JPS61121870A - Cutting method for brittle material - Google Patents

Abstract

PURPOSE:To make it possible to supply sufficient machining liquid uniformly to a cutting in part by cutting brittle material supplying the machining liquid to a slidably contacting part between a member to be cut and a wire as a hopper shaped slit nozzle to discharge the machining liquid in a water film state is moved round the periphery of the member to be cut. CONSTITUTION:The discharge port 6-1 of a hopper shaped slit nozzle 6 is aimed at a slidably contacting part between a member to be cut 3 and a wire 2, and then the machining liquid is discharged in a water film state through the discharge port 6-1 into the slidably contacting part. In the next stage, the cutting in part of the member to be cut is cut under the machining liquid supplied as the hopper shaped slit nozzle 6 is moved back along the periphery of the member to be cut in accordance with its cutting in part. When the cutting wire 2 passes through the sectional central part of the member to be cut 3, the above part is cut under the machining liquid supplied as the hopper shaped slit nozzle 6 is moved toward the member to be cut 3 again. Thus the sufficient machining liquid can be supplied uniformly to the cutting in part of the member to be cut 3 to improve cutting efficiency and machining accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention is suitable for processing so-called brittle materials such as semiconductor materials, magnetic materials, and ceramics using a machining fluid containing wires and abrasive grains or a cutting fluid containing acid (hereinafter referred to as machining fluid). The present invention relates to a method of cutting by.

Prior Art and Its Problems One method for cutting brittle materials such as semiconductor materials is a wire saw that cuts by supplying a machining fluid containing abrasive grains while sliding a wire against a member to be cut. To explain the cutting method, as shown in an example in FIG.
3) while running the wire while pressing against the material to be cut (3), the machining fluid supply porous nozzle (
4) The machining liquid is supplied to the part to be cut for cutting. (
5) is a table for pushing up the member to be cut. The machining fluid supply porous nozzle (4) has a large number of holes drilled at regular intervals along the workpiece to be cut (3), and the machining fluid falls in a so-called linear shape through the holes and supplies the workpiece to the workpiece. It is designed to be supplied on top of the

However, in the method of cutting using such a machining liquid supply nozzle, the cutting wire (2) and the member to be cut (3)
The machining fluid is not supplied uniformly and sufficiently to the sliding contact parts of the
In addition to lowering the processing accuracy (surface roughness, flaws) of the workpiece to be cut and the cutting efficiency, the wire was also significantly worn, sometimes causing problems such as wire breakage.

Purpose of the Invention The present invention has been made to solve the above-mentioned problems of the prior art, and provides a system in which machining fluid is always uniformly and sufficiently supplied.
The purpose of this invention is to propose a method for cutting brittle materials that can improve cutting efficiency and processing accuracy and significantly reduce wire wear.

Structure of the Invention The method for cutting a brittle material according to the present invention includes a cutting method in which a machining liquid is supplied while a wire is brought into sliding contact with a member to be cut, and a slit-shaped outflow hole is formed along the member to be cut. The present invention is characterized in that a hopper-type slit nozzle having a hopper-type slit nozzle is used, and the machining liquid is supplied while the slit nozzle is moved along the circumferential surface of the workpiece in parallel to the wire running direction.

The method of this invention will be explained below based on the drawings.

FIGS. 1 and 2 show an example of an apparatus for carrying out the method of the present invention, in which a processing fluid supply porous nozzle ( 4
), a hopper-type slit nozzle (6) having a slit-shaped outlet (6-1) along the member to be cut (3) is moved via a support jig (7) in parallel to the wire running direction. Attach to the slide guide (8).

The structure of the JR model is a hopper type slit nozzle (6)
The side walls of the support jig (7) are mounted on the side struts (7-1) of the support jig (7), and the support jig is mounted on the slide guide (8) provided below the wire portion that slides into contact with the member to be cut (3). Ingredients (7)
are fitted and supported so that they can move horizontally parallel to the wire running direction using a concave-convex fitting method.

The means for moving the hopper-type slit nozzle (6) is a nazoto part (
For example, a system can be used in which a ball screw (9) is screwed into the shaft 7-2) and the ball screw is rotated by a reversible motor (6) via a belt.

In addition, in the case of a wire saw that cuts the wire by running it in one direction, the machining fluid supply device described above is used to supply the workpiece (
3) is installed on the inlet side in the wire running direction. On the other hand, in the case of a wire saw that cuts the wire by moving it back and forth, it may be installed on either or both of the entry side and exit side of the member to be cut.

Effects of the Invention When cutting the member to be cut (3) with a wire saw, FIG. ) and the wire (2) so that the outlet (6-1) of the hopper-type slit nozzle (6) faces the sliding contact area, and in this state, the machining liquid is poured from the porous nozzle (4) to the hopper-type slit nozzle (6). The injected machining liquid is discharged from the slit-shaped outlet (a-1) of the slit nozzle in the form of a water curtain, and is supplied to the sliding contact portion between the member to be cut (3) and the wire (2). Thereafter, while continuing to supply the machining fluid, the workpiece to be cut (3
), the ball screw (9
) is rotated to move the hopper-type nullit nozzle (6) backward along the circumferential surface of the workpiece (3) to cut it. Then, the cutting wire (2) is connected to the member to be cut (3).
), the motor αD is reversely rotated to move the hopper-type slit nozzle (6) once again onto the workpiece (
3) Supply machining fluid while moving to the side and cut. When cutting is completed, the supply of machining fluid is stopped, and the motor (2) moves the hopper-type slit nozzle (6) to the workpiece (3).
).

As described above, the method of the present invention uses a hopper-type slit nozzle that discharges machining liquid in a water curtain shape, and moves the machining liquid along the circumferential surface of the workpiece to be cut, while the workflow is applied to the sliding contact area between the workpiece and the wire. Since this is a method for cutting by supplying the machining fluid to the cut portion of the workpiece, the machining fluid is uniformly and sufficiently supplied to the cut portion of the workpiece to be cut. Therefore, there is no occurrence of flaws (saw marks) caused by insufficient supply of machining fluid, thereby improving cutting accuracy, and cutting efficiency is also significantly improved due to the stable supply of machining fluid. Furthermore, the effect of reducing wire wear is significant, and wire breakage accidents are almost eliminated.

Example 1 Using the machining fluid supply device shown in Fig. 1, -
A 4Si single crystal was cut under the following conditions.

The results are shown in Table 1 in comparison with cutting using the same wire saw using the conventional machining fluid supply method using a multi-hole nozzle shown in FIG.

Cutting conditions Wire speed: Maximum 400m1m1n, unidirectional traveling method Liquid: Mixture of GC800 and lap oil Number of wafers cut: 150 wafers Table 2 shows the results of cutting a single crystal under the condition of -S t/S in comparison with the case of cutting using a conventional machining fluid supply method using a multi-hole nozzle.

Table 2 As is clear from Tables 1 and 2 above, the method of the present invention greatly improved both the cutting accuracy and cutting efficiency of the workpiece.

[Brief explanation of the drawing]

Fig. 1 is a schematic side view showing an example of an apparatus for implementing the method of the present invention, Fig. 2 is a front view of the same as above, Fig. 3 is an explanatory diagram of the machining fluid supply position in the method of the invention, and Fig. 4 is a conventional FIG. 2 is a schematic diagram showing a cutting method. l... Groove lobe, 2... Wire, 3... Member to be cut, 4... Porous nozzle, 5... Push-up table, 6...
Hopper type slit nozzle, 7... Support jig, 8...
・Slide guide, 9-ball screw, 11...motor. Figure 1 Figure 3 Figure 4

Claims (1)

[Claims] In this method, a wire is cut by supplying machining liquid while the workpiece is brought into sliding contact with the wire. A hopper-type slit nozzle having a slit-shaped outflow hole is used along the workpiece, and the slit nozzle is inserted around the workpiece. A method for cutting brittle materials characterized by supplying machining fluid while moving it along a surface parallel to the wire running direction.