JPS61163696A - 多層回路基板 - Google Patents
多層回路基板Info
- Publication number
- JPS61163696A JPS61163696A JP375985A JP375985A JPS61163696A JP S61163696 A JPS61163696 A JP S61163696A JP 375985 A JP375985 A JP 375985A JP 375985 A JP375985 A JP 375985A JP S61163696 A JPS61163696 A JP S61163696A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- circuit board
- multilayer circuit
- crystallized glass
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 239000011521 glass Substances 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000002241 glass-ceramic Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 8
- 238000010298 pulverizing process Methods 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 2
- 238000000227 grinding Methods 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- -1 TaN Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Glass Compositions (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP375985A JPS61163696A (ja) | 1985-01-11 | 1985-01-11 | 多層回路基板 |
| US07/320,796 US4943470A (en) | 1985-01-11 | 1989-03-09 | Ceramic substrate for electrical devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP375985A JPS61163696A (ja) | 1985-01-11 | 1985-01-11 | 多層回路基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5000109A Division JPH0732312B2 (ja) | 1993-01-04 | 1993-01-04 | 多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61163696A true JPS61163696A (ja) | 1986-07-24 |
| JPH0416039B2 JPH0416039B2 (enrdf_load_stackoverflow) | 1992-03-19 |
Family
ID=11566101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP375985A Granted JPS61163696A (ja) | 1985-01-11 | 1985-01-11 | 多層回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61163696A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147395A (ja) * | 1986-12-10 | 1988-06-20 | 日本特殊陶業株式会社 | 高密度配線多層基板の製造法 |
| JPS63265493A (ja) * | 1987-04-23 | 1988-11-01 | Fujitsu Ltd | 多層セラミツク基板 |
| WO2024253132A1 (ja) * | 2023-06-07 | 2024-12-12 | 日本板硝子株式会社 | ガラス組成物、ガラス繊維、及びガラスフィラー |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS599992A (ja) * | 1982-07-08 | 1984-01-19 | 株式会社日立製作所 | 多層配線基板の製造方法 |
| JPS61111598A (ja) * | 1984-10-13 | 1986-05-29 | 富士通株式会社 | ガラスセラミツクス多層基板の製造方法 |
-
1985
- 1985-01-11 JP JP375985A patent/JPS61163696A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS599992A (ja) * | 1982-07-08 | 1984-01-19 | 株式会社日立製作所 | 多層配線基板の製造方法 |
| JPS61111598A (ja) * | 1984-10-13 | 1986-05-29 | 富士通株式会社 | ガラスセラミツクス多層基板の製造方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147395A (ja) * | 1986-12-10 | 1988-06-20 | 日本特殊陶業株式会社 | 高密度配線多層基板の製造法 |
| JPS63265493A (ja) * | 1987-04-23 | 1988-11-01 | Fujitsu Ltd | 多層セラミツク基板 |
| WO2024253132A1 (ja) * | 2023-06-07 | 2024-12-12 | 日本板硝子株式会社 | ガラス組成物、ガラス繊維、及びガラスフィラー |
| JP7659709B1 (ja) * | 2023-06-07 | 2025-04-09 | 日本板硝子株式会社 | ガラス組成物、ガラス繊維、及びガラスフィラー |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416039B2 (enrdf_load_stackoverflow) | 1992-03-19 |
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