JPS61136965A - 薄膜用セラミツク基板の製造方法 - Google Patents

薄膜用セラミツク基板の製造方法

Info

Publication number
JPS61136965A
JPS61136965A JP25889584A JP25889584A JPS61136965A JP S61136965 A JPS61136965 A JP S61136965A JP 25889584 A JP25889584 A JP 25889584A JP 25889584 A JP25889584 A JP 25889584A JP S61136965 A JPS61136965 A JP S61136965A
Authority
JP
Japan
Prior art keywords
ceramic substrate
ceramic
manufacture
sheets
firing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25889584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0536382B2 (enrdf_load_stackoverflow
Inventor
公一 永田
北野　光明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP25889584A priority Critical patent/JPS61136965A/ja
Publication of JPS61136965A publication Critical patent/JPS61136965A/ja
Publication of JPH0536382B2 publication Critical patent/JPH0536382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Compositions Of Oxide Ceramics (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP25889584A 1984-12-06 1984-12-06 薄膜用セラミツク基板の製造方法 Granted JPS61136965A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25889584A JPS61136965A (ja) 1984-12-06 1984-12-06 薄膜用セラミツク基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25889584A JPS61136965A (ja) 1984-12-06 1984-12-06 薄膜用セラミツク基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61136965A true JPS61136965A (ja) 1986-06-24
JPH0536382B2 JPH0536382B2 (enrdf_load_stackoverflow) 1993-05-28

Family

ID=17326516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25889584A Granted JPS61136965A (ja) 1984-12-06 1984-12-06 薄膜用セラミツク基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61136965A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297467A (ja) * 1988-10-05 1990-04-10 Hokuriku Electric Ind Co Ltd セラミック薄板の製造方法
JP2003069217A (ja) * 2001-08-22 2003-03-07 Kyocera Corp 回路基板の製造方法
JP2003101217A (ja) * 2001-09-26 2003-04-04 Kyocera Corp 回路基板及びその製造方法
US20090302284A1 (en) * 2005-06-10 2009-12-10 Walter Fischer Reversibly Thermochromic Compositions
JP2010030280A (ja) * 2008-06-27 2010-02-12 Kyocera Corp セラミック基体、放熱基体および電子装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258717A (en) * 1975-11-10 1977-05-14 Tokyo Shibaura Electric Co Tools for burning ceramics
JPS5631536U (enrdf_load_stackoverflow) * 1979-08-15 1981-03-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258717A (en) * 1975-11-10 1977-05-14 Tokyo Shibaura Electric Co Tools for burning ceramics
JPS5631536U (enrdf_load_stackoverflow) * 1979-08-15 1981-03-27

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297467A (ja) * 1988-10-05 1990-04-10 Hokuriku Electric Ind Co Ltd セラミック薄板の製造方法
JP2003069217A (ja) * 2001-08-22 2003-03-07 Kyocera Corp 回路基板の製造方法
JP2003101217A (ja) * 2001-09-26 2003-04-04 Kyocera Corp 回路基板及びその製造方法
US20090302284A1 (en) * 2005-06-10 2009-12-10 Walter Fischer Reversibly Thermochromic Compositions
US9039946B2 (en) * 2005-06-10 2015-05-26 Basf Se Reversibly thermochromic compositions
JP2010030280A (ja) * 2008-06-27 2010-02-12 Kyocera Corp セラミック基体、放熱基体および電子装置

Also Published As

Publication number Publication date
JPH0536382B2 (enrdf_load_stackoverflow) 1993-05-28

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Legal Events

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