JPS61144846A - 大規模集積回路装置 - Google Patents
大規模集積回路装置Info
- Publication number
- JPS61144846A JPS61144846A JP59267177A JP26717784A JPS61144846A JP S61144846 A JPS61144846 A JP S61144846A JP 59267177 A JP59267177 A JP 59267177A JP 26717784 A JP26717784 A JP 26717784A JP S61144846 A JPS61144846 A JP S61144846A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- layer
- equivalent
- region
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
- H10D84/854—Complementary IGFETs, e.g. CMOS comprising arrangements for preventing bipolar actions between the different IGFET regions, e.g. arrangements for latchup prevention
Landscapes
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59267177A JPS61144846A (ja) | 1984-12-18 | 1984-12-18 | 大規模集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59267177A JPS61144846A (ja) | 1984-12-18 | 1984-12-18 | 大規模集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61144846A true JPS61144846A (ja) | 1986-07-02 |
JPH0566737B2 JPH0566737B2 (enrdf_load_stackoverflow) | 1993-09-22 |
Family
ID=17441173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59267177A Granted JPS61144846A (ja) | 1984-12-18 | 1984-12-18 | 大規模集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61144846A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01204461A (ja) * | 1988-02-09 | 1989-08-17 | Matsushita Electron Corp | 半導体集積回路 |
JPH08162539A (ja) * | 1994-06-15 | 1996-06-21 | Hyundai Electron Ind Co Ltd | データ出力バッファ |
JPH08330431A (ja) * | 1995-05-31 | 1996-12-13 | Nec Corp | 半導体集積回路 |
-
1984
- 1984-12-18 JP JP59267177A patent/JPS61144846A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01204461A (ja) * | 1988-02-09 | 1989-08-17 | Matsushita Electron Corp | 半導体集積回路 |
JPH08162539A (ja) * | 1994-06-15 | 1996-06-21 | Hyundai Electron Ind Co Ltd | データ出力バッファ |
JPH08330431A (ja) * | 1995-05-31 | 1996-12-13 | Nec Corp | 半導体集積回路 |
Also Published As
Publication number | Publication date |
---|---|
JPH0566737B2 (enrdf_load_stackoverflow) | 1993-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |