JPS61136654A - アルミニウム極細線の製造方法 - Google Patents

アルミニウム極細線の製造方法

Info

Publication number
JPS61136654A
JPS61136654A JP59259675A JP25967584A JPS61136654A JP S61136654 A JPS61136654 A JP S61136654A JP 59259675 A JP59259675 A JP 59259675A JP 25967584 A JP25967584 A JP 25967584A JP S61136654 A JPS61136654 A JP S61136654A
Authority
JP
Japan
Prior art keywords
wire
elongation
weight
tensile strength
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59259675A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0418026B2 (enrdf_load_stackoverflow
Inventor
Yutaka Kusano
裕 草野
Junichi Hasegawa
淳一 長谷川
Kiyomi Kubota
久保田　清美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to JP59259675A priority Critical patent/JPS61136654A/ja
Publication of JPS61136654A publication Critical patent/JPS61136654A/ja
Publication of JPH0418026B2 publication Critical patent/JPH0418026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Conductive Materials (AREA)
JP59259675A 1984-12-08 1984-12-08 アルミニウム極細線の製造方法 Granted JPS61136654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59259675A JPS61136654A (ja) 1984-12-08 1984-12-08 アルミニウム極細線の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59259675A JPS61136654A (ja) 1984-12-08 1984-12-08 アルミニウム極細線の製造方法

Publications (2)

Publication Number Publication Date
JPS61136654A true JPS61136654A (ja) 1986-06-24
JPH0418026B2 JPH0418026B2 (enrdf_load_stackoverflow) 1992-03-26

Family

ID=17337338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59259675A Granted JPS61136654A (ja) 1984-12-08 1984-12-08 アルミニウム極細線の製造方法

Country Status (1)

Country Link
JP (1) JPS61136654A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014173097A (ja) * 2013-03-06 2014-09-22 Auto Network Gijutsu Kenkyusho:Kk アルミニウム合金線、アルミニウム合金撚り線、絶縁電線、及びワイヤーハーネス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619536A (ja) * 1984-06-21 1986-01-17 Sumitomo Electric Ind Ltd ボンディングワイヤ用アルミ合金細線の製造方法
JPS61117258A (ja) * 1984-11-13 1986-06-04 Kobe Steel Ltd ボンディング用アルミニウムワイヤ−の製造法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619536A (ja) * 1984-06-21 1986-01-17 Sumitomo Electric Ind Ltd ボンディングワイヤ用アルミ合金細線の製造方法
JPS61117258A (ja) * 1984-11-13 1986-06-04 Kobe Steel Ltd ボンディング用アルミニウムワイヤ−の製造法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014173097A (ja) * 2013-03-06 2014-09-22 Auto Network Gijutsu Kenkyusho:Kk アルミニウム合金線、アルミニウム合金撚り線、絶縁電線、及びワイヤーハーネス

Also Published As

Publication number Publication date
JPH0418026B2 (enrdf_load_stackoverflow) 1992-03-26

Similar Documents

Publication Publication Date Title
US7928541B2 (en) Copper alloy sheet and QFN package
JPH0625388B2 (ja) 高強度、高導電性銅基合金
JP3367544B2 (ja) ボンディング用金合金細線及びその製造方法
JPS63109130A (ja) 電子機器用銅合金
US5637274A (en) Palladium alloy thin wire for wire bonding semiconductor elements
JPH0379416B2 (enrdf_load_stackoverflow)
US5205878A (en) Copper-based electric and electronic parts having high strength and high electric conductivity
JPH06100983A (ja) 高ヤング率・高降伏強度を有するｔａｂテープ用金属箔およびその製造方法
JPS62104061A (ja) 半導体素子用ボンデイング線およびその製造方法
JPS61136654A (ja) アルミニウム極細線の製造方法
JP3573321B2 (ja) Ａｕボンディングワイヤー
JPS5841782B2 (ja) Ｉｃ用リ−ド材
JPS62170448A (ja) アルミニウム極細線
JPH084100B2 (ja) ボンディング線
JPS61136653A (ja) アルミニウム極細線の製造方法
JP2003059964A (ja) ボンディングワイヤ及びその製造方法
JPS60238079A (ja) アルミニウム極細線の製造方法
JPH11293366A (ja) 圧電振動子ケース用材料および前記材料を使用した圧電振動子ケース
JPS62211337A (ja) エレクトロニクス部品の為の材料としての銅、チタン、コバルトの合金
JP2661247B2 (ja) 半導体素子ボンディング用金合金細線
JPH1136028A (ja) 半導体装置用リードフレーム
JP3117852B2 (ja) Ｆｅ−Ｃｕ合金ＩＣリードフレームおよびその製造方法
JPS61157664A (ja) アルミニウム極細線の製造方法
JPH0480981B2 (enrdf_load_stackoverflow)
JP2003023030A (ja) ボンディングワイヤ及びその製造方法