JPS61123148A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS61123148A
JPS61123148A JP59244803A JP24480384A JPS61123148A JP S61123148 A JPS61123148 A JP S61123148A JP 59244803 A JP59244803 A JP 59244803A JP 24480384 A JP24480384 A JP 24480384A JP S61123148 A JPS61123148 A JP S61123148A
Authority
JP
Japan
Prior art keywords
capillary
moving
acceleration characteristic
distance
standard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59244803A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0566731B2 (enExample
Inventor
Mitsusada Shibasaka
柴坂　光貞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59244803A priority Critical patent/JPS61123148A/ja
Publication of JPS61123148A publication Critical patent/JPS61123148A/ja
Publication of JPH0566731B2 publication Critical patent/JPH0566731B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP59244803A 1984-11-20 1984-11-20 ワイヤボンデイング方法 Granted JPS61123148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59244803A JPS61123148A (ja) 1984-11-20 1984-11-20 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59244803A JPS61123148A (ja) 1984-11-20 1984-11-20 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61123148A true JPS61123148A (ja) 1986-06-11
JPH0566731B2 JPH0566731B2 (enExample) 1993-09-22

Family

ID=17124171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59244803A Granted JPS61123148A (ja) 1984-11-20 1984-11-20 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61123148A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604307B1 (ko) * 2000-05-27 2006-07-24 삼성테크윈 주식회사 와이어 본딩 시스템의 속도 프로파일 설계 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604307B1 (ko) * 2000-05-27 2006-07-24 삼성테크윈 주식회사 와이어 본딩 시스템의 속도 프로파일 설계 방법

Also Published As

Publication number Publication date
JPH0566731B2 (enExample) 1993-09-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term