JPH0376578B2 - - Google Patents

Info

Publication number
JPH0376578B2
JPH0376578B2 JP56200980A JP20098081A JPH0376578B2 JP H0376578 B2 JPH0376578 B2 JP H0376578B2 JP 56200980 A JP56200980 A JP 56200980A JP 20098081 A JP20098081 A JP 20098081A JP H0376578 B2 JPH0376578 B2 JP H0376578B2
Authority
JP
Japan
Prior art keywords
conductive material
copper
plate
conductive
refractory material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56200980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58102532A (ja
Inventor
Keizo Tani
Kenichi Muramoto
Yutaka Tomizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56200980A priority Critical patent/JPS58102532A/ja
Publication of JPS58102532A publication Critical patent/JPS58102532A/ja
Publication of JPH0376578B2 publication Critical patent/JPH0376578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/255—
    • H10W72/884—
    • H10W90/734—

Landscapes

  • Die Bonding (AREA)
JP56200980A 1981-12-15 1981-12-15 半導体装置 Granted JPS58102532A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56200980A JPS58102532A (ja) 1981-12-15 1981-12-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56200980A JPS58102532A (ja) 1981-12-15 1981-12-15 半導体装置

Publications (2)

Publication Number Publication Date
JPS58102532A JPS58102532A (ja) 1983-06-18
JPH0376578B2 true JPH0376578B2 (cg-RX-API-DMAC10.html) 1991-12-05

Family

ID=16433508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56200980A Granted JPS58102532A (ja) 1981-12-15 1981-12-15 半導体装置

Country Status (1)

Country Link
JP (1) JPS58102532A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089935A (ja) * 1983-10-21 1985-05-20 Hitachi Ltd 半導体装置
JP3445511B2 (ja) * 1998-12-10 2003-09-08 株式会社東芝 絶縁基板、その製造方法およびそれを用いた半導体装置
JP3852858B1 (ja) 2005-08-16 2006-12-06 株式会社日立製作所 半導体放射線検出器、放射線検出モジュールおよび核医学診断装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
JPS55128837A (en) * 1979-03-28 1980-10-06 Nec Corp Base for mounting semiconductor chip

Also Published As

Publication number Publication date
JPS58102532A (ja) 1983-06-18

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