JPH0813457B2 - Semiconductor cutting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a semiconductor cutting apparatus for sequentially cutting a work (ingot) such as a silicon single crystal rod by an inner peripheral blade (blade) to obtain a large number of wafers. Regarding

[Conventional technology]

Conventionally, this type of semiconductor cutting device is provided with a displacement sensor for detecting the warp of the inner peripheral blade during the cutting work. Then, based on the detection result of the warp of the inner peripheral blade by the displacement sensor, the cut surface shape of the cut semiconductor single crystal ingot is calculated and used as the judgment data of the quality of the wafer.

[Problems to be Solved by the Invention]

By the way, in the above-mentioned conventional displacement sensor,
As shown in the figure, the installation position is displaced left and right (shifted to the right in FIG. 3) from the work (ingot) 1 to be cut. In the figure, reference numeral 2 indicates an inner peripheral blade, and 3 indicates a displacement sensor.

However, when the position of the displacement sensor 3 is far away from the cutting position of the workpiece 1 of the inner peripheral blade 2 as in the above-described conventional case, the displacement of the inner peripheral blade 2 is not necessarily equivalent to the shape of the cut surface of the workpiece 1. There is a problem that the cut surface shape of the work 1 which is the original measurement purpose cannot be accurately grasped.

The present invention has been made in view of the above circumstances, and an object thereof is to be able to measure the displacement of the portion of the inner peripheral blade that is directly involved in the cutting of the workpiece, and to cut the cut semiconductor unit. It is an object of the present invention to provide a semiconductor cutting device capable of accurately grasping the cut surface shape of a crystal rod.

[Means for solving the problem]

In order to achieve the above object, the present invention provides a displacement sensor for measuring the displacement of the inner peripheral blade at a position facing the inner peripheral blade with the workpiece being cut therebetween.

[Action]

In the semiconductor cutting device of the present invention, the displacement sensor provided at a position facing the inner peripheral blade across the workpiece being cut, the displacement of the portion of the inner peripheral blade, which is directly involved in the cutting of the workpiece, , Through the work.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a front view showing an embodiment of a semiconductor cutting device of the present invention, and FIG. 2 is a side view of the same. In these figures,
Reference numeral 10 denotes an inner peripheral blade, and this inner peripheral blade 10 is one in which an abrasive grain portion 12 is formed by electrodeposition on an inner peripheral portion of a thin plate donut-shaped base metal 11. The inner peripheral blade is attached to a rotating body rotatably supported by an air bearing (not shown) so as to rotate at a fixed position around an axis passing through the center thereof. Also, in the central space of the inner peripheral blade 10,
A semiconductor single crystal ingot (work) 13 to be cut is arranged, and the semiconductor single crystal ingot is cut by a cutting and feeding device (not shown).
While 13 is moved from the bottom to the top, the abrasive grain portion 12
The wafer is obtained by being cut by.

Further, reference numeral 14 is a displacement sensor such as a magnetic sensor or an eddy current sensor for measuring the displacement of the inner peripheral blade 10. The displacement sensor 14 is arranged so as to face a portion of the inner peripheral blade 10 directly involved in the cutting of the semiconductor single crystal ingot 13 and rotatably rotates the rotating body to which the inner peripheral blade 10 is attached. It is fixed to the fixed part that it supports. Then, between the inner peripheral blade 10 and the displacement sensor 14, there is provided an interval (an interval slightly larger than the thickness of the cut wafer) through which the semiconductor single crystal ingot 13 being cut can enter. .

In the semiconductor cutting device configured as described above,
Similarly to the conventional case, the semiconductor single crystal ingot 13 is inserted into the central portion of the inner peripheral blade 10 and moved in the vertical direction, so that the semiconductor single crystal ingot 13 is cut as a thin wafer and sequentially collected one by one.

In this case, while the semiconductor single crystal ingot 13 is being cut, the deformation of the inner peripheral blade 10 is detected by the displacement sensor 14 over the cutting portion 13a of the semiconductor single crystal ingot 13. Then, the displacement data of the inner peripheral blade 10 detected by the displacement sensor 14 is a cut surface shape of the semiconductor single crystal ingot 13 being cut and the front and back are integrated, and between the inner peripheral blade 10 and the displacement sensor 14. Since the cutting portion 13a located at the semiconductor does not affect the displacement sensor 14 with the semiconductor, the accurate displacement of the inner peripheral blade 10, the cutting semiconductor single crystal rod
13 cut surface shapes are obtained.

〔The invention's effect〕

As described above, the present invention provides the displacement sensor for measuring the displacement of the inner peripheral blade at a position facing the inner peripheral blade across the workpiece being cut. By measuring the displacement of the peripheral blade, which is directly involved in the cutting of the workpiece, through the workpiece,
The state of the inner peripheral blade at the time of cutting and the cut surface shape of the cut semiconductor single crystal ingot can be accurately grasped. Therefore, the cutting performance of the inner peripheral blade can be surely controlled, the quality of the cut wafers can be easily ranked, the defective wafer can be prevented from flowing to the subsequent process, and the measurement operation can be simplified. Have the effect.

[Brief description of drawings]

1 and 2 show an embodiment of the present invention.
FIG. 1 is a front view, FIG. 2 is a side view, and FIG. 3 is a front view of a conventional semiconductor cutting device. 10 …… Inner peripheral blade, 13 …… Semiconductor single crystal rod (work), 14…
… Displacement sensor.

Claims (1)

[Claims] 1. A semiconductor cutting apparatus for cutting a work by an inner peripheral blade to obtain a wafer, wherein a displacement sensor for measuring the displacement of the inner peripheral blade is opposed to the inner peripheral blade with the work being cut being sandwiched therebetween. A semiconductor cutting device, which is provided at a position where