JPS6117140B2 - - Google Patents

Info

Publication number
JPS6117140B2
JPS6117140B2 JP55125154A JP12515480A JPS6117140B2 JP S6117140 B2 JPS6117140 B2 JP S6117140B2 JP 55125154 A JP55125154 A JP 55125154A JP 12515480 A JP12515480 A JP 12515480A JP S6117140 B2 JPS6117140 B2 JP S6117140B2
Authority
JP
Japan
Prior art keywords
bonding
distance
bonding pad
pellet
points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55125154A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5749242A (en
Inventor
Kyoto Hirase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP55125154A priority Critical patent/JPS5749242A/ja
Publication of JPS5749242A publication Critical patent/JPS5749242A/ja
Publication of JPS6117140B2 publication Critical patent/JPS6117140B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P74/00—
    • H10W72/075—

Landscapes

  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Wire Bonding (AREA)
JP55125154A 1980-09-09 1980-09-09 Wire bonding device Granted JPS5749242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55125154A JPS5749242A (en) 1980-09-09 1980-09-09 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55125154A JPS5749242A (en) 1980-09-09 1980-09-09 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS5749242A JPS5749242A (en) 1982-03-23
JPS6117140B2 true JPS6117140B2 (enExample) 1986-05-06

Family

ID=14903203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55125154A Granted JPS5749242A (en) 1980-09-09 1980-09-09 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5749242A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102747A (ja) * 1984-10-26 1986-05-21 Marine Instr Co Ltd ワイヤ−ボンダ−の認識パタ−ン変更方法
JP2569821B2 (ja) * 1989-08-30 1997-01-08 三菱電機株式会社 半導体装置の認識装置およびその認識方法
KR100460047B1 (ko) * 2001-09-21 2004-12-04 주식회사 칩팩코리아 반도체패키지의 본딩검사방법
US6787392B2 (en) * 2002-09-09 2004-09-07 Semiconductor Components Industries, L.L.C. Structure and method of direct chip attach

Also Published As

Publication number Publication date
JPS5749242A (en) 1982-03-23

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