JPS61154137A - テストプロ−ブ組立体 - Google Patents
テストプロ−ブ組立体Info
- Publication number
- JPS61154137A JPS61154137A JP27577784A JP27577784A JPS61154137A JP S61154137 A JPS61154137 A JP S61154137A JP 27577784 A JP27577784 A JP 27577784A JP 27577784 A JP27577784 A JP 27577784A JP S61154137 A JPS61154137 A JP S61154137A
- Authority
- JP
- Japan
- Prior art keywords
- probes
- probe
- holes
- plates
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 74
- 239000000615 nonconductor Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 239000010453 quartz Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012811 non-conductive material Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 240000008620 Fagopyrum esculentum Species 0.000 description 1
- 235000009419 Fagopyrum esculentum Nutrition 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27577784A JPS61154137A (ja) | 1984-12-27 | 1984-12-27 | テストプロ−ブ組立体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27577784A JPS61154137A (ja) | 1984-12-27 | 1984-12-27 | テストプロ−ブ組立体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61154137A true JPS61154137A (ja) | 1986-07-12 |
| JPH0515067B2 JPH0515067B2 (en:Method) | 1993-02-26 |
Family
ID=17560253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27577784A Granted JPS61154137A (ja) | 1984-12-27 | 1984-12-27 | テストプロ−ブ組立体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61154137A (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63262850A (ja) * | 1987-04-21 | 1988-10-31 | Tokyo Electron Ltd | プロ−ブカ−ド |
| JPH01276073A (ja) * | 1988-04-28 | 1989-11-06 | Tokyo Electron Ltd | プローブ装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS561314U (en:Method) * | 1979-06-18 | 1981-01-08 | ||
| JPS5654096A (en) * | 1979-10-05 | 1981-05-13 | Nippon Electric Co | Device for inspecting printed board |
| JPS57115841A (en) * | 1981-01-10 | 1982-07-19 | Nec Corp | Probing method |
| JPS58148935U (ja) * | 1982-03-31 | 1983-10-06 | 日本電子材料株式会社 | プロ−ブカ−ド |
| JPS58173841A (ja) * | 1982-04-03 | 1983-10-12 | Nippon Denshi Zairyo Kk | プロ−ブカ−ド |
-
1984
- 1984-12-27 JP JP27577784A patent/JPS61154137A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS561314U (en:Method) * | 1979-06-18 | 1981-01-08 | ||
| JPS5654096A (en) * | 1979-10-05 | 1981-05-13 | Nippon Electric Co | Device for inspecting printed board |
| JPS57115841A (en) * | 1981-01-10 | 1982-07-19 | Nec Corp | Probing method |
| JPS58148935U (ja) * | 1982-03-31 | 1983-10-06 | 日本電子材料株式会社 | プロ−ブカ−ド |
| JPS58173841A (ja) * | 1982-04-03 | 1983-10-12 | Nippon Denshi Zairyo Kk | プロ−ブカ−ド |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63262850A (ja) * | 1987-04-21 | 1988-10-31 | Tokyo Electron Ltd | プロ−ブカ−ド |
| JPH01276073A (ja) * | 1988-04-28 | 1989-11-06 | Tokyo Electron Ltd | プローブ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515067B2 (en:Method) | 1993-02-26 |
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