JPH0418026B2 - - Google Patents

Info

Publication number
JPH0418026B2
JPH0418026B2 JP59259675A JP25967584A JPH0418026B2 JP H0418026 B2 JPH0418026 B2 JP H0418026B2 JP 59259675 A JP59259675 A JP 59259675A JP 25967584 A JP25967584 A JP 25967584A JP H0418026 B2 JPH0418026 B2 JP H0418026B2
Authority
JP
Japan
Prior art keywords
wire
weight
properties
bonding
elongation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59259675A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61136654A (ja
Inventor
Yutaka Kusano
Junichi Hasegawa
Kyomi Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to JP59259675A priority Critical patent/JPS61136654A/ja
Publication of JPS61136654A publication Critical patent/JPS61136654A/ja
Publication of JPH0418026B2 publication Critical patent/JPH0418026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Conductive Materials (AREA)
JP59259675A 1984-12-08 1984-12-08 アルミニウム極細線の製造方法 Granted JPS61136654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59259675A JPS61136654A (ja) 1984-12-08 1984-12-08 アルミニウム極細線の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59259675A JPS61136654A (ja) 1984-12-08 1984-12-08 アルミニウム極細線の製造方法

Publications (2)

Publication Number Publication Date
JPS61136654A JPS61136654A (ja) 1986-06-24
JPH0418026B2 true JPH0418026B2 (enrdf_load_stackoverflow) 1992-03-26

Family

ID=17337338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59259675A Granted JPS61136654A (ja) 1984-12-08 1984-12-08 アルミニウム極細線の製造方法

Country Status (1)

Country Link
JP (1) JPS61136654A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014173097A (ja) * 2013-03-06 2014-09-22 Auto Network Gijutsu Kenkyusho:Kk アルミニウム合金線、アルミニウム合金撚り線、絶縁電線、及びワイヤーハーネス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619536A (ja) * 1984-06-21 1986-01-17 Sumitomo Electric Ind Ltd ボンディングワイヤ用アルミ合金細線の製造方法
JPS61117258A (ja) * 1984-11-13 1986-06-04 Kobe Steel Ltd ボンディング用アルミニウムワイヤ−の製造法

Also Published As

Publication number Publication date
JPS61136654A (ja) 1986-06-24

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