JPH0376780B2 - - Google Patents

Info

Publication number
JPH0376780B2
JPH0376780B2 JP59273077A JP27307784A JPH0376780B2 JP H0376780 B2 JPH0376780 B2 JP H0376780B2 JP 59273077 A JP59273077 A JP 59273077A JP 27307784 A JP27307784 A JP 27307784A JP H0376780 B2 JPH0376780 B2 JP H0376780B2
Authority
JP
Japan
Prior art keywords
resin
pressure fluid
burr removal
lead frame
resin burr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59273077A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61152028A (ja
Inventor
Toshiro Iba
Michio Tanimoto
Masuzo Ikumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP59273077A priority Critical patent/JPS61152028A/ja
Publication of JPS61152028A publication Critical patent/JPS61152028A/ja
Publication of JPH0376780B2 publication Critical patent/JPH0376780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59273077A 1984-12-26 1984-12-26 レジンバリ除去装置 Granted JPS61152028A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59273077A JPS61152028A (ja) 1984-12-26 1984-12-26 レジンバリ除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59273077A JPS61152028A (ja) 1984-12-26 1984-12-26 レジンバリ除去装置

Publications (2)

Publication Number Publication Date
JPS61152028A JPS61152028A (ja) 1986-07-10
JPH0376780B2 true JPH0376780B2 (enExample) 1991-12-06

Family

ID=17522822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59273077A Granted JPS61152028A (ja) 1984-12-26 1984-12-26 レジンバリ除去装置

Country Status (1)

Country Link
JP (1) JPS61152028A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386529A (ja) * 1986-09-30 1988-04-16 Toshiba Corp 樹脂封止型半導体のバリ取り装置
JP2760339B2 (ja) * 1996-03-05 1998-05-28 日本電気株式会社 リードフレームのばり取り方法およびリードフレーム用ばり取り装置
US20040194803A1 (en) * 2003-04-04 2004-10-07 Asm Technology Singapore Pte Ltd Cleaning of an electronic device
CN104217864A (zh) * 2014-07-24 2014-12-17 天津三星电机有限公司 Mlcc载板的异物清理装置及清理方法
JP6880678B2 (ja) * 2016-11-30 2021-06-02 日亜化学工業株式会社 パッケージの製造方法、パッケージ、及び発光装置
KR101882648B1 (ko) * 2018-03-16 2018-07-26 서장호 버 제거부를 구비한 금형장치
KR101882649B1 (ko) * 2018-03-16 2018-07-26 서장호 버 제거부를 구비한 금형장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582443A (en) * 1978-12-14 1980-06-21 Toa Seimitsu Kogyo Kk Method and device for processing after sealing up semiconductor device
JPS5588340A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Trimming method for resin-sealed electronic parts

Also Published As

Publication number Publication date
JPS61152028A (ja) 1986-07-10

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