JPS61121870A - 脆性材料の切断方法 - Google Patents

脆性材料の切断方法

Info

Publication number
JPS61121870A
JPS61121870A JP24424384A JP24424384A JPS61121870A JP S61121870 A JPS61121870 A JP S61121870A JP 24424384 A JP24424384 A JP 24424384A JP 24424384 A JP24424384 A JP 24424384A JP S61121870 A JPS61121870 A JP S61121870A
Authority
JP
Japan
Prior art keywords
wire
cut
cutting
workpiece
machining fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24424384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0366106B2 (enrdf_load_stackoverflow
Inventor
Atsushi Tomizawa
淳 富澤
Mitsuo Mitani
三谷　充男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Spindle Manufacturing Co Ltd
Nippon Steel Corp
Original Assignee
Nihon Spindle Manufacturing Co Ltd
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Spindle Manufacturing Co Ltd, Sumitomo Metal Industries Ltd filed Critical Nihon Spindle Manufacturing Co Ltd
Priority to JP24424384A priority Critical patent/JPS61121870A/ja
Publication of JPS61121870A publication Critical patent/JPS61121870A/ja
Publication of JPH0366106B2 publication Critical patent/JPH0366106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP24424384A 1984-11-19 1984-11-19 脆性材料の切断方法 Granted JPS61121870A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24424384A JPS61121870A (ja) 1984-11-19 1984-11-19 脆性材料の切断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24424384A JPS61121870A (ja) 1984-11-19 1984-11-19 脆性材料の切断方法

Publications (2)

Publication Number Publication Date
JPS61121870A true JPS61121870A (ja) 1986-06-09
JPH0366106B2 JPH0366106B2 (enrdf_load_stackoverflow) 1991-10-16

Family

ID=17115861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24424384A Granted JPS61121870A (ja) 1984-11-19 1984-11-19 脆性材料の切断方法

Country Status (1)

Country Link
JP (1) JPS61121870A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989010825A1 (fr) * 1988-05-09 1989-11-16 Charles Hauser Dispositif pour l'amelioration du sciage d'une piece en tranches fines
JP2007021676A (ja) * 2005-07-19 2007-02-01 Asahi Diamond Industrial Co Ltd ノズル装置、ワイヤ加工装置、及びワイヤ加工方法
CN100358697C (zh) * 2004-07-29 2008-01-02 日本碍子株式会社 线锯装置
JP2012161867A (ja) * 2011-02-04 2012-08-30 Denso Corp ワイヤーソー装置
JP2014133287A (ja) * 2013-01-10 2014-07-24 Toyo Advanced Technologies Co Ltd ワイヤソー
CN105500535A (zh) * 2014-05-08 2016-04-20 沈棋 一种手动瓷砖切割机
JP2017220546A (ja) * 2016-06-07 2017-12-14 株式会社Sumco ワークの切断方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989010825A1 (fr) * 1988-05-09 1989-11-16 Charles Hauser Dispositif pour l'amelioration du sciage d'une piece en tranches fines
CN100358697C (zh) * 2004-07-29 2008-01-02 日本碍子株式会社 线锯装置
JP2007021676A (ja) * 2005-07-19 2007-02-01 Asahi Diamond Industrial Co Ltd ノズル装置、ワイヤ加工装置、及びワイヤ加工方法
JP2012161867A (ja) * 2011-02-04 2012-08-30 Denso Corp ワイヤーソー装置
JP2014133287A (ja) * 2013-01-10 2014-07-24 Toyo Advanced Technologies Co Ltd ワイヤソー
CN105500535A (zh) * 2014-05-08 2016-04-20 沈棋 一种手动瓷砖切割机
JP2017220546A (ja) * 2016-06-07 2017-12-14 株式会社Sumco ワークの切断方法

Also Published As

Publication number Publication date
JPH0366106B2 (enrdf_load_stackoverflow) 1991-10-16

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees