JPS61152028A - レジンバリ除去装置 - Google Patents

レジンバリ除去装置

Info

Publication number
JPS61152028A
JPS61152028A JP59273077A JP27307784A JPS61152028A JP S61152028 A JPS61152028 A JP S61152028A JP 59273077 A JP59273077 A JP 59273077A JP 27307784 A JP27307784 A JP 27307784A JP S61152028 A JPS61152028 A JP S61152028A
Authority
JP
Japan
Prior art keywords
resin
nozzle
pressure fluid
resin burr
removal device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59273077A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0376780B2 (enExample
Inventor
Toshiro Iba
射場　俊郎
Michio Tanimoto
道夫 谷本
Masuzo Ikumi
生見　益三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP59273077A priority Critical patent/JPS61152028A/ja
Publication of JPS61152028A publication Critical patent/JPS61152028A/ja
Publication of JPH0376780B2 publication Critical patent/JPH0376780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59273077A 1984-12-26 1984-12-26 レジンバリ除去装置 Granted JPS61152028A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59273077A JPS61152028A (ja) 1984-12-26 1984-12-26 レジンバリ除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59273077A JPS61152028A (ja) 1984-12-26 1984-12-26 レジンバリ除去装置

Publications (2)

Publication Number Publication Date
JPS61152028A true JPS61152028A (ja) 1986-07-10
JPH0376780B2 JPH0376780B2 (enExample) 1991-12-06

Family

ID=17522822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59273077A Granted JPS61152028A (ja) 1984-12-26 1984-12-26 レジンバリ除去装置

Country Status (1)

Country Link
JP (1) JPS61152028A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386529A (ja) * 1986-09-30 1988-04-16 Toshiba Corp 樹脂封止型半導体のバリ取り装置
EP0794559A3 (en) * 1996-03-05 1998-03-18 Nec Corporation Lead frame flash removing method and apparatus
EP1465241A3 (en) * 2003-04-04 2006-11-15 ASM Technology Singapore Pte Ltd. Apparatus and method for cleaning an electronic device
CN104217864A (zh) * 2014-07-24 2014-12-17 天津三星电机有限公司 Mlcc载板的异物清理装置及清理方法
JP2018092964A (ja) * 2016-11-30 2018-06-14 日亜化学工業株式会社 パッケージの製造方法、パッケージ、及び発光装置
KR101882649B1 (ko) * 2018-03-16 2018-07-26 서장호 버 제거부를 구비한 금형장치
KR101882648B1 (ko) * 2018-03-16 2018-07-26 서장호 버 제거부를 구비한 금형장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582443A (en) * 1978-12-14 1980-06-21 Toa Seimitsu Kogyo Kk Method and device for processing after sealing up semiconductor device
JPS5588340A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Trimming method for resin-sealed electronic parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582443A (en) * 1978-12-14 1980-06-21 Toa Seimitsu Kogyo Kk Method and device for processing after sealing up semiconductor device
JPS5588340A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Trimming method for resin-sealed electronic parts

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386529A (ja) * 1986-09-30 1988-04-16 Toshiba Corp 樹脂封止型半導体のバリ取り装置
EP0794559A3 (en) * 1996-03-05 1998-03-18 Nec Corporation Lead frame flash removing method and apparatus
EP1465241A3 (en) * 2003-04-04 2006-11-15 ASM Technology Singapore Pte Ltd. Apparatus and method for cleaning an electronic device
CN104217864A (zh) * 2014-07-24 2014-12-17 天津三星电机有限公司 Mlcc载板的异物清理装置及清理方法
JP2018092964A (ja) * 2016-11-30 2018-06-14 日亜化学工業株式会社 パッケージの製造方法、パッケージ、及び発光装置
KR101882649B1 (ko) * 2018-03-16 2018-07-26 서장호 버 제거부를 구비한 금형장치
KR101882648B1 (ko) * 2018-03-16 2018-07-26 서장호 버 제거부를 구비한 금형장치

Also Published As

Publication number Publication date
JPH0376780B2 (enExample) 1991-12-06

Similar Documents

Publication Publication Date Title
JP2009285769A (ja) 切削装置
JP7169061B2 (ja) 切削方法
JPH11238746A (ja) ワイヤボンディング済ダイのカプセル封入方法
JP2016159376A (ja) 切削装置
KR100695664B1 (ko) 재료 액적 분배 방법
JPH0376780B2 (enExample)
JP6486711B2 (ja) 切削装置
JP7519759B2 (ja) 加工方法
JP2680453B2 (ja) ダイシング方法
JPH10256450A (ja) リードフレームの加工装置および加工方法
JP4292329B2 (ja) 電子部品の切断装置
JPS61244051A (ja) バリ取り装置
JPH03280554A (ja) 半導体装置の製造方法
KR100796189B1 (ko) 반도체 제조장비의 테입 어태치 장치
JPS60152033A (ja) ばり取り装置
JPS6386529A (ja) 樹脂封止型半導体のバリ取り装置
JP2025168257A (ja) パッケージデバイスチップの製造方法
JPH1058478A (ja) トランスファ成形装置及びこれを用いた半導体装置の製 造方法
JPS58135646A (ja) 樹脂封止形半導体装置の製造方法
JPS63107052A (ja) レジンモ−ルド型半導体装置用リ−ドフレ−ム
JPH05283575A (ja) 封止済リードフレームにおけるリード加工方法と加工装 置及び成形品
JPH10138294A (ja) 樹脂封止金型及び樹脂封止方法
JP2754269B2 (ja) 不用レジン除去装置
JPS5964165A (ja) 水中プラズマ切断方法
JPS6269625A (ja) バリ取り方法

Legal Events

Date Code Title Description
S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term