JPS6112385B2 - - Google Patents
Info
- Publication number
- JPS6112385B2 JPS6112385B2 JP52154821A JP15482177A JPS6112385B2 JP S6112385 B2 JPS6112385 B2 JP S6112385B2 JP 52154821 A JP52154821 A JP 52154821A JP 15482177 A JP15482177 A JP 15482177A JP S6112385 B2 JPS6112385 B2 JP S6112385B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- solder
- semiconductor
- semi
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 2
- 239000011265 semifinished product Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15482177A JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15482177A JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5486275A JPS5486275A (en) | 1979-07-09 |
| JPS6112385B2 true JPS6112385B2 (enrdf_load_stackoverflow) | 1986-04-08 |
Family
ID=15592600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15482177A Granted JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5486275A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61267355A (ja) * | 1985-05-21 | 1986-11-26 | Fuji Plant Kogyo Kk | 半導体パツケ−ジ組立工程での外装処理方法 |
| JPS63142841A (ja) * | 1986-12-05 | 1988-06-15 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装処理方法 |
| JPS63148669A (ja) * | 1986-12-12 | 1988-06-21 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装方法 |
-
1977
- 1977-12-21 JP JP15482177A patent/JPS5486275A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5486275A (en) | 1979-07-09 |