CN102886716B - Sapphire ingot face grinding machine - Google Patents
Sapphire ingot face grinding machine Download PDFInfo
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- CN102886716B CN102886716B CN201110201707.5A CN201110201707A CN102886716B CN 102886716 B CN102886716 B CN 102886716B CN 201110201707 A CN201110201707 A CN 201110201707A CN 102886716 B CN102886716 B CN 102886716B
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- grinding machine
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Abstract
The invention provides a kind of sapphire ingot face grinding machine, belong to process equipment field, its primary structure comprises surface grinding machine, C is to direction finder, rotating disk, special fixture, emery wheel, X-Y grating display system and trimming rack, on lathe bed, equipment has alpha cellulose a gage to show and grating scale, X-Y grating display system is installed within the stroke of the grinding machine X-Y direction of motion, rotating disk is provided with special fixture, the technique main flow of its end surface grinding comprises raw material and fixes, to center, molecules align is directed, grinding, special fixture all adjustable angle in two mutually perpendicular directions do so, emery wheel is diamond material, grinding workpiece surface roughness can reach Ra < 0.8mm, ± 0.01mm/2 inch can be reached by mill surface planarity, present invention omits complicated fixture, adopt the method for similar on-line measurement, make the raising that machining accuracy, working (machining) efficiency are larger, alleviate the labour intensity of operator simultaneously.
Description
Technical field
The present invention relates to a kind of process equipment, particularly relating to a kind of grinding machine for processing sapphire ingot end face, especially, present invention also offers the method utilizing this grinding machine to carry out the processing of sapphire ingot end face.
Background technology
Sapphire crystal is a kind of outstanding multifunctional material, has the features such as hardness is high, fusing point is high, light transmission is good, electrical insulating property is excellent, stable chemical performance, but typical difficult processing hard brittle material.
Cylindric sapphire material must carry out fine grinding to its biend before section, makes its rough surface and profile reach following requirement:
A. surface roughness reaches Ra0.8;
B. surface profile and sapphire molecules align are at C to parallel, and its not parallel franchise is within 5 seconds.
Prior art utilizes special fixture and x-ray instrument sapphire ingot are fixed and adjust to grinding state, then related fixture is placed in Grinder bench face and carries out grinding, this technique has two shortcomings: after the first twice clamping, the precision originally mixed up may change, it two is that fixture adds that crystal bar deadweight is light, and operator's muscle power can not adapt to.
Summary of the invention
In order to solve Problems existing and deficiency in the processing of existing sapphire biend, the invention provides a kind of sapphire ingot face grinding machine, for carrying out fine grinding to cylindric sapphire ingot material end face, the present invention also aims to the processing method that a kind of sapphire ingot material end face is provided.
The technical solution adopted in the present invention is as follows:
Sapphire ingot face grinding machine, primary structure comprises surface grinding machine, C is to direction finder, special fixture, rotating disk, X-Y grating display system and trimming rack, surface grinding machine table top is provided with protective cover, surface grinding machine one middle side part has a column, on lathe bed, equipment has alpha cellulose a gage to show and grating scale, C is to direction finder, Y grating shows, trimming rack is installed on grinding machine column, X-Y grating display system is installed within the stroke of the grinding machine X-Y direction of motion, emery wheel is installed on the electric machine main shaft in surface grinding machine through bistrique frame, rotating disk is fixed on grinding machine table top, rotating disk is provided with special fixture.
Described surface grinding machine, the emery wheel of this grinding machine is diamond material.
Described C is to direction finder, comprise ray generator, ray receiver, direction finder and directional display, be loaded on the left of grinder head column, be used for measuring sapphire crystal ingot molecules align direction, to adjust the angle of workpiece planarization and grinding machine table top, thus ensure that grinding in-plane reaches required requirement, utilize lift motor to realize fast lifting, when gage outfit and workpiece face close to time, by trimming hand wheel manual adjustments gage outfit height.
Above-mentioned special fixture and disk combination, being used for clamping is ground crystal ingot, utilizes x-ray instrument and rotating disk, can accurate adjustment workpiece by the inclination angle of flat surface grinding, thus reach grinding requirement.
Above-mentioned X-Y grating display system, the display of X-ray grid is installed on lathe bed left surface, X-ray grid chi is installed on protective cover bottom, Y grating scale is installed on lathe bed right flank, grating display system is installed within the stroke of the grinding machine X-Y direction of motion, be used for finding out the home position of cylinder crystal ingot, the heart position so that x-ray instrument gauge head is placed in one, improve certainty of measurement.
Above-mentioned trimming rack upper end is provided with lift motor, trimming hand wheel, x-ray instrument and gage outfit, and x-ray instrument and gage outfit can move up and down along fluctuating orbit.
A kind of technique utilizing present device to carry out sapphire end grinding provided by the invention, main flow comprises that raw material is fixed, grinding directed to center, molecules align, and concrete steps are:
1) special fixture is utilized to fix sapphire ingot blank; It is adjustable that special fixture realizes two dimension, and its angle adjustment scope is 3 ° ~ 5 °, and special fixture is fixed on rotating disk in plane, and rotating disk is fixed on Grinder bench;
2) to center: utilize direction finder to carry out workpiece to center, orientation is adjusted to parallel with the grinding machine table top direction of motion, utilize wheel grinding original facet surface, end face after grinding must orientation parallel, again with the end face parallel with molecules align for benchmark, be cut into the wafer meeting its optical quality;
3) molecules align is directed: again with the end face parallel with molecules align for benchmark, the wafer be cut into will meet its optical quality; If α
1for the angle that X-ray and molecules align direction are formed, α
2for the angle that molecules align direction after X ray reflection is formed, work as α
1with α
2time equal, namely crystal bar grinding position has adjusted;
4) grinding, by emery wheel, grinding is carried out to raw material, after requiring grinding, sapphire ingot end face surface roughness should reach 0.8, cylindric sapphire ingot molecules align direction and original facet surface not parallel, itself and original facet surface shape α in an angle, require that angle α angular error is not more than ± 5 ' (with molecules align direction).
Above-mentioned special fixture all adjustable angle in two mutually perpendicular directions do so.
Above-mentioned emery wheel is diamond material, and grinding workpiece surface roughness reaches Ra<0.8 μm, is reached ± 0.01mm by mill surface planarity.
Compared with current technology, the present invention only needs clamped one time, and precision is high, not only eliminates complicated fixture, and changes the physical load of light work work.
The present invention is by organic reasonable combination of measuring instrument and machining tool, measuring instrument and special fixture coordinate conbined usage, adopt the method for similar on-line measurement, make that machining accuracy is more stable, working (machining) efficiency is greatly improved, dramatically reduce the labour intensity of operator simultaneously.
Accompanying drawing explanation
Fig. 1 is one embodiment of the invention structural representation;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is molecules align orientation principle schematic diagram of the present invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described further
In figure: 1-lathe bed, 2-surface grinding machine table top, 3-rotating disk, 4-special fixture, 5-crystal, 6-emery wheel, 7-column, 8-protective cover, 90-Y grating shows, and 91-X grating shows, and 92-X is to grating scale, and 93-Y is to grating scale, 100-lift motor, 101-trimming hand wheel, 102-X alpha cellulose a gage, 103-gage outfit, 61
-bistrique frame, 11-C to direction finder, 110-X ray receiver, 111-X ray generator, 112-direction finder installing plate, 113-C to direction finder, 114-directional display, α
1for the angle that X-ray and molecules align direction are formed, α
2for the angle that molecules align direction after X ray reflection is formed.
As Fig. 1, embodiment illustrated in fig. 2, sapphire ingot face grinding machine, primary structure comprises surface grinding machine, C is to direction finder, rotating disk, X-Y grating display system and trimming rack, surface grinding machine table top is provided with protective cover, surface grinding machine one middle side part has a column, on lathe bed, equipment has alpha cellulose a gage to show and grating scale, C is to direction finder, Y grating shows, trimming rack is installed on grinding machine column, X-Y grating display system is installed within the stroke of the grinding machine X-Y direction of motion, emery wheel is installed on the electric machine main shaft in surface grinding machine through bistrique frame, rotating disk is fixed on grinding machine table top, rotating disk is provided with special fixture.
Described surface grinding machine, the emery wheel of this grinding machine is diamond material.
Described C is to direction finder, comprise ray generator, ray receiver, direction finder and directional display, be loaded on the left of grinder head column, be used for measuring sapphire crystal ingot molecules align direction, to adjust the angle of workpiece planarization and grinding machine table top, thus ensure that grinding in-plane reaches required requirement, utilize lift motor to realize fast lifting, when gage outfit and workpiece face close to time, by trimming hand wheel manual adjustments gage outfit height.
Above-mentioned special fixture and disk combination, being used for clamping is ground crystal ingot, utilizes x-ray instrument and rotating disk, can accurate adjustment workpiece by the inclination angle of flat surface grinding, thus reach grinding requirement.
Above-mentioned X-Y grating display system, the display of X-ray grid is installed on lathe bed left surface, X-ray grid chi is installed on protective cover bottom, Y grating scale is installed on lathe bed right flank, grating display system is installed within the stroke of the grinding machine X-Y direction of motion, be used for finding out the home position of cylinder crystal ingot, the heart position so that x-ray instrument gauge head is placed in one, improve certainty of measurement.
Above-mentioned trimming rack upper end is provided with lift motor, trimming hand wheel, x-ray instrument and gage outfit, and x-ray instrument and gage outfit can move up and down along fluctuating orbit.
A kind of technique utilizing present device to carry out sapphire ingot end surface grinding provided by the invention, main flow comprises that raw material is fixed, grinding directed to center, molecules align, and concrete steps are:
1) combination special fixture is utilized by sapphire ingot blank to fix; It is adjustable that special fixture realizes two dimension, and its angle adjustment scope is 3 ° ~ 5 °, and special fixture is fixed on rotating disk in plane, and rotating disk is fixed on Grinder bench;
2) to center: utilize C to carry out raw material to center to direction finder, orientation is adjusted to parallel with the grinding machine table top direction of motion, utilize wheel grinding original facet surface, end face after grinding must orientation parallel, again with the end face parallel with molecules align for benchmark, be cut into the wafer meeting its optical quality;
3) molecules align is directed: again with the end face parallel with molecules align for benchmark, the wafer be cut into will meet its optical quality; As shown in Figure 3, α is worked as
1with α
2time equal, namely crystal bar grinding position has adjusted, and can enter grinding link;
4) grinding, by emery wheel, grinding is carried out to raw material, after requiring grinding, sapphire ingot end face surface roughness should reach 0.8, cylindric sapphire ingot molecules align direction and original facet surface not parallel, itself and original facet surface shape α in an angle, require that angle α angular error is not more than ± 5 ' (with molecules align direction).
Above-mentioned special fixture all adjustable angle in two mutually perpendicular directions do so.
Above-mentioned emery wheel is diamond material, and grinding workpiece surface roughness reaches Ra<0.8 μm, is reached ± 0.01mm by mill surface planarity.
Compared with current technology, the present invention only needs clamped one time, and precision is high, not only eliminates complicated fixture, and changes the physical load of light work work.
Claims (8)
1. a sapphire ingot face grinding machine, structure comprises surface grinding machine, C is to direction finder, rotating disk, surface grinding machine one middle side part has a column, it is characterized in that, structure also comprises special fixture, X-Y grating display system and trimming rack, surface grinding machine table top is provided with protective cover, on lathe bed, equipment has alpha cellulose a gage to show and grating scale, C is to direction finder, Y grating shows, trimming rack is installed on grinding machine column, X-Y grating display system is installed within the stroke of the grinding machine X-Y direction of motion, emery wheel is installed on the electric machine main shaft in surface grinding machine through bistrique frame, rotating disk is fixed on grinding machine table top, rotating disk is provided with special fixture.
2. sapphire ingot face grinding machine according to claim 1, is characterized in that, described surface grinding machine, and the emery wheel of this grinding machine is diamond material.
3. sapphire ingot face grinding machine according to claim 1, it is characterized in that, described C is to direction finder, comprise ray generator, ray receiver, direction finder and directional display, be loaded on the left of grinder head column, be used for measuring sapphire crystal ingot molecules align direction, to adjust the angle of workpiece planarization and grinding machine table top, thus ensure that grinding in-plane reaches required requirement, lift motor is utilized to realize fast lifting, when gage outfit and workpiece face close to time, by trimming hand wheel manual adjustments gage outfit height.
4. according to sapphire ingot face grinding machine according to claim 1, it is characterized in that, described special fixture and disk combination, being used for clamping is ground crystal ingot, and combines and utilize x-ray instrument and rotating disk, and accurate adjustment workpiece is by the inclination angle of flat surface grinding.
5. according to sapphire ingot face grinding machine according to claim 1, it is characterized in that, the display of X-ray grid is installed on lathe bed left surface, X-ray grid chi is installed on protective cover bottom, Y grating scale is installed on lathe bed right flank, grating display system is installed within the stroke of the grinding machine X-Y direction of motion, finds the home position of cylinder crystal ingot, and x-ray instrument and gauge head are placed in one heart position.
6. according to sapphire ingot face grinding machine according to claim 1, it is characterized in that, described trimming rack upper end is provided with lift motor, trimming hand wheel, x-ray instrument and gage outfit, and x-ray instrument and gage outfit can move up and down along fluctuating orbit.
7. utilize the sapphire ingot face grinding machine described in claim 1 to carry out the technique of sapphire ingot end surface grinding, it is characterized in that, main flow comprises that raw material is fixed, grinding directed to center, molecules align, and concrete steps are:
1) special fixture is utilized to fix sapphire ingot blank; It is adjustable that special fixture realizes two dimension, and its angle adjustment scope is 3 ° ~ 5 °, and special fixture is fixed on rotating disk in plane, and rotating disk is fixed on Grinder bench;
2) to center: utilize direction finder to carry out workpiece to center, orientation is adjusted to parallel with the grinding machine table top direction of motion, utilize wheel grinding original facet surface, end face after grinding must orientation parallel, again with the end face parallel with molecules align for benchmark, be cut into the wafer meeting its optical quality;
3) molecules align is directed: again with the end face parallel with molecules align for benchmark, if α 1 is the angle that X-ray and molecules align direction are formed, α 2 is the angle that after X ray reflection, molecules align direction is formed, and when α 1 is equal with α 2, namely crystal bar grinding position has adjusted;
4) grinding, by emery wheel, grinding is carried out to raw material, after requiring grinding, the surface roughness of sapphire ingot end face should reach 0.8 μm, cylindric sapphire ingot molecules align direction and original facet surface not parallel, itself and original facet surface shape α in an angle, require angle α angular error be not more than ± 5 '.
8. carry out the technique of sapphire ingot end surface grinding according to sapphire ingot face grinding machine according to claim 7, it is characterized in that, described special fixture all adjustable angle in two mutually perpendicular directions do so.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110201707.5A CN102886716B (en) | 2011-07-19 | 2011-07-19 | Sapphire ingot face grinding machine |
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|---|---|---|---|
| CN201110201707.5A CN102886716B (en) | 2011-07-19 | 2011-07-19 | Sapphire ingot face grinding machine |
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| CN102886716B true CN102886716B (en) | 2016-02-24 |
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| CN109227297A (en) * | 2018-11-19 | 2019-01-18 | 洛阳Lyc轴承有限公司 | Reduction process device and its processing method are beaten in the soft region of turntable bearing axial direction raceway |
| CN110405603A (en) * | 2019-08-19 | 2019-11-05 | 安吉圆磨机械科技有限公司 | A kind of carborundum crystals Special shaping all-in-one machine |
| CN110587428A (en) * | 2019-10-09 | 2019-12-20 | 青岛高测科技股份有限公司 | Device and method for calibrating center of Notch groove formed in semiconductor crystal bar |
| CN112873583B (en) * | 2021-03-09 | 2022-03-25 | 北京理工大学 | Low-damage processing method based on sapphire crystal orientation and processing direction synergistic principle |
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| US4662124A (en) * | 1980-11-17 | 1987-05-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of grinding a sapphire wafer |
| EP0802029A2 (en) * | 1996-04-16 | 1997-10-22 | HAUSER, Charles | Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method |
| US6159284A (en) * | 1998-06-04 | 2000-12-12 | Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag | Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers |
| RU2284073C1 (en) * | 2005-02-24 | 2006-09-20 | Михаил Викторович Варакин | Method for producing monocrystal wafers |
| CN101036973A (en) * | 2007-03-29 | 2007-09-19 | 上海大学 | Method and device for the on-line measuring roundness level of high-precision roller grinder and roller shape error |
| JP2011031387A (en) * | 2009-07-10 | 2011-02-17 | Mitsubishi Chemicals Corp | Crystal slicing method |
| CN102092004A (en) * | 2010-12-17 | 2011-06-15 | 上海机床厂有限公司 | Grinding-carriage feed system of numerical control grinder |
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2011
- 2011-07-19 CN CN201110201707.5A patent/CN102886716B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4662124A (en) * | 1980-11-17 | 1987-05-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of grinding a sapphire wafer |
| EP0802029A2 (en) * | 1996-04-16 | 1997-10-22 | HAUSER, Charles | Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method |
| US6159284A (en) * | 1998-06-04 | 2000-12-12 | Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag | Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers |
| RU2284073C1 (en) * | 2005-02-24 | 2006-09-20 | Михаил Викторович Варакин | Method for producing monocrystal wafers |
| CN101036973A (en) * | 2007-03-29 | 2007-09-19 | 上海大学 | Method and device for the on-line measuring roundness level of high-precision roller grinder and roller shape error |
| JP2011031387A (en) * | 2009-07-10 | 2011-02-17 | Mitsubishi Chemicals Corp | Crystal slicing method |
| CN102092004A (en) * | 2010-12-17 | 2011-06-15 | 上海机床厂有限公司 | Grinding-carriage feed system of numerical control grinder |
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