JPS5582443A - Method and device for processing after sealing up semiconductor device - Google Patents
Method and device for processing after sealing up semiconductor deviceInfo
- Publication number
- JPS5582443A JPS5582443A JP15469378A JP15469378A JPS5582443A JP S5582443 A JPS5582443 A JP S5582443A JP 15469378 A JP15469378 A JP 15469378A JP 15469378 A JP15469378 A JP 15469378A JP S5582443 A JPS5582443 A JP S5582443A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- frame
- cutter
- semiconductor devices
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To raise the efficiency in workability when removing the exposed peripheral part of a radiator plate on a frame for semiconductor units or integrated circuits, by bringing a cutter into contact with the exposed side of the radiator plate and causing relative displacement between a semiconductor device and the cutter.
CONSTITUTION: Semiconductor frames 50, each of which is fitted with a plurality of semiconductor devices, are stacked in a frame housing section 1. The semiconductor frame is conveyed from the housing section. The position of the frame is then changed by a position corrector 2 so that the frame extends perpendiculary to the direction of the conveyance. The radiator plates of the semiconductor devices are thrusted into surface contact with cups 29 by the thrust mechanism 5 of a burr removing system 3. Relative motion is caused between the semiconductor frame and a cutter by a driving mechanism 6 to remove burr. After-processing is thus effected with high accuracy without damaging the exposed sides of the radiator plates of the semiconductor devices and a package.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15469378A JPS5582443A (en) | 1978-12-14 | 1978-12-14 | Method and device for processing after sealing up semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15469378A JPS5582443A (en) | 1978-12-14 | 1978-12-14 | Method and device for processing after sealing up semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5582443A true JPS5582443A (en) | 1980-06-21 |
Family
ID=15589865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15469378A Pending JPS5582443A (en) | 1978-12-14 | 1978-12-14 | Method and device for processing after sealing up semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5582443A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152028A (en) * | 1984-12-26 | 1986-07-10 | Hitachi Ltd | Resin burr remover |
-
1978
- 1978-12-14 JP JP15469378A patent/JPS5582443A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152028A (en) * | 1984-12-26 | 1986-07-10 | Hitachi Ltd | Resin burr remover |
JPH0376780B2 (en) * | 1984-12-26 | 1991-12-06 | Hitachi Seisakusho Kk |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0239266A3 (en) | Transfer system in a clean room | |
KR940006242A (en) | Clean Room Transfer System | |
JPS5582443A (en) | Method and device for processing after sealing up semiconductor device | |
JPS5434774A (en) | Article transfer device | |
JPS57154856A (en) | Semiconductor device | |
JPS57211746A (en) | Wafer conveying apparatus | |
JPS52155494A (en) | Process for w orking parallel plane of wafer | |
JPS5237770A (en) | Semiconductor device | |
JPS557106A (en) | Plate conveyer system | |
JPS5322260A (en) | Device for drawing out plankings from stacked plates | |
JPS62124747A (en) | Breaking method for cull in automatic molding equipment | |
JPS56145021A (en) | Aligning device | |
JPS5533027A (en) | Substrate conveyor | |
JPS531471A (en) | Manufacture for semiconductor device | |
JPS5359368A (en) | Plasma etching | |
JPS5382174A (en) | Surface processing method for semiconductor device | |
JPS5287982A (en) | Resin molding method of semiconductor elements | |
JPS52155052A (en) | Production of semiconductor device | |
JPS55126264A (en) | Original conveying means | |
JPS5362476A (en) | Processing method of semiconductor surface | |
JPS5299782A (en) | Semiconductor device for forced-air cooling type vehicles | |
JPS5310972A (en) | Production of semiconductor device | |
JPS5382261A (en) | Semiconductor wafer dicing method | |
JPS53112673A (en) | Mask alignment method in semiconductor device manufacturing process and photo mask used for its execution | |
JPS52119857A (en) | Diffusion of impurities in semi-conductor device |