JPS6117595B2 - - Google Patents

Info

Publication number
JPS6117595B2
JPS6117595B2 JP54099315A JP9931579A JPS6117595B2 JP S6117595 B2 JPS6117595 B2 JP S6117595B2 JP 54099315 A JP54099315 A JP 54099315A JP 9931579 A JP9931579 A JP 9931579A JP S6117595 B2 JPS6117595 B2 JP S6117595B2
Authority
JP
Japan
Prior art keywords
film
cutting
coat
cut
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54099315A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5624112A (en
Inventor
Yoshitake Oka
Tetsuo Ishihara
Masane Suzuki
Motonori Kanetani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Priority to JP9931579A priority Critical patent/JPS5624112A/ja
Priority to US06/174,065 priority patent/US4323757A/en
Publication of JPS5624112A publication Critical patent/JPS5624112A/ja
Publication of JPS6117595B2 publication Critical patent/JPS6117595B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1438—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for directional control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP9931579A 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate Granted JPS5624112A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9931579A JPS5624112A (en) 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate
US06/174,065 US4323757A (en) 1979-08-03 1980-07-31 Method for cutting specific layer of synthetic resin laminated film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9931579A JPS5624112A (en) 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate

Publications (2)

Publication Number Publication Date
JPS5624112A JPS5624112A (en) 1981-03-07
JPS6117595B2 true JPS6117595B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-05-08

Family

ID=14244197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9931579A Granted JPS5624112A (en) 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate

Country Status (2)

Country Link
US (1) US4323757A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5624112A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4486645A (en) * 1980-07-03 1984-12-04 Armour Food Company Process for removing packaging materials from packaged products
US4553016A (en) * 1982-06-09 1985-11-12 Ube Industries, Ltd. Elongated non-metallic sheet having a metal embedded therein or attached thereon
JPS60255293A (ja) * 1984-05-31 1985-12-16 Mitsui Toatsu Chem Inc レ−ザ−光による塗膜切断方法
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
JPS63172636A (ja) * 1987-12-24 1988-07-16 十條製紙株式会社 紙容器に開口用切り込みを形成する方法
US4987287A (en) * 1989-05-12 1991-01-22 Prevent-A-Crime International, Inc. Method of making a stencil for etching glass
US5151572A (en) * 1989-05-12 1992-09-29 Prevent-A-Crime International, Inc. Method of making a stencil for etching glass
EP0734325B1 (en) * 1993-12-17 1997-12-29 Minnesota Mining And Manufacturing Company Ablative imaging by proximity lithography
US6191382B1 (en) * 1998-04-02 2001-02-20 Avery Dennison Corporation Dynamic laser cutting apparatus
US5997985A (en) * 1998-09-10 1999-12-07 Northrop Grumman Corporation Method of forming acoustic attenuation chambers using laser processing of multi-layered polymer films
US6205160B1 (en) 1998-09-24 2001-03-20 Branson Ultrasonics Corporation Laser diode array
US7396493B2 (en) * 2002-05-21 2008-07-08 3M Innovative Properties Company Multilayer optical film with melt zone to control delamination
US20030218278A1 (en) * 2002-05-21 2003-11-27 Tait Bruce E. Method for subdividing multilayer optical film cleanly and rapidly
US6991695B2 (en) * 2002-05-21 2006-01-31 3M Innovative Properties Company Method for subdividing multilayer optical film cleanly and rapidly
JP4595378B2 (ja) * 2004-04-28 2010-12-08 住友電気工業株式会社 樹脂加工方法
JP4580444B2 (ja) * 2006-09-27 2010-11-10 芝浦メカトロニクス株式会社 フィルムカット装置及びフィルムカット方法
JP5399942B2 (ja) * 2010-02-22 2014-01-29 パナソニック株式会社 樹脂シートのカット方法
SG191244A1 (en) 2010-12-30 2013-07-31 3M Innovative Properties Co Apparatus and method for laser cutting using a support member having a gold facing layer
TWI567116B (zh) * 2011-07-26 2017-01-21 Univ Niigata Method for manufacturing fine particles
CN107824974A (zh) * 2016-09-14 2018-03-23 3M创新有限公司 交通标志制作方法及系统
US20210162547A1 (en) * 2018-08-20 2021-06-03 Zeon Corporation Manufacturing method of cut film, cut film, and film for cut film

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3262122A (en) * 1963-05-01 1966-07-19 Ibm Thermoplastic memory
US3435186A (en) * 1964-02-20 1969-03-25 Ibm Selective piercing and machining of sheet material
US3629546A (en) * 1969-04-02 1971-12-21 American Can Co Air-cooled laser processing of materials
US3668028A (en) * 1970-06-10 1972-06-06 Du Pont Method of making printing masks with high energy beams
US3909582A (en) * 1971-07-19 1975-09-30 American Can Co Method of forming a line of weakness in a multilayer laminate
US3790744A (en) * 1971-07-19 1974-02-05 American Can Co Method of forming a line of weakness in a multilayer laminate
US3889272A (en) * 1974-05-30 1975-06-10 Bell Telephone Labor Inc Metal film recording media for laser writing

Also Published As

Publication number Publication date
US4323757A (en) 1982-04-06
JPS5624112A (en) 1981-03-07

Similar Documents

Publication Publication Date Title
JPS6117595B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3001816B2 (ja) Ｎｄ：ＹＡＧレーザを使用するガラス上へのレーザスクライビング
CA2134926C (en) Method and apparatus for ablative processing of elastomeric products
WO1999012695A1 (en) Method of laser scribing a glass microsheet and scribed microsheet
KR20060043383A (ko) 3차원 개구 형성 필름
JPH11186189A5 (ja) レーザ照射装置及び半導体装置の作製方法
CA2009088A1 (en) Optical recording medium, optical recording method and optical recording device used in method
US5068514A (en) Laser polishing of lens surface
JPH0577068A (ja) 物品の図形パターン作成方法
JPH0632922A (ja) 光透過材料の高エネルギー光を用いた加工方法
JPS63220991A (ja) 光加工方法
JPH10319221A (ja) 光学素子及び光学素子の製造方法
JPH09141480A (ja) アブレーション加工方法
US20200039004A1 (en) Cutting device for cutting composite material
JPH1164614A (ja) 光学素子及び光学素子の製造方法
JPH08318390A (ja) アブレーションデブリス除去装置
JPH07117230A (ja) インク噴射装置のノズルプレート製造方法
JP3513025B2 (ja) 透明容器へのマーキング方法
JP2549864B2 (ja) 写真印画紙用支持体
JPH05222225A (ja) 塗膜層を有する成形品
JP4137495B2 (ja) レーザーマーキング方法及び感光材料
JPH07164175A (ja) レーザ加工装置
JPH05228682A (ja) パルスレーザ光を用いた材料加工方法
JPH10314965A (ja) 光加工装置および光加工方法
JP2003251937A (ja) マーキング方法、マーキング装置及び感光材料