JPS5582443A - Method and device for processing after sealing up semiconductor device - Google Patents

Method and device for processing after sealing up semiconductor device

Info

Publication number
JPS5582443A
JPS5582443A JP15469378A JP15469378A JPS5582443A JP S5582443 A JPS5582443 A JP S5582443A JP 15469378 A JP15469378 A JP 15469378A JP 15469378 A JP15469378 A JP 15469378A JP S5582443 A JPS5582443 A JP S5582443A
Authority
JP
Japan
Prior art keywords
semiconductor
frame
cutter
semiconductor devices
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15469378A
Other languages
Japanese (ja)
Inventor
Keiji Maeda
Michio Osada
Yotaro Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOA SEIMITSU KOGYO KK
Original Assignee
TOA SEIMITSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOA SEIMITSU KOGYO KK filed Critical TOA SEIMITSU KOGYO KK
Priority to JP15469378A priority Critical patent/JPS5582443A/en
Publication of JPS5582443A publication Critical patent/JPS5582443A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To raise the efficiency in workability when removing the exposed peripheral part of a radiator plate on a frame for semiconductor units or integrated circuits, by bringing a cutter into contact with the exposed side of the radiator plate and causing relative displacement between a semiconductor device and the cutter.
CONSTITUTION: Semiconductor frames 50, each of which is fitted with a plurality of semiconductor devices, are stacked in a frame housing section 1. The semiconductor frame is conveyed from the housing section. The position of the frame is then changed by a position corrector 2 so that the frame extends perpendiculary to the direction of the conveyance. The radiator plates of the semiconductor devices are thrusted into surface contact with cups 29 by the thrust mechanism 5 of a burr removing system 3. Relative motion is caused between the semiconductor frame and a cutter by a driving mechanism 6 to remove burr. After-processing is thus effected with high accuracy without damaging the exposed sides of the radiator plates of the semiconductor devices and a package.
COPYRIGHT: (C)1980,JPO&Japio
JP15469378A 1978-12-14 1978-12-14 Method and device for processing after sealing up semiconductor device Pending JPS5582443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15469378A JPS5582443A (en) 1978-12-14 1978-12-14 Method and device for processing after sealing up semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15469378A JPS5582443A (en) 1978-12-14 1978-12-14 Method and device for processing after sealing up semiconductor device

Publications (1)

Publication Number Publication Date
JPS5582443A true JPS5582443A (en) 1980-06-21

Family

ID=15589865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15469378A Pending JPS5582443A (en) 1978-12-14 1978-12-14 Method and device for processing after sealing up semiconductor device

Country Status (1)

Country Link
JP (1) JPS5582443A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152028A (en) * 1984-12-26 1986-07-10 Hitachi Ltd Resin burr remover

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152028A (en) * 1984-12-26 1986-07-10 Hitachi Ltd Resin burr remover
JPH0376780B2 (en) * 1984-12-26 1991-12-06 Hitachi Seisakusho Kk

Similar Documents

Publication Publication Date Title
EP0239266A3 (en) Transfer system in a clean room
KR940006242A (en) Clean Room Transfer System
JPS5582443A (en) Method and device for processing after sealing up semiconductor device
JPS5434774A (en) Article transfer device
JPS57154856A (en) Semiconductor device
JPS57211746A (en) Wafer conveying apparatus
JPS52155494A (en) Process for w orking parallel plane of wafer
JPS5237770A (en) Semiconductor device
JPS557106A (en) Plate conveyer system
JPS5322260A (en) Device for drawing out plankings from stacked plates
JPS62124747A (en) Breaking method for cull in automatic molding equipment
JPS56145021A (en) Aligning device
JPS5533027A (en) Substrate conveyor
JPS531471A (en) Manufacture for semiconductor device
JPS5359368A (en) Plasma etching
JPS5382174A (en) Surface processing method for semiconductor device
JPS5287982A (en) Resin molding method of semiconductor elements
JPS52155052A (en) Production of semiconductor device
JPS55126264A (en) Original conveying means
JPS5362476A (en) Processing method of semiconductor surface
JPS5299782A (en) Semiconductor device for forced-air cooling type vehicles
JPS5310972A (en) Production of semiconductor device
JPS5382261A (en) Semiconductor wafer dicing method
JPS53112673A (en) Mask alignment method in semiconductor device manufacturing process and photo mask used for its execution
JPS52119857A (en) Diffusion of impurities in semi-conductor device