EP0802029A3 - Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method - Google Patents

Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method Download PDF

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Publication number
EP0802029A3
EP0802029A3 EP97103800A EP97103800A EP0802029A3 EP 0802029 A3 EP0802029 A3 EP 0802029A3 EP 97103800 A EP97103800 A EP 97103800A EP 97103800 A EP97103800 A EP 97103800A EP 0802029 A3 EP0802029 A3 EP 0802029A3
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EP
European Patent Office
Prior art keywords
cutting
single crystal
support
machine
rods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97103800A
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German (de)
French (fr)
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EP0802029A2 (en
EP0802029B1 (en
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
HCT Shaping Systems SA
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Filing date
Publication date
Application filed by HCT Shaping Systems SA filed Critical HCT Shaping Systems SA
Publication of EP0802029A2 publication Critical patent/EP0802029A2/en
Publication of EP0802029A3 publication Critical patent/EP0802029A3/en
Application granted granted Critical
Publication of EP0802029B1 publication Critical patent/EP0802029B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

Abstract

Le procédé et le dispositif de positionnement (1) permet de monter plusieurs monocristaux (2) sur un support (3) en vue d'une découpe simultanée selon des directions bien définies par rapport à la structure cristalline de chaque monocristal; ils suppriment le réglage en machine et minimisent la durée de découpe en procédant à une mise en position hors machine selon des angles de rotation (d,g) obtenus mathématiquement à partir de données mesurées et/ou imposées et qui positionnent chaque monocristal géométrique dans un plan perpendiculaire à la direction de découpage (z''') tout en amenant le plan de découpe de chaque monocristal (2) parallèle à la direction de découpage de la machine. Le dispositif de mise en oeuvre du procédé comprend un châssis (5), un dispositif de préhension (8) monté tournant sur le châssis et portant chacun des monocristaux (2) et un plateau rotatif (11) destiné à maintenir le support de découpage (3) appartenant à la fois au dispositif de positionnement (1) et à la machine de découpage. Par un mécanisme de levage (9), le support (3) et chaque monocristal (2) sont mis en contact et rendus solidaires après avoir obtenu leur orientation relative prédéterminée par rotation autour des axes x et z'''. Le procédé et le dispositif permettent d'obtenir un positionnement exact de chaque monocristal (2) hors machine dans des conditions propices, un montage compact, optimalisé de plusieurs monocristaux sur le support de découpage et un découpage précis avec une productivité maximum.

Figure 00000001
The method and the positioning device (1) makes it possible to mount several single crystals (2) on a support (3) for simultaneous cutting in well-defined directions with respect to the crystal structure of each single crystal; they eliminate machine adjustment and minimize the cutting time by placing the machine outside the position according to rotation angles (d, g) obtained mathematically from measured and / or imposed data and which position each geometric single crystal in a plane perpendicular to the cutting direction (z ''') while bringing the cutting plane of each single crystal (2) parallel to the cutting direction of the machine. The device for implementing the method comprises a frame (5), a gripping device (8) mounted to rotate on the frame and each carrying single crystals (2) and a rotary plate (11) intended to hold the cutting support ( 3) belonging both to the positioning device (1) and to the cutting machine. By a lifting mechanism (9), the support (3) and each single crystal (2) are brought into contact and made integral after having obtained their predetermined relative orientation by rotation around the axes x and z '''. The method and the device make it possible to obtain an exact positioning of each single crystal (2) outside the machine under favorable conditions, a compact, optimized mounting of several single crystals on the cutting support and a precise cutting with maximum productivity.
Figure 00000001
EP97103800A 1996-04-16 1997-03-07 Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method Expired - Lifetime EP0802029B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH00957/96A CH691045A5 (en) 1996-04-16 1996-04-16 A method for the orientation of several crystalline parts placed side by side on a cutting support for a simultaneous cutting in a cutting machine and device for
CH957/96 1996-04-16
CH95796 1996-04-16

Publications (3)

Publication Number Publication Date
EP0802029A2 EP0802029A2 (en) 1997-10-22
EP0802029A3 true EP0802029A3 (en) 2000-06-28
EP0802029B1 EP0802029B1 (en) 2003-04-23

Family

ID=4199111

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97103800A Expired - Lifetime EP0802029B1 (en) 1996-04-16 1997-03-07 Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method

Country Status (5)

Country Link
US (1) US5839424A (en)
EP (1) EP0802029B1 (en)
JP (1) JPH10100139A (en)
CH (1) CH691045A5 (en)
DE (1) DE69721115T2 (en)

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US6106365A (en) * 1998-11-06 2000-08-22 Seh America, Inc. Method and apparatus to control mounting pressure of semiconductor crystals
AU2000251024A1 (en) 2000-05-31 2001-12-11 Memc Electronic Materials S.P.A. Wire saw and process for slicing multiple semiconductor ingots
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DE10052154A1 (en) * 2000-10-20 2002-05-08 Freiberger Compound Mat Gmbh Method and device for separating single crystals, adjusting device and test method for determining an orientation of a single crystal for such a method
US7285168B2 (en) 2004-08-10 2007-10-23 Efg Elektrotechnische Fabrikations-Und Grosshandelsgesellschaft Mnb Method and apparatus for the measurement, orientation and fixation of at least one single crystal
DE102005038639B4 (en) * 2004-08-10 2007-03-08 EFG Elektrotechnische Fabrikations- und Großhandelsgesellschaft mbH Method and device for measuring, aligning and fixing and fixing single crystals on a common carrier
JP2009530798A (en) 2006-01-05 2009-08-27 イルミテックス， インコーポレイテッド Independent optical device for directing light from an LED
US8212868B2 (en) * 2006-03-30 2012-07-03 Gemvision Corporation, L.L.C. Full image jewelry positioner
DE102006032432B3 (en) * 2006-07-13 2007-09-27 Siltronic Ag Saw member for use in combustion engines provides improved power control
US7789531B2 (en) 2006-10-02 2010-09-07 Illumitex, Inc. LED system and method
US7942276B2 (en) * 2007-07-31 2011-05-17 Eric Johnson Rotatable article display device and method for use
US8499940B2 (en) * 2007-07-31 2013-08-06 America's Collectibles Network Rotatable article display device and method
JP5152199B2 (en) * 2007-12-19 2013-02-27 旭硝子株式会社 Ether composition
EP2240968A1 (en) 2008-02-08 2010-10-20 Illumitex, Inc. System and method for emitter layer shaping
TW201009921A (en) * 2008-06-26 2010-03-01 Illumitex Inc Optical device polishing
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
CN101486231B (en) * 2009-01-22 2011-12-07 四川大学 Oriented cutting method for preparing infrared non-linear optics element from yellow copper uniaxial negative crystal
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8259901B1 (en) 2010-05-25 2012-09-04 Rubicon Technology, Inc. Intelligent machines and process for production of monocrystalline products with goniometer continual feedback
EP2520401A1 (en) 2011-05-05 2012-11-07 Meyer Burger AG Method for fixing a single-crystal workpiece to be treated on a processing device
JP2013008769A (en) * 2011-06-23 2013-01-10 Sumitomo Electric Ind Ltd Production method of silicon carbide substrate
CN102886716B (en) * 2011-07-19 2016-02-24 上海汇盛无线电专用科技有限公司 Sapphire ingot face grinding machine
CN102490279B (en) * 2011-11-30 2014-05-28 峨嵋半导体材料研究所 X-ray diffraction oriented cutting method for wire cutting crystal
CN102490278B (en) * 2011-11-30 2014-07-16 峨嵋半导体材料研究所 Directional cutting method of crystal linear cutting laser instrument
CN102490277B (en) * 2011-11-30 2014-05-28 峨嵋半导体材料研究所 Graphic directional cutting method for wire cutting crystal
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
DE102012210047A1 (en) * 2012-06-14 2013-12-19 Crystal-N Gmbh Process for cutting a single crystal
CN103171059B (en) * 2013-03-07 2015-02-25 贵阳嘉瑜光电科技咨询中心 Clamp for real-time crystal orientation measurement of sapphire processing and measuring method thereof
CN103448155B (en) * 2013-08-21 2015-04-08 常州贝斯塔德机械科技有限公司 Angle regulation system used for slicer
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
CN104708719B (en) * 2013-12-13 2016-11-02 无锡斯达新能源科技股份有限公司 A kind of Double-head shaking pendulum-type sapphire wafer excavation machine
JP2017503692A (en) 2013-12-30 2017-02-02 ビーピー・コーポレーション・ノース・アメリカ・インコーポレーテッド Sample preparation device for direct numerical simulation of rock properties
CN104985709B (en) * 2015-06-16 2017-01-11 浙江海纳半导体有限公司 Method for adjusting crystal orientation of single-crystal rod and measuring method
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
CN110900690B (en) * 2019-11-28 2021-06-11 清华大学 Rotary transformation clamping device, rotary transformation cutting system and application
CN111730771B (en) * 2020-06-09 2021-10-29 安徽利锋机械科技有限公司 Wafer cutting machine
CN113427650B (en) * 2021-06-17 2023-03-14 西北工业大学 Method for measuring orientation of directionally solidified alloy single crystal and cutting seed crystal
CN114953225B (en) * 2022-05-17 2023-05-23 河北同光半导体股份有限公司 Method for cutting silicon carbide by single body in oriented mode

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DE2752925A1 (en) * 1977-11-26 1979-05-31 Philips Patentverwaltung Monocrystal alignment and securing equipment suspends in mounting above base aligned with chamber support axis
WO1989010825A1 (en) * 1988-05-09 1989-11-16 Charles Hauser Device for improved sawing of a piece into thin slices
DE19517107A1 (en) * 1994-05-19 1995-11-23 Tokyo Seimitsu Co Ltd Workpiece positioning method for e.g. semiconductor wafer cutting process
EP0738572A1 (en) * 1995-04-22 1996-10-23 HAUSER, Charles Method for orienting monocrystals for cutting in a cutting machine and device for performing the method
EP0782907A1 (en) * 1995-11-30 1997-07-09 Nippei Toyama Corporation System and method for processing ingots

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Patent Citations (5)

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DE2752925A1 (en) * 1977-11-26 1979-05-31 Philips Patentverwaltung Monocrystal alignment and securing equipment suspends in mounting above base aligned with chamber support axis
WO1989010825A1 (en) * 1988-05-09 1989-11-16 Charles Hauser Device for improved sawing of a piece into thin slices
DE19517107A1 (en) * 1994-05-19 1995-11-23 Tokyo Seimitsu Co Ltd Workpiece positioning method for e.g. semiconductor wafer cutting process
EP0738572A1 (en) * 1995-04-22 1996-10-23 HAUSER, Charles Method for orienting monocrystals for cutting in a cutting machine and device for performing the method
EP0782907A1 (en) * 1995-11-30 1997-07-09 Nippei Toyama Corporation System and method for processing ingots

Also Published As

Publication number Publication date
JPH10100139A (en) 1998-04-21
CH691045A5 (en) 2001-04-12
DE69721115D1 (en) 2003-05-28
EP0802029A2 (en) 1997-10-22
EP0802029B1 (en) 2003-04-23
DE69721115T2 (en) 2003-12-24
US5839424A (en) 1998-11-24

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