JPS61125768A - Method of cutting off fragile material - Google Patents
Method of cutting off fragile materialInfo
- Publication number
- JPS61125768A JPS61125768A JP24539184A JP24539184A JPS61125768A JP S61125768 A JPS61125768 A JP S61125768A JP 24539184 A JP24539184 A JP 24539184A JP 24539184 A JP24539184 A JP 24539184A JP S61125768 A JPS61125768 A JP S61125768A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- cutting
- cut
- slit
- slit nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分計
この発明は、半導体材料、磁性材料、セラミックス等の
いわゆる脆性材料を、ワイヤと砥粒を含む加工液または
酸を含む切削液(以下加工液という)とくより切断(切
込みを含む)する方法に関する。DETAILED DESCRIPTION OF THE INVENTION Industrial Application This invention is a method for processing so-called brittle materials such as semiconductor materials, magnetic materials, and ceramics using a machining fluid containing wires and abrasive grains or a cutting fluid containing acid (hereinafter referred to as machining fluid). ) In particular, it relates to a method of cutting (including notching).
従来技術とその問題点
半導体材料等の脆性材料を切断する一つの方法としては
、ワイヤを被切断部材Ktl接させつつ砥粒を含む加工
液を供給して切断する方式のワイ、ヤソーがある。その
切断方法を説明すると、第6図にその一例を示すごとく
、複数の溝ローフ(1)相互間にわたって所定間隔で平
行にワイヤ(2)を張設し、このワイヤ部分く被切断部
材(3)を押し当てながらワイヤを走行させるとと−に
、被切断部材(3)の上方に設けた加工液供給多孔ノズ
A/(41より砥粒を含む加工液を被切断部に供給して
切断している。(5)は被切断部材押上げ台である。上
記加工液供給多孔ノズル(4Jは、被切断部材(3)K
沿って一定間隔に多数の孔が穿設されたものであり、番
孔より加工液がいわば線状に落下して被切断部材の上に
供給されるようKなっている。Prior Art and Its Problems One method for cutting brittle materials such as semiconductor materials is a wire saw, which cuts by supplying a machining fluid containing abrasive grains while bringing the wire into contact with the member to be cut Ktl. To explain the cutting method, as shown in FIG. 6, wires (2) are stretched in parallel at predetermined intervals between a plurality of grooved loaves (1), and the wire portions are cut into pieces (3). ) is pressed while the wire runs, and at the same time, machining liquid containing abrasive grains is supplied to the part to be cut from the machining liquid supply porous nozzle A/(41) provided above the part to be cut (3), and the part to be cut is cut. (5) is a platform for pushing up the workpiece to be cut.The above-mentioned machining fluid supply porous nozzle (4J is for pushing up the workpiece (3)K
A large number of holes are drilled at regular intervals along the length of the cutter, and the machining fluid is arranged so that it falls in a line from the holes and is supplied onto the workpiece to be cut.
しかし、このような加工液供給多孔ノズ〃を用いて切断
加工する方法では、切断用ワイヤ(2)と被切断部材(
3)の摺接部KIIiI−かつ十分な加工液の供給が行
なわれず、被切断部材の加工精度(表面粗さ、疵)およ
び切断能率の低下を招く上、ワイヤの摩耗が蕾しく、断
線事故等のトップ〃が発生することもあった。However, in the cutting method using such a machining fluid supply porous nozzle, the cutting wire (2) and the workpiece to be cut (
3) Sliding contact part KIIIiI- and sufficient machining fluid is not supplied, leading to a decrease in machining accuracy (surface roughness, flaws) and cutting efficiency of the workpiece to be cut, as well as premature wear of the wire, resulting in wire breakage accidents. etc., sometimes occurred.
発 明 の 目 的
この発明は、従来の前記問題を解決するためになされた
ものであり、加工液が常に均一かつ十分に供給されて、
切断能率および加工精度の向上がはかられ、かつワイヤ
の摩耗を著しく軽減し得る脆性材料の切断方法を機業す
ることを目的とするものである。Purpose of the Invention This invention was made to solve the above-mentioned conventional problems, and it is possible to ensure that the machining fluid is always uniformly and sufficiently supplied.
The purpose of this invention is to develop a method for cutting brittle materials that can improve cutting efficiency and processing accuracy and significantly reduce wire wear.
発 明 の 構 成
この発明に係ろ脆性材料の切断方法は、ワイヤを被切断
部材KJ’1lll!せしめつつ、加工液を供給して切
断する方法において、被切断部材(沿うスリット状の流
出孔を有するスリットノズルを用い、砥粒を含む加工液
を前記スリットノズMよシ供給することを特徴とするも
のである。Structure of the Invention The method for cutting a brittle material according to the present invention includes cutting a wire into a member to be cut KJ'1llll! The method of cutting by supplying machining liquid while cutting the workpiece is characterized in that a slit nozzle having a slit-shaped outflow hole along the cut member is used, and a machining liquid containing abrasive grains is supplied through the slit nozzle M. It is something.
以下、この発明方法を図面に基づいて説明する。The method of this invention will be explained below based on the drawings.
第1図はこの発明方法を実施する丸めの装置の一例を示
すもので、被切断部材に沿う一定間隔に多数の孔が穿設
された従来の加工液供給多孔ノズ〃に替えて、被切断部
材の長軸方向にスリット状の流出孔(至)を有する加工
液供給スリットノズ1vaaを用い、このスリットノズ
ルよシ加工液を水幕状に流下させて切断する方法でめる
。Fig. 1 shows an example of a rounding device for carrying out the method of the present invention. Using a machining fluid supply slit nozzle 1vaa having a slit-like outflow hole in the longitudinal direction of the member, cutting is performed by causing the machining fluid to flow down through the slit nozzle in the form of a water curtain.
また、他の方法として、第2図に示すごとく、従来の加
工液供給多孔ノズIv(41の真下に、下部開口部が被
切断部材(3)K沿うスリット状となしたホッパー状の
スリットノズルαeを設け、加工液供給ノズ〃(4Jよ
シ流下する加工液をホッパー状のスリットノズ/I/(
至)で受けて、ワイヤ(2)と被切断部材(3)の摺接
部に加工液を水幕状に流下させて供給する方法を採用す
ることができる。As another method, as shown in Fig. 2, a hopper-shaped slit nozzle with a lower opening formed in a slit shape along the cut member (3) K is used directly below the conventional machining fluid supply porous nozzle Iv (41). A hopper-shaped slit nozzle /I/(
(to), and a method can be adopted in which the machining fluid is supplied by flowing down in a water curtain shape to the sliding contact portion between the wire (2) and the member to be cut (3).
上記第1図および第2図に示した方法は、いずれも被切
断部材とワイヤの摺接部のみKi[l’加工液を供給し
て切断する方法でめろが、ts3図に示すごとく、第1
図に示すスリットノズルa番の両側に枝管αりを介して
同じ構造OスリットノズA/ (14−1)を取付け、
中央のスリットノズ/v041から被切断部材(3)と
ツイヤ(2)との摺接部に、左右のスリットノズu(1
4−1)からはワイヤ(2)にセれぞれ加工液を水幕状
に流下させて供給し切断する方法をとることもできる。In both of the methods shown in FIGS. 1 and 2 above, cutting is performed by supplying Ki[l' machining fluid only to the sliding contact portion between the workpiece and the wire. 1st
Attach the O slit nozzle A/ (14-1) of the same structure to both sides of the slit nozzle number a shown in the figure via a branch pipe α,
Left and right slit nozzles u (1
From 4-1), it is also possible to adopt a method of supplying the machining fluid to each wire (2) by flowing it down in the form of a water curtain and cutting.
さらに、第4図に示すごとく、中央のノズルは上記と同
様スリットノズtv(141とし、左右のノズ〃を従来
と同様の加工液供給多孔ノズ〃(4)またはスリットノ
ズpとし、この多孔ノズ〃の下にホラ/(−状のスリッ
トノズtv (16−1)を設け、被切断部材(3)と
ツイヤ(2)との摺接部およびワイヤ部分に加工液を水
幕状に流下させて供給し切断する方法でるる。Furthermore, as shown in FIG. 4, the center nozzle is the same slit nozzle tv (141) as described above, and the left and right nozzles are the same machining fluid supply porous nozzle (4) or slit nozzle p as before. A hollow/(--shaped slit nozzle tv (16-1) is provided at the bottom, and the machining liquid is supplied by flowing down in a water curtain shape to the sliding contact area between the member to be cut (3) and the wire (2) and the wire area. How to cut it.
また、第5図は第4図に示すホッパー状のスリットノズ
/I/に替えて、断面が逆T字形のスリットノズ/l’
(16−2)を用いた場合で、この場合はスリットノズ
/L’(16−2)の中をワイヤ(2)を通し、加工液
中にワイヤが浸漬された状顔で切断が行なわれる。In addition, in place of the hopper-shaped slit nozzle /I/ shown in FIG. 4, FIG.
(16-2), in which case the wire (2) is passed through the slit nozzle/L' (16-2) and cutting is performed with the wire immersed in the machining liquid.
なお、このスリットノズルを用いた場合は被切断部材(
3)とワイヤ(2)との摺接部にも加工液が供給される
ので、中央のスリットノズ/vQ4を省略しても特に支
障はない。上記スリットノズ/’ (16−2)はその
中にワイヤ(2)を通す関係上、図示のごとく2分割構
造となっており、両端部に突設した鍔部(181をボル
ト・ナツト0優で締付けて一体化する。なお、一方向走
行切断の場合は被切断部材に対するワイヤ入側のみにス
リットノズルを設置してもよい。Note that when using this slit nozzle, the workpiece to be cut (
3) and the wire (2), the machining fluid is also supplied to the sliding contact portion, so there is no particular problem even if the central slit nozzle /vQ4 is omitted. The slit nozzle/' (16-2) has a two-part structure as shown in the figure in order to pass the wire (2) through it. Tighten and integrate.In the case of unidirectional traveling cutting, the slit nozzle may be installed only on the wire entry side with respect to the member to be cut.
発明の作用効果
この発明方法は上記のごとくスリットノズμを用い、加
工液を水幕状にして供給しながら切断する方法であり、
第1図の場合はスリットノズwa41よシ加工液が被切
断部材(3)とワイヤ(2)とのl’lFM’部に水幕
状に供給されながら切断される。また、第2図の場合は
多孔ノズ/%/(41よシ流出した加工液がホッパー状
のスリットノズ#at9に受けられて、加工液の圧力不
均一が々くなるため容易に加工液の水幕ができ被切断部
材(3)とワイヤ(2)との摺接部に水幕が供給され切
断が行なわれる。Effects of the Invention The method of the invention uses the slit nozzle μ as described above to cut while supplying machining liquid in the form of a water curtain.
In the case of FIG. 1, the slit nozzle wa41 supplies cutting fluid to the l'lFM' portion of the member to be cut (3) and the wire (2) in the form of a water curtain while cutting. In addition, in the case of Fig. 2, the machining fluid flowing out from the porous nozzle /%/(41) is received by the hopper-shaped slit nozzle #at9, and the pressure unevenness of the machining fluid increases, making it easy for the machining fluid to water. A curtain is formed, and the water curtain is supplied to the sliding contact portion between the member to be cut (3) and the wire (2), and cutting is performed.
第3図の場合は、中央のスリットノズA/(141およ
び該ツメμの両側のスリットノズル(14−1)より、
それぞれ加工液が被切断部材(3)とワイヤ(2)との
摺接部およびワイヤ部分に水幕状に供給されなカニら切
断が行なわれる。第4図の場合は、中央のスリットノズ
tvlllJから加工液が被切断部材(3)とワイヤ(
2)との摺接部に水幕状に供給されるとともに、両サイ
ドの多孔ノズ〃(4)から流出する加工液がホツパー状
のスリットノズル(16−1)を介してワイヤ部分に近
接させ自然落下を利用して水幕状釦供給されるためワイ
ヤへの砥粒付着が増加し良好な切断が行なわれる。第5
図の場合は、中央のスリットノズμα番から加工液が水
幕状VC1’!lW!部に供給されるとともに、両サイ
ドの逆T字形スリットノズル(16−2)内でワイヤ部
分く加工液が供給されるので上記と同様に良好な切断が
行なわれる。In the case of Fig. 3, from the central slit nozzle A/(141) and the slit nozzles (14-1) on both sides of the claw μ,
Crab cutting is performed in which machining liquid is supplied in a water curtain to the sliding contact portion between the member to be cut (3) and the wire (2) and the wire portion. In the case of Fig. 4, the machining fluid flows from the central slit nozzle tvllllJ to the workpiece (3) and the wire (
2) is supplied in the form of a water curtain to the sliding contact area, and the machining liquid flowing out from the porous nozzles (4) on both sides is brought close to the wire portion through the hopper-shaped slit nozzle (16-1). Since the water curtain button is supplied using natural falling, the adhesion of abrasive grains to the wire increases, resulting in good cutting. Fifth
In the case of the figure, the machining fluid flows from the central slit nozzle μα in the form of a water curtain VC1'! lW! At the same time, the machining liquid is supplied to the wire section in the inverted T-shaped slit nozzles (16-2) on both sides, so that good cutting can be performed in the same manner as described above.
従って、この発明方法によれば、被切断部材とワイヤの
摺接部および、被切断部材とワイヤの摺接部とワイヤ部
分とく均一かつ十分に加工液を供給することができ、ワ
イヤソーの切断精度ならびに切断能率を大巾に向上さぜ
ることができ、かつワイヤの摩耗軽減効果も大きく、ワ
イヤの断線事故もほとんど々くなる。Therefore, according to the method of the present invention, machining liquid can be uniformly and sufficiently supplied to the sliding contact portion between the workpiece to be cut and the wire, and the sliding contact portion between the workpiece to be cut and the wire and the wire portion, thereby improving the cutting accuracy of the wire saw. In addition, the cutting efficiency can be greatly improved, and the effect of reducing wire wear is also large, and wire breakage accidents are almost eliminated.
!!施例
この発明方法をワイヤソーに画用し、φ5“S1単結晶
を下記の条件で切断した。その結果を、同一のワイヤソ
ーで第6図に示す従来の多孔ノズルによる加工液#給方
済で切断した場合と比較して第1表に示す。! ! EXAMPLE The method of this invention was applied to a wire saw to cut a φ5"S1 single crystal under the following conditions. The results are shown below using the same wire saw with machining fluid # supplied using a conventional multi-hole nozzle as shown in FIG. Table 1 shows a comparison with the case of cutting.
切断条件
ワイヤ速度:平均100 s/i、往復走行方式用 工
液:GClooとフツデオイ〃の混合物切断枚数;ウ
ェハ150枚
癌】表
第1表より明らかなごとく、この発明方法(よ)、ワイ
ヤと被切断部材の摺接部に十分な量の加工液がまんべん
なく供給されるため切断精度、切断能率、ワイヤ摩耗量
共に大巾に向上した。Cutting conditions Wire speed: average 100 s/i, for reciprocating method Working liquid: mixture of GCloo and Futudeoy Number of wafers cut: 150 wafers] As is clear from Table 1, the method of this invention, the wire and Since a sufficient amount of machining fluid is evenly supplied to the sliding contact area of the workpiece, cutting accuracy, cutting efficiency, and wire wear amount have all been greatly improved.
第1図〜第5図はこの発明方法を賽確するための装置例
を示す概略図、第6図は従来の切断方法を示すnit#
raでめる。
1・・・・溝ローフ、2・・・・ワイヤ、3・・・・被
切断部材、5・・・・押上げ台、14.14−1.16
.16−1.16−2・・・・スリットノズル、15・
・・・流出孔。Figures 1 to 5 are schematic diagrams showing an example of an apparatus for confirming the method of this invention, and Figure 6 is a diagram showing a conventional cutting method.
I can use ra. 1... Groove loaf, 2... Wire, 3... Member to be cut, 5... Pushing stand, 14.14-1.16
.. 16-1.16-2...Slit nozzle, 15.
...Outflow hole.
Claims (1)
て切断する方法において、被切断部材に沿うスリット状
の流出孔を有するスリットノズルを用い、加工液を前記
スリットノズルより供給することを特徴とする脆性材料
の切断方法。In a method of cutting a wire by supplying machining fluid while bringing the workpiece into sliding contact with the wire, a slit nozzle having a slit-shaped outflow hole along the workpiece is used, and the machining fluid is supplied from the slit nozzle. Characteristic cutting method for brittle materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24539184A JPS61125768A (en) | 1984-11-20 | 1984-11-20 | Method of cutting off fragile material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24539184A JPS61125768A (en) | 1984-11-20 | 1984-11-20 | Method of cutting off fragile material |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29822192A Division JPH0639095B2 (en) | 1992-10-12 | 1992-10-12 | Brittle material cutting equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61125768A true JPS61125768A (en) | 1986-06-13 |
JPH0520227B2 JPH0520227B2 (en) | 1993-03-18 |
Family
ID=17132956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24539184A Granted JPS61125768A (en) | 1984-11-20 | 1984-11-20 | Method of cutting off fragile material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61125768A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989010825A1 (en) * | 1988-05-09 | 1989-11-16 | Charles Hauser | Device for improved sawing of a piece into thin slices |
US5269285A (en) * | 1991-11-29 | 1993-12-14 | Shin-Etsu Handotai Company, Ltd. | Wire saw and slicing method using the same |
JP2006305685A (en) * | 2005-04-28 | 2006-11-09 | Komatsu Electronic Metals Co Ltd | Wire saw device, guide bar for wire saw device and slurry supplying device for wire saw device |
JP2008213111A (en) * | 2007-03-06 | 2008-09-18 | Sharp Corp | Multi-wire saw and slurry supply method |
JP2009142986A (en) * | 2003-10-27 | 2009-07-02 | Mitsubishi Electric Corp | Multi-wire saw |
CN102085641A (en) * | 2010-07-22 | 2011-06-08 | 杭州精功机电研究所有限公司 | Anti-wire jumper sand-blasting device for multi-wire cutter |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279395A (en) * | 1975-12-25 | 1977-07-04 | Mitsubishi Heavy Ind Ltd | Surface polishing device of thin film sheet |
JPS57193349U (en) * | 1981-06-02 | 1982-12-08 |
-
1984
- 1984-11-20 JP JP24539184A patent/JPS61125768A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279395A (en) * | 1975-12-25 | 1977-07-04 | Mitsubishi Heavy Ind Ltd | Surface polishing device of thin film sheet |
JPS57193349U (en) * | 1981-06-02 | 1982-12-08 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989010825A1 (en) * | 1988-05-09 | 1989-11-16 | Charles Hauser | Device for improved sawing of a piece into thin slices |
US5269285A (en) * | 1991-11-29 | 1993-12-14 | Shin-Etsu Handotai Company, Ltd. | Wire saw and slicing method using the same |
JP2009142986A (en) * | 2003-10-27 | 2009-07-02 | Mitsubishi Electric Corp | Multi-wire saw |
JP2006305685A (en) * | 2005-04-28 | 2006-11-09 | Komatsu Electronic Metals Co Ltd | Wire saw device, guide bar for wire saw device and slurry supplying device for wire saw device |
JP2008213111A (en) * | 2007-03-06 | 2008-09-18 | Sharp Corp | Multi-wire saw and slurry supply method |
CN102085641A (en) * | 2010-07-22 | 2011-06-08 | 杭州精功机电研究所有限公司 | Anti-wire jumper sand-blasting device for multi-wire cutter |
Also Published As
Publication number | Publication date |
---|---|
JPH0520227B2 (en) | 1993-03-18 |
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