WO1989010825A1 - Device for improved sawing of a piece into thin slices - Google Patents

Device for improved sawing of a piece into thin slices Download PDF

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Publication number
WO1989010825A1
WO1989010825A1 PCT/CH1989/000083 CH8900083W WO8910825A1 WO 1989010825 A1 WO1989010825 A1 WO 1989010825A1 CH 8900083 W CH8900083 W CH 8900083W WO 8910825 A1 WO8910825 A1 WO 8910825A1
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WO
WIPO (PCT)
Prior art keywords
sawing
workpiece
abrasive
cylinder
homogenization
Prior art date
Application number
PCT/CH1989/000083
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French (fr)
Inventor
Charles Hauser
Original Assignee
Charles Hauser
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Publication date
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Publication of WO1989010825A1 publication Critical patent/WO1989010825A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/04—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of solid grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums

Definitions

  • D isposi ti f sawing by son, comprising a sheet of son 2, capable of moving in a continuous or reciprocating movement pressing against a workpiece 1 defining. thus a sawing zone, and means for supplying an abrasive slip 8 intended to ensure a supply of abrasive i f into the sawing zone.
  • Sawing devices of the aforementioned type are already known, especially in the industry of electronic components, ferrites, quartz and silicas, for obtaining thin slices of materials such as silicon (poly or monocr i stal l in ), or new materials such as GaAs, InP, GGG or also quartz, synthetic sapphire, or even .. ceramic.
  • materials such as silicon (poly or monocr i stal l in ), or new materials such as GaAs, InP, GGG or also quartz, synthetic sapphire, or even .. ceramic.
  • the high price of these materials makes wire sawing more attractive compared to other techniques such as diamond disc sawing.
  • the wire sawing technique requires perfect control of the supply of abrasive to obtain quality cuts. It therefore depends on the way in which the abrasive is brought to the entry of the ply of wires into the workpiece.
  • the object of the invention is to remedy the aforementioned drawbacks by providing a sawing device of the type mentioned above which does not require delicate adjustment of the distribution of the abrasive mixture, in such a way that it ensures, in in any circumstance, a satisfactory sawing with a good surface condition. This increases the yield by allowing a higher sawing speed. Good penetration of abrasive between the wire and the workpiece and not wiping of the latter depends on the pressure with which the abrasive is supplied. Currently, all of the delivery devices use the linear speed of the wire for penetration of the abrasive mixture.
  • the sawing device according to the invention is characterized in that it comprises means 3, 6 for homogenizing the local pressure and the quantity of abrasive slip near the entry of the wires into the workpiece.
  • the sawing arrangement object of the present invention, therefore comprises, near the block to be sawn, a part whose shape, by the laws of hydrodynamics, locally increases the pressure of the abrasive at the entrance of the wire in the material to be sawn.
  • This part can be static or rotating. It can be constituted for example by a cylinder driven by the wire and pressing against the workpiece. When this overpressure appears, the supply irregularities are immediately eliminated and the sawing conditions stabilize. The quality of sawing becomes little or not dependent on the abrasive supply means.
  • the appended drawing illustrates schérnatiquernent and by way of example a sawing device in accordance with the invention, as well as several variants.
  • Fig. 1 - Figure 1 shows schérnatiquernent the case where the homogenization means are constituted by a cylind neck in rotation.
  • the cylinder 3 rotates by pressing. on the workpiece 1 and. on wire 2 with a translation speed.
  • a depression appears at points FI and F3 which is compensated by an overpressure in P2.
  • Diagram 4 illustrates the distribution of the pressures of the abrasive slip around the cylinder.
  • Fig. 2 - Figure 2 describes means of homogeni sat i on fixed causing an increase in pressure of the abrasive i not 5, similar to what has been described with reference to Figure 1. These means are constituted by a fixed wall 6 disposed near the workpiece 1 and the wire.
  • Fig. 3 - Figure 3 illustrates in perspective an example of application of the present invention.
  • the cylinder 3 placed on the web of wires 2 impregnated with the abrasive mixture is driven by the latter. It is rotated and supported by the abrasive film. There is then a pressure at the entry of the wires into the workpiece 1, which stabilizes the sawing process. In addition, the cylinder equalizes local irregularities in abrasive flow due to improper adjustment of the supply device.
  • the vertical movement of the workpiece 1 is given by the table 7.
  • Fig. 4 - Figure 4 shows in elevation a sawing device comprising static homogenization means.
  • a wall 6 disposed near the workpiece 1 causes the desired overpressure and there are the same effects as in the previous case.
  • the wall 6 can be part of the means for supplying abrasive slip.
  • Fig. 5 - Figure 5 is a schematic section of a device similar to that illustrated in Figure 3.
  • Two ingots 1 are sawn simultaneously with means of homogenization constituted by a cyl rim 3 placed in front of each ingot, the supply of slip abrasive 8 being produced above each cylinder.
  • the saw wire is generally made of spring steel with a diameter between 0.1 and 0.2 mm, this for silicon blocks of 100 mm or more of inscribed circle, cut into slices of 0.2 to 1 mm. It is possible to produce between 200 and 500 slices at a time in a time of 5 to 6 hours.
  • the device described in the present invention makes it possible to easily place several blocks to be sawed side by side. Productivity can then be doubled or tripled.
  • the abrasive generally consists of a mixture of lifting liquid and an abrasive solid. More particularly, this mixture can consist of an aqueous medium or of oil with silicon or boron carbides, or alumina oxides. There may also be surfactants such as carboxyrnethyl cellulose or glycerin etc. Diamond paste can also be considered.
  • the homogenization means for example the cylinder 3 or the wall 6, may be made of metal, steel, aluminum or the like, or may comprise a surface which is resistant to abrasion wear. It can then be a polyurethane such as "Adipren" (Dupont) or "Vulcolan" (Bayer).
  • the sawing is made practically independent of the adjustment of the abrasive supply and allows the sawing of several simultaneous ingots placed side by side (fig. 5).
  • the homogenization means can present other forms always in the spirit of maintaining near the entry of the sheet of fxls in the workpiece, an overpressure of the abrasive mixture if given hydrodynamic i by the relative movements of the means of homogenization, the wire and the body to be sawn, in the presence of the abrasive mixture.
  • the homogenization means can be constituted by a plate conforming to the contour of the workpiece near the entry of the ply of wires into the workpiece.
  • the homogenization means consist of a cylinder
  • this can have a surface structure in order to increase the volume of slip around the cylinder.
  • This structure can be formed by longitudinal or circular ridges or, in general, by cells in the surface of the cylinder.
  • the latter may have the shape of a comb through which the sheet of yarn passes.
  • This comb-shaped part can be obtained by sawing the edge of a solid plate by means of the ply of wires at the start of the sawing operation of part 1.

Abstract

A device for sawing pieces into thin slices by means of a row of parallel wires (2) coated with a slip is characterized by the presence of one or more pieces (3) placed near the object (1) to be sawn so that their presence ensures a uniform pressure and quantity of slip near the point at which the wire enters the piece (1) bo be sawn.

Description

DISPOSITIF POUR L'AMELIORATION DU SCIAGE D'UNE PIECE EN TRANCHES FINES DEVICE FOR IMPROVING THE SAWING OF A WORKPIECE IN FINE WAFERS
D isposi ti f de sci age par fils, comprenant une nappe de fils 2, susceptibles de se déplacer selon un mouvement continu ou alternatif en appui contre une pièce à scier 1 définissant. ainsi une zone de sciage, et des moyens d'alimentation en barbotine abrasive 8 dest inés à assurer un apport d ' abras i f dans la zone de sciage.D isposi ti f sawing by son, comprising a sheet of son 2, capable of moving in a continuous or reciprocating movement pressing against a workpiece 1 defining. thus a sawing zone, and means for supplying an abrasive slip 8 intended to ensure a supply of abrasive i f into the sawing zone.
Des dispositifs de sciage du type précité sont déjà connus, spécialement dans l ' industr ie des composants électroniques, des ferrites, des quartz et silices, pour l'obtention en tranches fines de matériaux tels que le silicium (poly ou monocr i stal l in) , ou l es nouveaux mat ér i aux t e l s que GaAs, InP, GGG ou également quartz, saphir synthétique, voire même.. céramique. Le prix élevé de ces matériaux rend le sciage par fil plus attractif comparativement a d'autres techniques comme le sciage par disque diamanté.Sawing devices of the aforementioned type are already known, especially in the industry of electronic components, ferrites, quartz and silicas, for obtaining thin slices of materials such as silicon (poly or monocr i stal l in ), or new materials such as GaAs, InP, GGG or also quartz, synthetic sapphire, or even .. ceramic. The high price of these materials makes wire sawing more attractive compared to other techniques such as diamond disc sawing.
Toutefois, la technique du sciage par fil requiert un contrôle parfait de l'apport d'abrasif pour l'obtention de découpes de qualité. Elle dépend donc de la manière dont l'abrasif est amené à l'entrée de la nappe de fils dans la pièce à scier.However, the wire sawing technique requires perfect control of the supply of abrasive to obtain quality cuts. It therefore depends on the way in which the abrasive is brought to the entry of the ply of wires into the workpiece.
Ainsi, parmi les dispositifs connu d'apport, on peut citer les buses d'injection ou de pulvérisation, soit sous pression, soit par gravité naturelle, ou encore l'immersion de la ou les pièces à scier. Malheureusement, une petite rno dification ou variation de l'apport de l'abrasif peut compromettre la qualité du sciage, par exemple en affectant l'état de surface. L'ajustement de cette distr ibution est d'autantplus délicate que la longueur utile de sciage est grande; or cela correspond à la tendance actuelle qui est le sciage de pièce de grandes dimensions ou de plusieurs pièces sirnultanérnent.Thus, among the known supply devices, mention may be made of injection or spray nozzles, either under pressure or by natural gravity, or even the immersion of the part or parts to be sawed. Unfortunately a little rno modification or variation of the abrasive supply can compromise the quality of the sawing, for example by affecting the surface finish. The adjustment of this distr ibution is all the more delicate the larger the useful sawing length; however, this corresponds to the current trend which is sawing large pieces or several cut pieces.
Le but de l'invention consiste à remédier aux inconvénients précités en fournissant un dispositif de sciage du type mentionné ci-dessus qui ne nécessite pas d'ajustement délicat, de la distribution du mélange abrasif, de telle manière que celui-ci assure, dans n'importe quelle circonstance, un sciage satisfaisant avec un bon état de surface. On augmente ainsi le rendement en permettant une vitesse de sciage plus importante. Une bonne pénétration d'abrasif entre le fil et la pièce à scier et non un essuyage de celui-ci dépend de la pression avec laquelle l'abrasif est apporté. Actuellement., tous les dispositifs d'apport utilisent la vitesse l inéa i re du fil pour la pénétration du mélange d'abrasif. Le dispositif de sciage selon l'invention est caractérisé en ce qu'il comprend des moyens d'homogénéisation 3, 6 de la pression locale et de la quantité de barbotine abrasive à proximité de l'entrée des fils dans la pièce à scier.The object of the invention is to remedy the aforementioned drawbacks by providing a sawing device of the type mentioned above which does not require delicate adjustment of the distribution of the abrasive mixture, in such a way that it ensures, in in any circumstance, a satisfactory sawing with a good surface condition. This increases the yield by allowing a higher sawing speed. Good penetration of abrasive between the wire and the workpiece and not wiping of the latter depends on the pressure with which the abrasive is supplied. Currently, all of the delivery devices use the linear speed of the wire for penetration of the abrasive mixture. The sawing device according to the invention is characterized in that it comprises means 3, 6 for homogenizing the local pressure and the quantity of abrasive slip near the entry of the wires into the workpiece.
Le dispositi f de sciage , objet de la présente invention, comprend donc, à proximité du bloc à scier, une pièce dont la forme, par les lois de l'hydrodynamique, augmente localementla pression de l'abrasif au droit de l'entrée du fil dans le matériau à scier. Cette pièce peut être statique ou en rotation. Elle peut être constituée par exemple par un cylindre entraîné par le fil et s' appuyant contre la pièce à scier. Lorsque cette surpression apparaît, les i r r égu l ar i t és d'apport sont aussitôt éliminée et les conditions de sciage se stabilisent. La qualité de sciage devient peu ou pas dépendante des moyens d'alimentation en abrasif.The sawing arrangement, object of the present invention, therefore comprises, near the block to be sawn, a part whose shape, by the laws of hydrodynamics, locally increases the pressure of the abrasive at the entrance of the wire in the material to be sawn. This part can be static or rotating. It can be constituted for example by a cylinder driven by the wire and pressing against the workpiece. When this overpressure appears, the supply irregularities are immediately eliminated and the sawing conditions stabilize. The quality of sawing becomes little or not dependent on the abrasive supply means.
Le dessin annexé illustre schérnatiquernent et à titre d'exemple un dispositif de sciage en accord avec l'invention, ainsi que plusieurs variantes.The appended drawing illustrates schérnatiquernent and by way of example a sawing device in accordance with the invention, as well as several variants.
Fig. 1 - la figure 1 représente schérnatiquernent le cas où les moyens d ' homogénéi sation sont constitués par un cyl indre en rotation. Le cylindre 3 tourne en s' appuyant. sur la pièce à découper 1 et. sur le fil 2 animé d'une vitesse de translation. Une dépression apparaît aux points FI et F3 qui est compensée par une surpression en P2. Le diagramme 4 illustre distribution des pressions de la barbotine abrasive autour du cylindre.Fig. 1 - Figure 1 shows schérnatiquernent the case where the homogenization means are constituted by a cylind indre in rotation. The cylinder 3 rotates by pressing. on the workpiece 1 and. on wire 2 with a translation speed. A depression appears at points FI and F3 which is compensated by an overpressure in P2. Diagram 4 illustrates the distribution of the pressures of the abrasive slip around the cylinder.
Fig. 2 - La figure 2 décrit des moyens d ' homogénéi sat i on fixes provoquant une augmentation de pression de la barbot i ne abrasive 5, de façon similaire à ce qui a été décrit en référence à la figure 1. Ces moyens sont constitués par une paroi fixe 6 disposée è proximité de la pièce à scier 1 et du fil.Fig. 2 - Figure 2 describes means of homogeni sat i on fixed causing an increase in pressure of the abrasive i not 5, similar to what has been described with reference to Figure 1. These means are constituted by a fixed wall 6 disposed near the workpiece 1 and the wire.
Fig. 3 - La figure 3 illustre en perspective un exemple d'application de la présente invention. Le cylindre 3 posé sur la nappe de fils 2 imprégnée du mélange abrasif est entraîné par celui-ci. Il est mis en rotation et est sustanté par le film d'abrasif. Il y a alors apparition d'une pression è l'entrée des fils dans la pièce à scier 1, ce qui stabilise le processus de sciage. De plus, le cylindre égalise les irrégularités locales de débit d'abrasif dues à un mauvais réglage du dispositif d'apport. Le mouvement vertical de la pièce à scier 1 est donné par la table 7. Fig. 4 - La figure 4 représente en élévation un dispositif de sciage comprenant des moyens d'homogénéisation statiques. Une paroi 6 disposée à proximité de la pièce à scier 1 provoque la surpression désirée et l'on constate les mêmes effets que pour le cas précédent. La paroi 6 peut faire partie des moyens d'alimentation en barbotine abrasive.Fig. 3 - Figure 3 illustrates in perspective an example of application of the present invention. The cylinder 3 placed on the web of wires 2 impregnated with the abrasive mixture is driven by the latter. It is rotated and supported by the abrasive film. There is then a pressure at the entry of the wires into the workpiece 1, which stabilizes the sawing process. In addition, the cylinder equalizes local irregularities in abrasive flow due to improper adjustment of the supply device. The vertical movement of the workpiece 1 is given by the table 7. Fig. 4 - Figure 4 shows in elevation a sawing device comprising static homogenization means. A wall 6 disposed near the workpiece 1 causes the desired overpressure and there are the same effects as in the previous case. The wall 6 can be part of the means for supplying abrasive slip.
Fig. 5 - La figure 5 est une coupe schématique d'un dispositif similaire à celui illustré à la figure 3. Deux lingots 1 sont sciés simultanément avec des moyens d ' homogénéisation constitués par un cyl indre 3 posé devant chaque lingot, l'apport en barbotine abrasive 8 étant réalisé au-dessus de chaque cylindre.Fig. 5 - Figure 5 is a schematic section of a device similar to that illustrated in Figure 3. Two ingots 1 are sawn simultaneously with means of homogenization constituted by a cyl indre 3 placed in front of each ingot, the supply of slip abrasive 8 being produced above each cylinder.
Le fil de sciage est généralement constitué d ' acier à ressort d'un diamètre compris entre 0,1 et 0,2 mm, ceci pour des blocs de silicium de 100 mm ou plus de cercle inscrit, coupés en tranches de 0,2 à 1 mm. Il est possible de produire entre 200 et 500 tranches à la fois dans un temps de 5 à 6 heures.The saw wire is generally made of spring steel with a diameter between 0.1 and 0.2 mm, this for silicon blocks of 100 mm or more of inscribed circle, cut into slices of 0.2 to 1 mm. It is possible to produce between 200 and 500 slices at a time in a time of 5 to 6 hours.
Le dispositif décrit dans le présente invention permet de mettre facilement côte à côte plusieurs blocs à scier. La productivité peut alors être doublée ou triplée.The device described in the present invention makes it possible to easily place several blocks to be sawed side by side. Productivity can then be doubled or tripled.
L'abrasif est généralement constitué d'un mélange de liquide sustentateur et d'un solide abrasif. Plus particulièrement, ce mélange peut être constitué d'un milieu acqueux ou d'huile avec des carbures de silicium ou de bore, ou des oxydes d'alumine. Il peut y avoir en plus des agents tensioactifs tel que carboxyrnéthyl cellulose ou glycérine etc. Une pâte de diamant peut également être envisagée. Les moyens d'homogénéisation, par exemple le cylindre 3 ou la paroi 6, peuvent être en métal, acier, aluminium ou autres, ou peuvent comprendre une surface résistant bien â l'usure par abrasi on. I l peut alors s ' agi r de polyuréthane tel que "Adipren" (Dupont) ou "Vulcolan" (Bayer).The abrasive generally consists of a mixture of lifting liquid and an abrasive solid. More particularly, this mixture can consist of an aqueous medium or of oil with silicon or boron carbides, or alumina oxides. There may also be surfactants such as carboxyrnethyl cellulose or glycerin etc. Diamond paste can also be considered. The homogenization means, for example the cylinder 3 or the wall 6, may be made of metal, steel, aluminum or the like, or may comprise a surface which is resistant to abrasion wear. It can then be a polyurethane such as "Adipren" (Dupont) or "Vulcolan" (Bayer).
Ainsi, grâce à l'introduction des moyens d'homogénéisation, le sciage est rendu pratiquement indépendant de l'ajustement de l'apport d'abrasif et permet le sciage de plusieurs lingots simultanés placés côte à côte (fig. 5).Thus, thanks to the introduction of homogenization means, the sawing is made practically independent of the adjustment of the abrasive supply and allows the sawing of several simultaneous ingots placed side by side (fig. 5).
De fait il est possible, avec les moyens d'homogénéisation, d'éliminer pratiquement les défectuosités de découpes et d ' accroître les v itesses de sciage. D e plus, l ' efficaci té de l'action abrasive étant optimale, le fil de sciage voit sa durée de vie augmentée.In fact it is possible, with the means of homogenization, to practically eliminate the cutting defects and to increase the sawing speeds. In addition, the effectiveness of the abrasive action being optimal, the saw wire sees its life increased.
Il est également possible, avec le dispositif de sciage, de découper des matériaux plus durs pour lesquels l'état de surface requis n ' autor isait pas l'utilisation de telle machine auparavant.It is also possible, with the sawing device, to cut harder materials for which the required surface condition did not allow the use of such a machine before.
Naturellement, d'autres types de dispositifs peuvent être envisagés dans le cadre de la présente invention. De fait, les moyens d' homogénéisation peuvent présent er d'autres formes toujours dans l'esprit de maintenir à proximité de l'entrée de la nappe de fxls dans la pièce à scier, une surpression du mélange d ' abras i f donnée hydrodynam i quernent par les mouvements relatifs des moyens d'homogénéisation, du fil et du corps à scier, en présence du mélange d'abrasif.Naturally, other types of device can be envisaged in the context of the present invention. In fact, the homogenization means can present other forms always in the spirit of maintaining near the entry of the sheet of fxls in the workpiece, an overpressure of the abrasive mixture if given hydrodynamic i by the relative movements of the means of homogenization, the wire and the body to be sawn, in the presence of the abrasive mixture.
Par exemple, il serait possible d'imaginer la rotation de la pièce à scier. On peut également envisager l'injection sous pression de la barbotine abrasive au droit de l'entrée du fil dans la pièce a scier ou dans un espace entre la pièce à scier et la paroi 6. Si la pièce â scier n'est pas cylindrique, les moyens d'homogénéisation peuvent être constitués par une plaque épousant le contour de la pièce à proximité de l'entrée de la nappe de fils dans la pièce à scier.For example, it would be possible to imagine the rotation of the workpiece. It is also possible to envisage the injection under pressure of the abrasive slip at the right of the entry of the wire into the workpiece to be sawn or into a space between the workpiece to be sawn and the wall 6. If the workpiece is not cylindrical , the homogenization means can be constituted by a plate conforming to the contour of the workpiece near the entry of the ply of wires into the workpiece.
Lorsque les moyens d'homogénéisation sont constitués par un cylindre, celui-ci peut avoir une structure de surface dans le but d'augmenter le volume de barbotine autour du cylindre. Cette structure peut être constituée par des stries longitudinales ou circulaires ou, d'une façon générale, par des alvéoles dans le surface du cylindre.When the homogenization means consist of a cylinder, this can have a surface structure in order to increase the volume of slip around the cylinder. This structure can be formed by longitudinal or circular ridges or, in general, by cells in the surface of the cylinder.
Lorsque ces moyens sont constitués par une paroi 6, cette dernière peut avoir la forme d'un peigne traversé par la nappe de fi ls. Cette pièce en forme de peigne peut être obtenue par sciage du chant d'une plaque pleine au moyen de la nappe de fils en début de l'opération de sciage de la pièce 1. When these means are constituted by a wall 6, the latter may have the shape of a comb through which the sheet of yarn passes. This comb-shaped part can be obtained by sawing the edge of a solid plate by means of the ply of wires at the start of the sawing operation of part 1.

Claims

RIVENDICATIONSRIVENDICATIONS
1) Dispositif de sciage par fils, comprenant. une nappe de fils (2), susceptible de se déplacer selon un mouvement continu ou alternatif en appui contre une pièce à scier (1) définissant ainsi une zone de sciage, et des moyens d'alimentation en barbotine abrasive (8) destinés à assurer un apport d'abrasif dans la zone de sciage caractér isé en ce qu'il comprend des moyens d'homogénéisation (3, 6) de la pression locale et de la quantité de barbotine abrasive à proximité de l'entrée des fils dans la pièce à scier.1) Wire sawing device, comprising. a ply of wires (2) capable of moving in a continuous or reciprocating movement pressing against a workpiece (1) thus defining a sawing zone, and means for supplying abrasive slip (8) intended to ensure supply of abrasive to the sawing zone, characterized in that it includes means for homogenizing (3, 6) the local pressure and the quantity of abrasive slip near the entry of the wires into the workpiece to saw.
2) Dispositif selon la revendication 1, caractérisé en ce que les moyens d ' homogénéisation sont constitués par une pièce (3, 6) dont. 1 ' enveloppe épouse le contour de la pièce à scier à proximité de la nappe de fils (2).2) Device according to claim 1, characterized in that the homogenization means consist of a part (3, 6) of which. 1 envelope conforms to the contour of the workpiece to be cut close to the ply of wires (2).
3) Dispositif selon la revendi cation 2, caractérisé en ce que les moyens d ' homogénéi sation sont constitués par une pièce dont l'enveloppe suit le contour de la pièce à scier audessus de la nappe de fils.3) Device according to CLAIMS 2, characterized in that the means of homogenization consist of a piece whose envelope follows the outline of the piece to be sawn above the sheet of son.
4) Di spositi f selon la revendication 3, destiné à couper une pièce cylindrique (1), caractérisé en ce que les moyens d'homogénéisati on comprennent un cylindre (3) placé a proximité de la nappist et de la pièce à scier.4) Di spositi f according to claim 3, intended to cut a cylindrical part (1), characterized in that the means of homogenization include a cylinder (3) placed near the nappist and the part to be sawn.
5) Dispositif selon la revendication 4, caractérisé en ce que le cylindre (3) est posé librement sur la nappe de fils.5) Device according to claim 4, characterized in that the cylinder (3) is placed freely on the sheet of son.
6) Dispositif selon la revendication 4, caractérisé en ce que le cylindre (3) est en rotation forcée. 7) Dispositif selon la revendication 5 ou 6, caractérisé ence que le cylindre (3) a une structure de surface.6) Device according to claim 4, characterized in that the cylinder (3) is in forced rotation. 7) Device according to claim 5 or 6, characterized ence that the cylinder (3) has a surface structure.
8) Dispositif selon la revendication 7, caractérisé en ce quela structure de surface est constituée par des stries.8) Device according to claim 7, characterized in that the surface structure is formed by streaks.
9) Dispositif selon la revendication 7, caractérisé en ce quela structure de surface est constituée par des alvéoles.9) Device according to claim 7, characterized in that the surface structure is constituted by cells.
10) Dispositif selon la revendication 3, caractérisé en ceque les moyens d'homogénéisation comprennent une paroi placéeà proximité de la pièce à scier.10) Device according to claim 3, characterized in that the homogenization means comprise a wall placed near the workpiece.
11) Dispositif selon la revendication 10, caractérisé en ceque la paroi (6) fait partie intégrante des moyens d'alimen¬tation en barbotine abrasive.11) Device according to claim 10, characterized in that the wall (6) is an integral part of the means of alimen¬tation abrasive slip.
12) Dispositif selon la revendication 10 ou 11, caractériséen ce que la paroi (6) a une structure de surface.12) Device according to claim 10 or 11, characterized in that the wall (6) has a surface structure.
13) Dispositif selon la revendication 12, caractérisé en ceque la structure de surface est un peigne de même pas que lepas de la nappe de fils.13) Device according to claim 12, characterized in that the surface structure is a comb not the same as the step of the web of wires.
14) Procédé de fabrication du peigne selon la revendication 12, caractérisé en ce que l'on place une paroi pleine que l'on appuie sur la nappe de fils, de façon à créer la struc¬ture finale par sciage, ceci au début. du sciage de la pièce àscier (1). 14) A method of manufacturing the comb according to claim 12, characterized in that one places a solid wall which is pressed on the sheet of son, so as to create the final structure by sawing, this at the start. sawing the workpiece (1).
PCT/CH1989/000083 1988-05-09 1989-05-08 Device for improved sawing of a piece into thin slices WO1989010825A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1747/88-0 1988-05-09
CH174788A CH678298A5 (en) 1988-05-09 1988-05-09 Slicer for materials used in electronic components

Publications (1)

Publication Number Publication Date
WO1989010825A1 true WO1989010825A1 (en) 1989-11-16

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991012915A1 (en) * 1990-03-01 1991-09-05 Charles Hauser Industrial device for sawing parts into thin slices
EP0802029A2 (en) * 1996-04-16 1997-10-22 HAUSER, Charles Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method
GB2361814A (en) * 2000-03-15 2001-10-31 Murata Manufacturing Co Nonreciprocal circuit device comprising cut ferrite

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FR1093328A (en) * 1955-05-03
JPS61100366A (en) * 1984-10-22 1986-05-19 Sumitomo Metal Ind Ltd Wire type multi-strip cutting device
JPS61121871A (en) * 1984-11-19 1986-06-09 Sumitomo Metal Ind Ltd Cutting method for brittle material
JPS61121870A (en) * 1984-11-19 1986-06-09 Sumitomo Metal Ind Ltd Cutting method for brittle material
JPS61125768A (en) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd Method of cutting off fragile material

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Publication number Priority date Publication date Assignee Title
FR1093328A (en) * 1955-05-03
JPS61100366A (en) * 1984-10-22 1986-05-19 Sumitomo Metal Ind Ltd Wire type multi-strip cutting device
JPS61121871A (en) * 1984-11-19 1986-06-09 Sumitomo Metal Ind Ltd Cutting method for brittle material
JPS61121870A (en) * 1984-11-19 1986-06-09 Sumitomo Metal Ind Ltd Cutting method for brittle material
JPS61125768A (en) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd Method of cutting off fragile material

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991012915A1 (en) * 1990-03-01 1991-09-05 Charles Hauser Industrial device for sawing parts into thin slices
EP0802029A2 (en) * 1996-04-16 1997-10-22 HAUSER, Charles Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method
EP0802029A3 (en) * 1996-04-16 2000-06-28 HCT Shaping Systems SA Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method
GB2361814A (en) * 2000-03-15 2001-10-31 Murata Manufacturing Co Nonreciprocal circuit device comprising cut ferrite
GB2361814B (en) * 2000-03-15 2002-10-23 Murata Manufacturing Co A method of manufacturing a nonreciprocal circuit device

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