02-08 2007-08-23 Hitachi Ltd 半導体装置
US7964492B2 (en) 2005-08-31 2011-06-21 Hitachi, Ltd. Semiconductor device and automotive AC generator

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5252650B2 (ja) * 2009-06-22 2013-07-31 日本インター株式会社 パワー半導体モジュールの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7964492B2 (en) 2005-08-31 2011-06-21 Hitachi, Ltd. Semiconductor device and automotive AC generator
US8421232B2 (en) 2005-08-31 2013-04-16 Hitachi, Ltd. Semiconductor device and automotive ac generator
JP2007214219A (ja) * 2006-02-08 2007-08-23 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0353780B2 (cg-RX-API-DMAC10.html) 1991-08-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term